Abstract:
An image pickup device includes an active pixel sensor (APS), a row driver, and a leakage current breaker. The active pixel sensor includes an array of a plurality of pixels. The row driver selects at least one pixel to be activated to output signals. The leakage current breaker decreases the leakage current through the unselected pixels by applying a leakage current breaker voltage at the bit lines of the APS array.
Abstract:
Example embodiments relate to a semiconductor device and a method of manufacturing the same. A semiconductor device according to example embodiments may have reduced disturbances during reading operations and a reduced short channel effect. The semiconductor device may include a semiconductor substrate having a body and a pair of fins protruding from the body. Inner spacer insulating layers may be formed on an upper portion of an inner sidewall of the pair of fins so as to reduce the entrance to the region between the pair of fins. A gate electrode may cover a portion of the external sidewalls of the pair of fins and may extend across the inner spacer insulating layers so as to define a void between the pair of fins. Gate insulating layers may be interposed between the gate electrode and the pair of fins.
Abstract:
A non-volatile memory device may include a substrate having a field region and an active region including a rounded upper edge portion and a flat upper central portion, an effective tunnel oxide layer on the flat upper central portion of the active region, a split floating gate electrode on the effective tunnel oxide layer, the floating gate electrode having a width greater than a width of the effective tunnel oxide layer, a dielectric layer pattern on the floating gate electrode, the dielectric layer pattern including metal oxide, and a control gate electrode on the dielectric layer pattern.
Abstract:
A method of manufacturing a package substrate includes forming a first copper plated layer on a base substrate having through holes and inner surfaces of the through hole, coating a first resist over the first copper plated layer, partially removing the first resist, forming a second copper plated layer on the first copper plated layer, stripping the first resist, coating a second resist over the resultant structure, and removing the second resist from regions where wire bonding pads and solder ball pads are to be formed, removing exposed portions of the first copper plated layer, forming the wire bonding pads and the solder ball pads, removing the second resist, removing exposed portions of the first copper plated layer, and coating a solder resist over all surfaces of the resultant structure, and removing portions of the solder resist respectively covering the wire bonding pads and the solder ball pads.
Abstract:
Provided are a capsule-type image photographing apparatus and endoscopy using the same. The apparatus includes a shell unit having a globular shape and a main body unit capable of freely rotating in the shell unit. The main body unit includes an image photographing system, a wireless transmitter, a battery, a counterweight for determining the center of gravity of the main body unit, and an encapsulant for fixing the image photographing system, the wireless transmitter, the battery, and the counterweight. The apparatus may be a long-distance capsule-type image photographing apparatus or a short-distance capsule-type image photographing apparatus depending on the position of the counterweight. By use of the long- and short-distance capsule-type image photographing apparatuses, the interior of the tested person's body can be effectively photographed.
Abstract:
An electronic component embedded printed circuit board and a method for manufacturing the same are disclosed. The method includes: providing a first carrier having a first circuit pattern formed on one surface thereof; providing a second carrier having a second circuit pattern formed on one surface thereof; flip-chip bonding an electronic component to the first circuit pattern; stacking one side of an insulator on one side of the first carrier to cover the electronic component; compressing the second carrier having the second circuit pattern formed on one surface thereof on an other side of the insulator; and removing the first carrier and the second carrier. The method can improve the degree of conformation for an electrical component by embedding the electrical component using a flip-chip bonding method and can improve the yield by simplifying the production process.
Abstract:
An electronic component embedded printed circuit board and a method for manufacturing the same are disclosed. The method includes: providing a first carrier having a first circuit pattern formed on one surface thereof; providing a second carrier having a second circuit pattern formed on one surface thereof; flip-chip bonding an electronic component to the first circuit pattern; stacking one side of an insulator on one side of the first carrier to cover the electronic component; compressing the second carrier having the second circuit pattern formed on one surface thereof on an other side of the insulator; and removing the first carrier and the second carrier. The method can improve the degree of conformation for an electrical component by embedding the electrical component using a flip-chip bonding method and can improve the yield by simplifying the production process.
Abstract:
A printed circuit board, a component package that includes the printed circuit board, and a method of manufacturing the component package are disclosed. The printed circuit board, which may include an insulation layer, a pad formed over the insulation layer and wire-bonded to a component, and a tin (Sn) alloy layer formed over the pad, can be manufactured with lower costs and a simpler manufacturing process, where the adhesion provided by the wire-bonding can also be increased.
Abstract:
For color correction in an image sensor, an image sensor processing block generates a plurality of color correction parameters corresponding to a plurality of selected pixels of the image sensor for defining a plurality of areas of a sample image. In addition, a color correction value calculation block generates a respective color correction value corresponding to a given pixel from bilinear interpolation of a respective subset of the color correction parameters corresponding to a respective one of the areas including a respective location of the given pixel.
Abstract:
A printed circuit board, a component package that includes the printed circuit board, and a method of manufacturing the component package are disclosed. The printed circuit board, which may include an insulation layer, a pad formed over the insulation layer and wire-bonded to a component, and a tin (Sn) alloy layer formed over the pad, can be manufactured with lower costs and a simpler manufacturing process, where the adhesion provided by the wire-bonding can also be increased.