公开(公告)号：US20210057375A1

公开(公告)日：2021-02-25

申请号：US16991123

申请日：2020-08-12

Applicant: Infineon Technologies AG

Inventor： Wee Aun Jason Lim ,  Paul Armand Asentista Calo ,  Ting Soon Chin ,  Chooi Mei Chong ,  Sanjay Kumar Murugan ,  Ying Pok Sam ,  Chee Voon Tan

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

Abstract: A power semiconductor package includes a power semiconductor chip, an electrical connector arranged at a first side of the power semiconductor chip and having a first surface that is coupled to a power electrode of the power semiconductor chip, an encapsulation body at least partially encapsulating the power semiconductor chip and the electrical connector, and an electrical insulation layer arranged at a second surface of the electrical connector opposite the first surface, wherein parts of the encapsulation body and the electrical insulation layer form a coplanar surface of the power semiconductor package.

公开(公告)号：US20180297301A1

公开(公告)日：2018-10-18

申请号：US15944549

申请日：2018-04-03

Applicant: Infineon Technologies AG

Inventor： Jayaganasan Narayanasamy ,  Jagen Krishnan ,  Sanjay Kumar Murugan ,  Hong Lim Lee

IPC: B29C70/58 ,  B29C70/78 ,  H01L23/495 ,  H01L23/373 ,  H01L21/48

Abstract: A method for forming a matrix composite layer on a workpiece and a workpiece with a matrix composite layer are disclosed. In an embodiment the method includes forming a wall around a metallic surface such that the wall extends in a vertical direction from a plane formed by the metallic surface, and depositing a filler material in a walled area on the metallic surface. The method further includes depositing a plastic material on the filler material and performing a vacuum treatment of the filler material and the plastic material thereby forming a matrix composite layer disposed on the metallic surface.

公开(公告)号：US11211356B2

公开(公告)日：2021-12-28

申请号：US16991123

申请日：2020-08-12

Applicant: Infineon Technologies AG

Inventor： Wee Aun Jason Lim ,  Paul Armand Asentista Calo ,  Ting Soon Chin ,  Chooi Mei Chong ,  Sanjay Kumar Murugan ,  Ying Pok Sam ,  Chee Voon Tan

IPC: H01L23/495 ,  H01L23/28 ,  H01L21/00 ,  H05K7/18 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

Abstract: A power semiconductor package includes a power semiconductor chip, an electrical connector arranged at a first side of the power semiconductor chip and having a first surface that is coupled to a power electrode of the power semiconductor chip, an encapsulation body at least partially encapsulating the power semiconductor chip and the electrical connector, and an electrical insulation layer arranged at a second surface of the electrical connector opposite the first surface, wherein parts of the encapsulation body and the electrical insulation layer form a coplanar surface of the power semiconductor package.

公开(公告)号：US20210013135A1

公开(公告)日：2021-01-14

申请号：US16510448

申请日：2019-07-12

Applicant: Infineon Technologies AG

Inventor： Jayaganasan Narayanasamy ,  Meng How Chong ,  Elmer Senorin Holgado ,  Chee Ming Lam ,  Sanjay Kumar Murugan ,  Arivindran Navaretnasinggam ,  Kai Yang Tan ,  Lee Shuang Wang

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the first lead. The first groove extends longitudinally along the first lead away from the die pad.

公开(公告)号：US10457001B2

公开(公告)日：2019-10-29

申请号：US15944549

申请日：2018-04-03

Applicant: Infineon Technologies AG

Inventor： Jayaganasan Narayanasamy ,  Jagen Krishnan ,  Sanjay Kumar Murugan ,  Hong Lim Lee

IPC: B29C70/58 ,  B29C70/78 ,  H01L23/495 ,  H01L21/48 ,  H01L23/373 ,  H01L23/42 ,  H01L23/433 ,  B29L31/34 ,  B29K509/04

Abstract: A method for forming a matrix composite layer on a workpiece and a workpiece with a matrix composite layer are disclosed. In an embodiment the method includes forming a wall around a metallic surface such that the wall extends in a vertical direction from a plane formed by the metallic surface, and depositing a filler material in a walled area on the metallic surface. The method further includes depositing a plastic material on the filler material and performing a vacuum treatment of the filler material and the plastic material thereby forming a matrix composite layer disposed on the metallic surface.

公开(公告)号：US10431526B2

公开(公告)日：2019-10-01

申请号：US15727725

申请日：2017-10-09

Applicant: Infineon Technologies AG

Inventor： Kar Meng Ho ,  Chiew Li Tai ,  Jia Yi Wong ,  Sanjay Kumar Murugan

IPC: H01L23/492 ,  H01L21/48 ,  H01L23/14 ,  H01L23/047 ,  H01L23/31 ,  H01L23/367

Abstract: A metal heat slug having an upper and lower surface is provided. First and second electrically conductive leads are provided. First and second electrically insulating fastening mechanisms are provided. The first and second fastening mechanisms are adhered to the upper surface of the heat slug in an outer peripheral region of the heat slug such that the first and second leads are vertically separated from and electrically insulated from the heat slug. The central die attach region is exposed from the first and second fastening mechanisms after adhering the first and second fastening mechanisms to the upper surface of the heat slug.

公开(公告)号：US20190109070A1

公开(公告)日：2019-04-11

申请号：US15727725

申请日：2017-10-09

Applicant: Infineon Technologies AG

Inventor： Kar Meng Ho ,  Chiew Li Tai ,  Jia Yi Wong ,  Sanjay Kumar Murugan

IPC: H01L23/492 ,  H01L23/14 ,  H01L21/48

CPC classification number: H01L23/492 ,  H01L21/481 ,  H01L21/4814 ,  H01L23/047 ,  H01L23/14 ,  H01L23/315 ,  H01L23/367 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/49111 ,  H01L2924/00014

Abstract: A metal heat slug having an upper and lower surface is provided. First and second electrically conductive leads are provided. First and second electrically insulating fastening mechanisms are provided. The first and second fastening mechanisms are adhered to the upper surface of the heat slug in an outer peripheral region of the heat slug such that the first and second leads are vertically separated from and electrically insulated from the heat slug. The central die attach region is exposed from the first and second fastening mechanisms after adhering the first and second fastening mechanisms to the upper surface of the heat slug.

公开(公告)号：US20160365296A1

公开(公告)日：2016-12-15

申请号：US15176952

申请日：2016-06-08

Applicant: Infineon Technologies AG

Inventor： Ralf Otremba ,  Edward Fuergut ,  Christian Kasztelan ,  Hsieh Ting Kuek ,  Teck Sim Lee ,  Sanjay Kumar Murugan ,  Lee Shuang Wang

IPC: H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L23/495 ,  H01L23/29

CPC classification number: H01L23/3114 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49568 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A device includes an encapsulation material and a first lead and a second lead protruding out of a surface of the encapsulation material. A recess extends into the surface of the encapsulation material. An elevation is arranged on the surface of the encapsulation material. The first lead protrudes out of the elevation.

Abstract translation: 一种装置包括封装材料和从包封材料的表面突出的第一引线和第二引线。 凹部延伸到封装材料的表面。 在封装材料的表面上布置有高度。 第一个引线突出了海拔高度。