公开(公告)号：US07344906B2

公开(公告)日：2008-03-18

申请号：US11300872

申请日：2005-12-15

申请人： Christopher L. Chua ,  David K. Fork ,  Koenraed F. Van Schuylenbergh

发明人： Christopher L. Chua ,  David K. Fork ,  Koenraed F. Van Schuylenbergh

IPC分类号： H01L21/00

CPC分类号： B81C1/0015 ,  Y10T428/24942

摘要： A method and structure for forming a spring structure that avoids undesirable kinks in the spring is described. The method converts a portion of a release layer such that the converted portion resists etching. The converted portion then serves as an anchor region for a spring structure deposited over the release layer. When the non-converted portions of the release layer are etched, the spring curls out of the plane of a plane.

摘要翻译： 描述了形成弹簧结构的方法和结构，其避免了弹簧中不希望的扭结。 该方法将释放层的一部分转换成转换部分抵抗蚀刻。 转换的部分然后用作沉积在释放层上的弹簧结构的锚定区域。 当剥离层的未转化部分被蚀刻时，弹簧卷曲在平面的平面之外。

公开(公告)号：US07284324B2

公开(公告)日：2007-10-23

申请号：US11197675

申请日：2005-08-04

申请人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

发明人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC分类号： H01R43/16

CPC分类号： H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

摘要翻译： 可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。 光刻图案的线圈结构包括具有固有应力分布的弹性构件。 固有的应力分布使形成环绕的基板远离基板偏移。 锚固部分​​保持固定到基底上。 自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。 一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

公开(公告)号：US06439898B2

公开(公告)日：2002-08-27

申请号：US09794101

申请日：2001-02-28

申请人： Christopher L. Chua ,  David K. Fork ,  Patrick G. Kim ,  Linda Romano

发明人： Christopher L. Chua ,  David K. Fork ,  Patrick G. Kim ,  Linda Romano

IPC分类号： H05K100

CPC分类号： H05K3/325 ,  H01L21/563 ,  H01L24/10 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/73203 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01R4/04 ,  H01R12/52 ,  H01L2924/00

摘要： A method and apparatus for interconnecting at least two devices. Each of the interconnected devices includes a contact structure for electrically and/or physically interconnecting the devices. Preferably, the contact structure for at least one of the devices includes a spring contact. An adhesive, such as a UV-curable adhesive, is applied to at least a portion of one of the devices, and once the adhesive is applied, the devices are assembled, i.e., brought into sufficient proximity so that the contact structures interconnect the devices. The adhesive can be applied directly to contact structures of one of the devices and/or can be applied to other portions of the devices so that the adhesive flows around the contact structures during assembly. The adhesive is then cured to bond the devices together. Applying the adhesive before assembling the devices prevents interference with the interconnection between the contact structures, especially if the contact structures include spring contacts to be electrically connected with corresponding contact pads.

摘要翻译： 一种用于互连至少两个装置的方法和装置。 互连设备中的每一个包括用于电和/或物理互连设备的接触结构。 优选地，用于至少一个装置的接触结构包括弹簧接触件。 将诸如UV可固化粘合剂的粘合剂施加到装置中的一个的至少一部分，并且一旦施加了粘合剂，则将这些装置组装，即使其具有足够的接近性，使得接触结构将装置 。 粘合剂可以直接施加到装置中的一个的接触结构和/或可以施加到装置的其它部分，使得粘合剂在组装期间围绕接触结构流动。 然后固化粘合剂以将装置粘合在一起。 在组装设备之前应用粘合剂可以防止接触结构之间的互连干扰，特别是如果接触结构包括与相应接触垫电连接的弹簧触点。

公开(公告)号：US07293996B2

公开(公告)日：2007-11-13

申请号：US11463283

申请日：2006-08-08

申请人： Koenraad F. Van Schuylenbergh ,  Christopher L. Chua ,  David K. Fork

发明人： Koenraad F. Van Schuylenbergh ,  Christopher L. Chua ,  David K. Fork

IPC分类号： H01R12/00

CPC分类号： H01L24/72 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06761 ,  G01R1/06772 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P3/081 ,  H01P3/085 ,  H01R12/718 ,  H01R13/24 ,  H01R13/6461 ,  H01R13/6477 ,  H05K1/0218 ,  H05K3/4092

摘要： A curved transmission-line spring structure formed by self-bending materials (e.g., stress-engineered materials, intermetallic compounds and/or bimorphs) that are layered to form a stripline or microstrip transmission line. A dielectric layer is sandwiched between two conductive layers, which form the signal and ground lines of the structure. The various layers are etched to form an elongated spring structure, and then one end of the spring structure is released from the underlying substrate, causing the tip of the released end to bend away from the substrate for contact with a second device. One or both of the conductive layers is fabricated using self-bending spring metals to facilitate the bending process, and plated metal is utilized for conductivity. Alternatively, or in addition, the dielectric layer is formed using a stress-engineered dielectric material. Two-tip and three-tip structures are used to facilitate connection of both the ground and signal lines.

摘要翻译： 通过层叠以形成带状线或微带传输线的自弯曲材料（例如，应力工程材料，金属间化合物和/或双压电晶片）形成的弯曲传输线弹簧结构。 介电层夹在两个导电层之间，形成结构的信号和接地线。 蚀刻各种层以形成细长的弹簧结构，然后弹簧结构的一端从下面的基底释放，使得释放端的尖端远离基板弯曲以与第二装置接触。 使用自弯曲弹簧金属制造一个或两个导电层以促进弯曲过程，并且将电镀金属用于导电性。 或者或另外，使用应力工程介电材料形成电介质层。 两端和三端结构用于促进接地和信号线的连接。

公开(公告)号：US07015584B2

公开(公告)日：2006-03-21

申请号：US10615653

申请日：2003-07-08

申请人： Eugene M. Chow ,  David K. Fork ,  Thomas Hantschel ,  Koenraad F. Van Schuylenbergh ,  Christopher L. Chua

发明人： Eugene M. Chow ,  David K. Fork ,  Thomas Hantschel ,  Koenraad F. Van Schuylenbergh ,  Christopher L. Chua

IPC分类号： H01L23/48

CPC分类号： F16F1/027

摘要： Lithographically defined and etched spring structures are produced by various methods such that they avoid the formation of a plated metal wedge on an underside of the spring structure after release. A post is utilized to offset the spring from an underlying substrate by a distance greater than the thickness of the plated metal. A trench is etched into the substrate below the spring to provide clearance during deflection of the spring. Another spring includes a knee (bend) that provides the necessary clearance during deflection. A plating process is limited to the upper side of another spring. A released spring is used as a shadow mask for patterning resist that prevents wedge formation during plating. Various tip arrangements are disclosed that can be utilized with each spring structure

摘要翻译： 通过各种方法制造光刻定义和蚀刻的弹簧结构，使得它们在释放之后避免在弹簧结构的下侧上形成电镀金属楔。 使用柱子将弹簧从下面的衬底偏移大于电镀金属的厚度的距离。 在弹簧下方的衬底中蚀刻沟槽，以在弹簧偏转期间提供间隙。 另一个弹簧包括在偏转期间提供必要的间隙的膝盖（弯头）。 电镀工艺限于另一弹簧的上侧。 释放的弹簧用作用于图案化抗蚀剂的荫罩，其防止电镀期间的楔形成。 公开了可以与每个弹簧结构一起使用的各种尖端装置

公开(公告)号：US06794725B2

公开(公告)日：2004-09-21

申请号：US09469122

申请日：1999-12-21

申请人： Francesco Lemmi ,  Christopher L. Chua ,  Ping Mei ,  JengPing Lu ,  David K. Fork ,  Harry J. McIntyre

发明人： Francesco Lemmi ,  Christopher L. Chua ,  Ping Mei ,  JengPing Lu ,  David K. Fork ,  Harry J. McIntyre

IPC分类号： H01L3100

CPC分类号： H01L31/1055 ,  B41J2/45 ,  H01L25/0753 ,  H01L31/1016 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01S5/02 ,  H01S5/0262 ,  H01S5/4025 ,  H01L2924/00

摘要： A hybrid structure or device is provided wherein carried on a single substrate is at least one micro-spring interconnect having an elastic material that is initially fixed to a surface of the substrate, an anchor portion which is fixed to the substrate surface and a free portion. The spring contact is self-assembling in that as the free portion is released it moves out of the plane of the substrate. Also integrated on the substrate is a sensor having an active layer and contacts. The substrate and sensor may be formed of materials which are somewhat partially transparent to light at certain infrared wavelengths. The integrated sensor/spring contact configuration may be used in an imaging system to sense output from a light source which is used for image formation. The light source may be a laser array, LED array or other appropriate light source. The sensor is appropriately sized to sense all or some part of light from the light source. The sensor may also be sufficiently transparent so that light is not blocked from its emission path, with a contrast ratio such that it only absorbs a small fraction of light passing therethrough. An additional characteristic is that the manufacturing process is compatible with the manufacturing process for the micro-spring interconnects. Data from the sensor is used as light source correction information. This information is provided to a calibration configuration which allows for calibration of high-speed systems.

摘要翻译： 提供了一种混合结构或装置，其中承载在单个基板上的是具有弹性材料的至少一个微弹簧互连，弹性材料最初固定到基板的表面，固定到基板表面的锚定部分和自由部分 。 弹簧接触件是自组装的，因为随着自由部分的释放，它移出基板的平面。 还集成在基板上的是具有有源层和触点的传感器。 衬底和传感器可以由对某些红外波长的光稍微部分透明的材料形成。 集成的传感器/弹簧接触配置可用于成像系统中以感测用于图像形成的光源的输出。 光源可以是激光阵列，LED阵列或其他合适的光源。 传感器的尺寸适当，可以感测来自光源的全部或部分光线。 传感器也可以是足够透明的，使得光不被其发射路径阻挡，对比度使得其仅吸收通过其中的一小部分光。 另外的特征是制造工艺与微弹簧互连的制造工艺兼容。 来自传感器的数据用作光源校正信息。 该信息被提供给允许校准高速系统的校准配置。

公开(公告)号：US06582989B2

公开(公告)日：2003-06-24

申请号：US10004819

申请日：2001-12-07

申请人： David K. Biegelsen ,  Christopher L. Chua ,  David K. Fork

发明人： David K. Biegelsen ,  Christopher L. Chua ,  David K. Fork

IPC分类号： H01L2144

CPC分类号： H01F17/0006 ,  H01F17/0033 ,  H01F41/041 ,  H01F2027/2814 ,  H01G5/18 ,  H01G5/38 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/48091 ,  H01L2924/014 ,  H01L2924/19042 ,  H05K3/4092 ,  H01L2924/00014

摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. Alternately, the loop winding can be formed of two elastic members in which the free ends are joined in mid-air. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

公开(公告)号：US5944537A

公开(公告)日：1999-08-31

申请号：US990508

申请日：1997-12-15

申请人： Donald L. Smith ,  Robert L. Thornton ,  Christopher L. Chua ,  David K. Fork

发明人： Donald L. Smith ,  Robert L. Thornton ,  Christopher L. Chua ,  David K. Fork

IPC分类号： H01L21/56 ,  H01L23/48 ,  H01L23/498 ,  H01R4/48 ,  H05K3/40 ,  H01R9/03 ,  H05K1/14

CPC分类号： H01L23/49811 ,  H01L21/563 ,  H01L24/72 ,  H05K3/4092 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/4943 ,  H01L2224/73203 ,  H01L2224/85424 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01R4/48

摘要： A photolithographically patterned spring contact is formed on a substrate and electrically connects contact pads on two devices. The spring contact also compensates for thermal and mechanical variations and other environmental factors. An inherent stress gradient in the spring contact causes a free portion of the spring contact to bend up and away from the substrate. An anchor portion remains fixed to the substrate and is electrically connected to a first contact pad on the substrate. The spring contact is made of an elastic material and the free portion compliantly contacts a second contact pad, thereby electrically interconnecting the two contact pads.

摘要翻译： 光刻图案的弹簧触点形成在基板上并电连接两个器件上的接触焊盘。 弹簧触点还补偿热和机械变化等环境因素。 弹簧接触中的固有应力梯度使得弹簧接触件的自由部分向上弯曲并远离基板。 锚固部分​​保持固定到基底上，并且电连接到基底上的第一接触垫。 弹簧接触由弹性材料制成，并且自由部分顺从地接触第二接触垫，由此电连接两个接触垫。

公开(公告)号：US07160121B2

公开(公告)日：2007-01-09

申请号：US10737272

申请日：2003-12-15

申请人： Koenraad F. Van Schuylenbergh ,  Christopher L. Chua ,  David K. Fork

发明人： Koenraad F. Van Schuylenbergh ,  Christopher L. Chua ,  David K. Fork

IPC分类号： H01R12/00

CPC分类号： H01R13/2407

摘要： An electrical interconnect structure that includes a spring portion that extends out of a plane. The electrical interconnect including curved regions to improve the lateral compliance of the interconnect. The curved region may be incorporated into a release region of the spring. The release region may include either or both an uplifted region and a planar region. The curves in the release region are arranged to improve the spring contact with a mating surface and also improve lateral compliance compared to prior art spring designs.

摘要翻译： 一种电互连结构，其包括从平面延伸的弹簧部分。 电互连包括弯曲区域，以改善互连的横向顺应性。 弯曲区域可以结合到弹簧的释放区域中。 释放区域可以包括隆起区域和平坦区域中的一个或两个。 释放区域中的曲线布置成改进与配合表面的弹簧接触，并且与现有技术的弹簧设计相比，还改善了侧向顺从性。

公开(公告)号：US06947291B2

公开(公告)日：2005-09-20

申请号：US10154555

申请日：2002-05-23

申请人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

发明人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC分类号： H01F41/04 ,  G01R1/067 ,  G01R3/00 ,  G03C5/00 ,  H01F17/00 ,  H01F17/02 ,  H01F27/29 ,  H01L21/02 ,  H01L21/60 ,  H01L21/768 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/522 ,  H01R9/03 ,  H05K7/02

CPC分类号： H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.