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    PACKAGE FOR ELECTRON ELEMENT AND ELECTRONIC COMPONENT
    12.
    发明申请
    PACKAGE FOR ELECTRON ELEMENT AND ELECTRONIC COMPONENT 审中-公开
    电子元件和电子元件包装

    公开(公告)号：US20100181105A1

    公开(公告)日：2010-07-22

    申请号：US12690223

    申请日：2010-01-20

    申请人： Takuma Hitomi ,  Masanori Hongo ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

    发明人： Takuma Hitomi ,  Masanori Hongo ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

    IPC分类号： H05K1/11

    CPC分类号： H05K1/0206 ,  H01L21/481 ,  H01L23/053 ,  H01L23/15 ,  H01L23/3677 ,  H01L33/483 ,  H01L33/641 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4061 ,  H05K3/4629 ,  H05K2201/09709 ,  H05K2201/10106 ,  H01L2924/00

    摘要： A package for an electron element comprises: a base substrate made of ceramic; a frame body made of ceramic arranged on a top surface of the base substrate and provided therein with a cavity for accommodating the electron element; a via formed in the base substrate below the cavity, penetrating the base substrate from the top surface to a bottom surface thereof and filled with a thermally-conductive material; and a projecting part formed on an inner wall of the via and projecting toward a center of the via. The projecting part has a length along a direction perpendicular to a penetration direction of the via not less than a thickness along the penetration direction. An electronic component comprises the package and the electron element mounted thereon. The electron element is accommodated in the cavity defined inside the frame body of the package and arranged above the via.

    摘要翻译： 一种用于电子元件的封装包括：由陶瓷制成的基底; 布置在所述基底基板的顶表面上的由陶瓷制成的框体，并在其中设置有用于容纳所述电子元件的空腔; 通孔，其形成在所述空腔下方的所述基底基板中，从所述基底基板从所述顶表面向其底表面穿透并填充有导热材料; 以及形成在所述通孔的内壁上并朝向所述通孔的中心突出的突出部。 突出部具有沿与贯通方向的贯通方向垂直的方向的长度不小于沿着贯通方向的厚度。 电子部件包括安装在其上的封装和电子元件。 电子元件容纳在限定在封装的框体内部的空腔中，并布置在通孔的上方。

    Process for assembling piping or components by TIG welding
    14.
    发明授权
    Process for assembling piping or components by TIG welding 失效
    通过TIG焊接组装管道或部件的工艺

    公开(公告)号：US5396039A

    公开(公告)日：1995-03-07

    申请号：US156817

    申请日：1993-11-24

    申请人： Henri Chevrel ,  Taeko Hattori ,  Hideki Takagi ,  Eiichi Ozawa ,  Jean-Marie Friedt

    发明人： Henri Chevrel ,  Taeko Hattori ,  Hideki Takagi ,  Eiichi Ozawa ,  Jean-Marie Friedt

    IPC分类号： B23K9/16 ,  B23K9/028 ,  B23K9/167 ,  B23K9/23 ,  B23K9/00

    CPC分类号： B23K9/0286

    摘要： A process to avoid or limit corrosion at the junction of two piping comprising devices welded together, said piping comprising devices being adapted to flow corrosive gases through them, said process comprising the steps of:a) providing a first piping comprising device and connecting it to an inert gas source;b) purging it with an inert gas comprising substantially not more than 10 ppb of an oxidizing gas selected from the group consisting of oxygen, carbon dioxide, water vapor or mixtures thereof, said inert gas flowing from a first opening to a second opening of said piping comprising device;c) providing a second pipe comprising device in flow communication with the first one, while continuing to purge the first piping comprising device;d) welding the two piping comprising devices, said welding being carried out under an inert gas atmosphere; ande) repeating steps c and d if necessary.

    摘要翻译： 一种避免或限制在包括焊接在一起的装置的两个管道的接合处的腐蚀的过程，所述管道包括适于使腐蚀性气体通过它们的装置，所述方法包括以下步骤：a）提供包括装置的第一管道并将其连接到 惰性气源; b）用惰性气体吹扫，所述惰性气体基本上不超过10ppb的选自氧，二氧化碳，水蒸气或其混合物的氧化气体，所述惰性气体从第一开口流到所述 管道包括装置; c）提供包括与第一管流动连通的装置的第二管道，同时继续吹扫包括第一管道装置的第一管道; d）焊接包括装置的两个管道，所述焊接在惰性气体气氛下进行; 和e）如果需要，重复步骤c和d。

    Method and manufacturing surface acoustic wave device
    16.
    发明授权
    Method and manufacturing surface acoustic wave device 有权
    表面声波装置的制造方法

    公开(公告)号：US07331092B2

    公开(公告)日：2008-02-19

    申请号：US10806148

    申请日：2004-03-23

    申请人： Michio Miura ,  Takashi Matsuda ,  Yoshio Satoh ,  Masanori Ueda ,  Hideki Takagi

    发明人： Michio Miura ,  Takashi Matsuda ,  Yoshio Satoh ,  Masanori Ueda ,  Hideki Takagi

    IPC分类号： H04R17/10

    CPC分类号： H03H3/08 ,  H03H9/02574 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49007 ,  Y10T29/49016 ,  Y10T29/49126

    摘要： A method of manufacturing a surface acoustic device that has a surface acoustic wave filter including comb-like electrodes, electrode pads, and wiring patterns formed on a joined substrate produced by joining a piezoelectric substrate and a supporting substrate to each other. This method includes the steps of: activating at least one of the joining surfaces of the piezoelectric substrate and the supporting substrate; and joining the piezoelectric substrate and the supporting substrate in such a manner that the activated joining surfaces face each other.

    摘要翻译： 一种表面声学装置的制造方法，其具有包括梳状电极，电极焊盘和布线图案的表面声波滤波器，所述梳状电极，电极焊盘和布线图案形成在通过将压电基板和支撑基板彼此接合而制成的接合基板上。 该方法包括以下步骤：激活压电衬底和支撑衬底的至少一个接合表面; 以及使活化的接合面彼此面对的方式接合压电基板和支撑基板。

    Method of molding glass parts and molding apparatus
    20.
    发明授权
    Method of molding glass parts and molding apparatus 有权
    玻璃部件和成型设备的成型方法

    公开(公告)号：US08099982B2

    公开(公告)日：2012-01-24

    申请号：US12531815

    申请日：2008-03-26

    申请人： Hideki Takagi ,  Masaharu Takahashi ,  Ryutaro Maeda ,  Shinichi Miyazawa

    发明人： Hideki Takagi ,  Masaharu Takahashi ,  Ryutaro Maeda ,  Shinichi Miyazawa

    IPC分类号： C03B11/00 ,  B29D11/00

    CPC分类号： C03B11/082 ,  C03B2215/07 ,  C03B2215/10 ,  C03B2215/17 ,  C03C23/008 ,  Y02P40/57 ,  Y10T428/265

    摘要： A molding apparatus of a glass material according to the present invention is characterized by containing means for holding a glass material and a molding die in contact with each other, means for heating the glass material and the molding die, and means for applying a voltage across the glass material and the molding die, in which press-molding is performed by electrostatic attraction acting between a surface of the glass material and a surface of the molding die. Further, a molded product of a glass material according to the present invention is characterized by including an alkali metal as a component, in which a concentration of the alkali metal is lowered in vicinity of a surface to be molded as compared with that of a glass base material.

    摘要翻译： 根据本发明的玻璃材料的成型装置的特征在于包含用于保持彼此接触的玻璃材料和模制模具的装置，用于加热玻璃材料和模制模具的装置，以及用于施加电压的装置 玻璃材料和成型模具，其中通过在玻璃材料的表面和成型模具的表面之间进行静电吸引来进行加压成型。 此外，根据本发明的玻璃材料的成型体的特征在于，与玻璃相比，含有碱金属作为成分的成分，其中碱金属的浓度在待模制的表面附近降低 基材。