公开(公告)号：US09604210B2

公开(公告)日：2017-03-28

申请号：US14683826

申请日：2015-04-10

Applicant: Intel Corporation

Inventor： Lakshmi Supriya ,  James C. Matayabas, Jr. ,  Nirupama Chakrapani

IPC: B01L3/00 ,  B05D3/12 ,  B05D5/00 ,  B29C65/00 ,  B01J19/00

CPC classification number: B01L3/502707 ,  B01J2219/00527 ,  B01J2219/00605 ,  B01J2219/00619 ,  B01L3/502715 ,  B01L2200/025 ,  B01L2200/027 ,  B01L2200/0605 ,  B01L2200/10 ,  B01L2300/046 ,  B01L2300/0627 ,  B01L2300/0816 ,  B01L2300/0819 ,  B01L2300/0822 ,  B01L2300/0867 ,  B01L2300/089 ,  B01L2300/16 ,  B01L2300/161 ,  B01L2300/165 ,  B01L2400/0406 ,  B01L2400/0688 ,  B05D3/12 ,  B05D5/00

Abstract: A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel the flow of liquids to the die for biological sensor type applications. The defined paths may comprise a wetting coating that has an affinity to fluids. Similarity, the defined paths may comprise a dewetting coating the tend to repel fluid surrounding the paths.

公开(公告)号：US20200273811A1

公开(公告)日：2020-08-27

申请号：US16287665

申请日：2019-02-27

Applicant: Intel Corporation

Inventor： Debendra Mallik ,  Mitul Modi ,  Sanka Ganesan ,  Edvin Cetegen ,  Omkar Karhade ,  Ravindranath Mahajan ,  James C. Matayabas, Jr. ,  Jan Krajniak ,  Kumar Singh ,  Aastha Uppal

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/29 ,  H01L23/34 ,  H01L23/00 ,  H01L21/56 ,  H01L23/532

Abstract: IC package including a material preform comprising graphite. The material preform may have a thermal conductivity higher than that of other materials in the package and may therefore mitigate the formation of hot spots within an IC die during device operation. The preform may have high electrical conductivity suitable for EMI shielding. The preform may comprise a graphite sheet that can be adhered to a package assembly with an electrically conductive adhesive, applied, for example over an IC die surface and a surrounding package dielectric material. Electrical interconnects of the package may be coupled to the graphite sheet as an EMI shield. The package preform may be grounded to a reference potential through electrical interconnects of the package, which may be further coupled to a system-level ground plane. System-level thermal solutions may interface with the package-level graphite sheet.

公开(公告)号：US09941652B2

公开(公告)日：2018-04-10

申请号：US14973543

申请日：2015-12-17

Applicant: INTEL CORPORATION

Inventor： Nachiket R. Raravikar ,  James C. Matayabas, Jr. ,  Akshay Mathkar ,  Dingying Xu

IPC: G01R31/28 ,  H01R43/20 ,  G01R1/073

CPC classification number: H01R43/20 ,  G01R1/07378

Abstract: Space transformer including a substrate and a perforated plate disposed on the substrate. The substrate includes conductive traces and an array of conductive probe pins extend outwardly from anchor points on the substrate. The pins are electrically coupled to at least one of the conductive traces on the substrate as an interface between an E-testing apparatus and a DUT. The perforated plate may be affixed to a surface of the substrate and includes an array of perforations through which the conductive pins may pass. The perforated plate may provide one or more of lateral pin support and protection to the underlying substrate and/or traces. The perforated plate may include a metal sheet. A polymeric material may be disposed on at least a sidewall of the perforations to electrically isolate the metal sheet from the conductive probe pins.

公开(公告)号：US09640415B2

公开(公告)日：2017-05-02

申请号：US14556994

申请日：2014-12-01

Applicant: Intel Corporation

Inventor： Randall D Lowe, Jr. ,  Suriyakala Suriya Ramalingam ,  Nisha Ananthakrishnan ,  James C. Matayabas, Jr. ,  Arjun Krishnan ,  Hitesh Arora

IPC: H01L21/56 ,  H01L23/29 ,  H01L23/544 ,  C09D11/101 ,  C09D11/20

CPC classification number: H01L21/56 ,  C09D11/101 ,  C09D11/20 ,  H01L23/296 ,  H01L23/544 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods for covalently and indelibly anchoring a polyacrylate polymer using a UV-induced polymerization process in the presence of a photoinitiator to an oxide surface are disclosed herein. The methods and compositions prepared by the methods can be used as indelible marking materials for use on microelectronic packages and as solder and sealant barriers to prevent overspreading of liquids on the oxide surfaces of microelectronic packages. The polyacrylate polymers are covalently linked to the oxide surface by use during the printing and UV-curing process of an adhesion promoter having as a first domain an oxide-reactive silyl group, bonded via a linker to an acrylate-reactive group.

公开(公告)号：US08900919B2

公开(公告)日：2014-12-02

申请号：US13801059

申请日：2013-03-13

Applicant: Intel Corporation

Inventor： Randall D. Lowe, Jr. ,  Suriyakala Suriya Ramalingam ,  Nisha Ananthakrishnan ,  James C. Matayabas, Jr. ,  Arjun Krishnan ,  Hitesh Arora

IPC: H01L21/44 ,  H01L23/02 ,  H01L23/28 ,  C09D11/107

CPC classification number: H01L21/56 ,  C09D11/101 ,  C09D11/20 ,  H01L23/296 ,  H01L23/544 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods for covalently and indelibly anchoring a polyacrylate polymer using a UV-induced polymerization process in the presence of a photoinitiator to an oxide surface are disclosed herein. The methods and compositions prepared by the methods can be used as indelible marking materials for use on microelectronic packages and as solder and sealant barriers to prevent overspreading of liquids on the oxide surfaces of microelectronic packages. The polyacrylate polymers are covalently linked to the oxide surface by use during the printing and UV-curing process of an adhesion promoter having as a first domain an oxide-reactive silyl group, bonded via a linker to an acrylate-reactive group.

Abstract translation: 本文公开了在光引发剂存在下使用UV诱导的聚合方法将聚丙烯酸酯聚合物共价且不可分割地锚定到氧化物表面的方法。 通过该方法制备的方法和组合物可用作用于微电子封装的不可擦除的标记材料，以及用作焊料和密封剂屏障以防止液体在微电子封装的氧化物表面上的过度扩散。 在通过连接剂与丙烯酸酯反应性基团键合的作为第一结构域的氧化物反应性甲硅烷基的粘合促进剂的印刷和UV固化过程中，聚丙烯酸酯聚合物共价连接到氧化物表面。

公开(公告)号：US10580717B2

公开(公告)日：2020-03-03

申请号：US15774990

申请日：2016-01-11

Applicant: Intel Corporation

Inventor： Boxi Liu ,  Hemanth K. Dhavaleswarapu ,  Syadwad Jain ,  James C. Matayabas, Jr.

IPC: H01L23/373 ,  H01L23/367 ,  H01L25/065 ,  H01L25/18 ,  H01L23/42 ,  H01L23/00 ,  H01L23/48 ,  H01L21/48 ,  H01L23/498 ,  H01L23/15 ,  H01L23/538

Abstract: A multiple chip package is described with multiple thermal interface materials. In one example, a package has a substrate, a first semiconductor die coupled to the substrate, a second semiconductor die coupled to the substrate, a heat spreader coupled to the die, wherein the first die has a first distance to the heat spreader and the second die has a second distance to the heat spreader, a first filled thermal interface material (TIM) between the first die and the heat spreader to mechanically and thermally couple the heat spreader to the die, and a second filled TIM between the second die and the heat spreader to mechanically and thermally couple the heat spreader to the second die.

公开(公告)号：US09070660B2

公开(公告)日：2015-06-30

申请号：US13844243

申请日：2013-03-15

Applicant: INTEL CORPORATION

Inventor： Randall Lowe, Jr. ,  Syadwad Jain ,  James C. Matayabas, Jr.

IPC: H01L23/373 ,  C08L83/04 ,  H01L23/367 ,  H01L23/42 ,  B32B5/16 ,  C08K3/22 ,  C08K3/08 ,  C08K3/28

CPC classification number: H01L23/3737 ,  B32B5/16 ,  C08K2003/0806 ,  C08K2003/0812 ,  C08K2003/085 ,  C08K2003/2227 ,  C08K2003/2296 ,  C08K2003/282 ,  C08L83/04 ,  C09C3/12 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  C08K3/28 ,  C08K3/10

Abstract: A polymer thermal interface material is described that has enhanced thermal conductivity. In one example, a vinyl-terminated silicone oil is combined with a silicone chain extender, and a thermally conductive filler comprising at least 85% by weight of the material, and comprising surface wetted particles with a range of shapes and sizes. The material may be used for bonding components inside a microelectronic package, for example.

Abstract translation: 描述了具有增强的导热性的聚合物热界面材料。 在一个实例中，将乙烯基封端的硅油与硅氧烷扩链剂和包含至少85重量％的材料的导热填料组合，并且包含具有一定形状和尺寸的表面润湿颗粒。 该材料可以用于例如将微电子封装内部的部件粘接。