公开(公告)号：US20170084539A1

公开(公告)日：2017-03-23

申请号：US15364534

申请日：2016-11-30

Applicant: Invensas Corporation

Inventor： Guilian GAO ,  Cyprian Emeka UZOH ,  Charles G. WOYCHIK ,  Hong SHEN ,  Arkalgud R. SITARAM ,  Liang WANG ,  Akash AGRAWAL ,  Rajesh KATKAR

IPC: H01L23/538 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L23/5385 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/147 ,  H01L23/15 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/08225 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32105 ,  H01L2224/32106 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48105 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49097 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Die (110) and/or undiced wafers and/or multichip modules (MCMs) are attached on top of an interposer (120) or some other structure (e.g. another integrated circuit) and are covered by an encapsulant (160). Then the interposer is thinned from below. Before encapsulation, a layer (410) more rigid than the encapsulant is formed on the interposer around the die to reduce or eliminate interposer dishing between the die when the interposer is thinned by a mechanical process (e.g. CMP). Other features are also provided.

公开(公告)号：US20170018510A1

公开(公告)日：2017-01-19

申请号：US15280175

申请日：2016-09-29

Applicant: Invensas Corporation

Inventor： Hong SHEN ,  Liang WANG ,  Rajesh KATKAR ,  Charles G. WOYCHIK ,  Guilian GAO

IPC: H01L23/00 ,  H01L23/053 ,  H01L23/498 ,  H01L23/31 ,  H01L25/065 ,  H01L21/48

CPC classification number: H01L23/562 ,  H01L21/481 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/561 ,  H01L23/053 ,  H01L23/145 ,  H01L23/147 ,  H01L23/15 ,  H01L23/295 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92225 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/16153 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/16315 ,  H01L2924/1632 ,  H01L2924/167 ,  H01L2924/16787 ,  H01L2924/16788 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/01029 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Die (110) are attached to an interposer (420), and the interposer/die assembly is placed into a lid cavity (510). The lid (210) is attached to the top of the assembly, possibly to the encapsulant (474) at the top. The lid's legs (520) surround the cavity and extend down below the top surface of the interposer's substrate (420S), possibly to the level of the bottom surface of the substrate or lower. The legs (520) may or may not be attached to the interposer/die assembly. In fabrication, the interposer wafer (420SW) has trenches (478) which receive the lid's legs during the lid placement. The interposer wafer is later thinned to remove the interposer wafer portion below the legs and to dice the interposer wafer. The thinning process also exposes, on the bottom, conductive vias (450) passing through the interposer substrate. Other features are also provided.

Abstract translation: 模具（110）附接到插入件（420），并且插入器/模具组件被放置在盖腔（510）中。 盖（210）附接到组件的顶部，可能附接到顶部的密封剂（474）。 盖的腿（520）围绕空腔并且向下延伸到插入器的衬底（420S）的顶表面下方，可能地到衬底的底表面的高度或更低。 腿（520）可以或可以不附接到插入件/模具组件。 在制造中，插入器晶片（420SW）具有在盖放置期间接收盖的腿的沟槽（478）。 中间层晶片稍后变薄以去除腿下方的插入片晶片部分并且切割插入片晶片。 薄化工艺还在底部暴露穿过内插衬底的导电通孔（450）。 还提供其他功能。

公开(公告)号：US20160042978A1

公开(公告)日：2016-02-11

申请号：US14453413

申请日：2014-08-06

Applicant: Invensas Corporation

Inventor： Liang WANG ,  Rajesh KATKAR ,  Charles G. WOYCHIK ,  Cyprian Emeka UZOH

IPC: H01L21/56 ,  H01L23/31 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L23/3178 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/54 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06593 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/014

Abstract: A device and method for localizing underfill includes a substrate, a plurality of dies, and underfill material. The substrate includes a plurality of contacts and a plurality of cavities separated by a plurality of mesas. The plurality of dies is mounted to the substrate using the plurality of contacts. The underfill material is located between the substrate and the dies. The underfill material is localized into a plurality of regions using the mesas. Each of the contacts is located in a respective one of the cavities. In some embodiments, the substrate further includes a plurality of channels interconnecting the cavities. In some embodiments, the substrate further includes a plurality of intra-cavity mesas for further localizing the underfill material. In some embodiments, outer edges of a first one of the dies rest on first mesas located on edges of a first one of the cavities.

公开(公告)号：US20150270209A1

公开(公告)日：2015-09-24

申请号：US14220912

申请日：2014-03-20

Applicant: Invensas Corporation

Inventor： Charles G. WOYCHIK ,  Cyprian Emeka UZOH ,  Ron ZHANG ,  Daniel BUCKMINSTER ,  Guilian GAO

IPC: H01L23/498 ,  H01L23/48 ,  H01L21/52 ,  H01L21/78 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/304 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/52 ,  H01L21/565 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: An apparatus relates generally to an integrated circuit package. In such an apparatus, a package substrate has a first plurality of via structures extending from a lower surface of the package substrate to an upper surface of the package substrate. An die has a second plurality of via structures extending to a lower surface of the die. The lower surface of the die faces the upper surface of the package substrate in the integrated circuit package. The package substrate does not include a redistribution layer. The die and the package substrate are coupled to one another.

Abstract translation: 装置一般涉及集成电路封装。 在这种装置中，封装衬底具有从封装衬底的下表面延伸到封装衬底的上表面的第一多个通孔结构。 模具具有延伸到模具的下表面的第二多个通孔结构。 模具的下表面在集成电路封装中面向封装衬底的上表面。 封装基板不包括再分布层。 管芯和封装衬底彼此耦合。