公开(公告)号：US08952404B2

公开(公告)日：2015-02-10

申请号：US13348369

申请日：2012-01-11

申请人： Cheol-jun Yoo ,  Young-hee Song

发明人： Cheol-jun Yoo ,  Young-hee Song

IPC分类号： H01L33/44 ,  H01L33/48 ,  B29C45/14 ,  H01L33/54 ,  H01L33/64

CPC分类号： H01L33/486 ,  B29C45/14344 ,  B29C45/14655 ,  B29C45/14836 ,  H01L33/54 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2924/15311 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting device package having improved connection reliability of a bonding wire, heat dissipation properties, and light quality due to post-molding and a method of manufacturing the light-emitting device package. The light-emitting device package includes, for example, a wiring substrate having an opening; a light-emitting device that is disposed on the wiring substrate and covers the opening; a bonding wire electrically connecting a bottom surface of the wiring substrate to a bottom surface of the light-emitting device via the opening; a molding member that surrounds a side surface of the light-emitting device and not a top surface of the light-emitting device, which is an emission surface, is formed on a portion of a top surface of the wiring substrate, and is formed in the opening of the wiring substrate to cover the bonding wire; and a solder resist and a bump formed on the bottom surface of the wiring substrate.

摘要翻译： 具有提高接合线的连接可靠性的发光器件封装，由于后成型而导致的散热特性和光质量以及制造发光器件封装的方法。 发光器件封装包括例如具有开口的布线基板; 发光装置，其布置在所述布线基板上并覆盖所述开口; 通过所述开口将所述布线基板的底面与所述发光装置的底面电连接的接合线; 在布线基板的上表面的一部分上形成有围绕发光装置的侧面而不是作为发光面的发光元件的顶面的成型部件， 布线基板的开口以覆盖接合线; 以及形成在布线基板的底面上的阻焊剂和凸块。

公开(公告)号：US20060073704A1

公开(公告)日：2006-04-06

申请号：US11210817

申请日：2005-08-25

申请人： Se-young Jeong ,  In-young Lee ,  Sung-min Sim ,  Young-hee Song ,  Dong-hyeon Jang ,  Myeong-soon Park ,  Sun-young Park ,  Sun-bum Kim ,  Hyun-soo Chung

发明人： Se-young Jeong ,  In-young Lee ,  Sung-min Sim ,  Young-hee Song ,  Dong-hyeon Jang ,  Myeong-soon Park ,  Sun-young Park ,  Sun-bum Kim ,  Hyun-soo Chung

IPC分类号： H01L21/302 ,  H01L21/461 ,  B44C1/22

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/00014

摘要： A method of forming a bump may involve providing a seed layer on a contact pad of a wafer. A shielding layer and a photosensitive mask layer may be formed on the seed layer. The photosensitive mask layer may be exposed and developed to form a mask pattern. An exposed portion of the shielding layer may be removed. The bump may be formed by plating the exposed seed layer.

摘要翻译： 形成凸块的方法可以包括在晶片的接触焊盘上提供种子层。 可以在种子层上形成屏蔽层和感光掩模层。 感光掩模层可以被曝光和显影以形成掩模图案。 可以去除屏蔽层的暴露部分。 可以通过电镀暴露的种子层来形成凸块。

公开(公告)号：US08710513B2

公开(公告)日：2014-04-29

申请号：US13365922

申请日：2012-02-03

申请人： Cheol-jun Yoo ,  Young-hee Song

发明人： Cheol-jun Yoo ,  Young-hee Song

IPC分类号： H01L33/62

CPC分类号： H01L25/167 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/15151 ,  H01L2924/00014

摘要： A light-emitting device package and a method of manufacturing the light-emitting device package. The light-emitting device package includes a wiring substrate; a Zener diode mounted on a first region of the wiring substrate; a light-emitting device chip mounted on the first region and a second region of the wiring substrate; and a molding member for fixing at least a portion of the wiring substrate, wherein the Zener diode is embedded in the molding member.

摘要翻译： 发光器件封装以及制造发光器件封装的方法。 发光器件封装包括布线基板; 安装在所述布线基板的第一区域上的齐纳二极管; 安装在所述第一区域上的发光器件芯片和所述布线基板的第二区域; 以及用于固定所述布线基板的至少一部分的模制构件，其中所述齐纳二极管嵌入所述模制构件中。

公开(公告)号：US20120205699A1

公开(公告)日：2012-08-16

申请号：US13365922

申请日：2012-02-03

申请人： Cheol-jun YOO ,  Young-hee Song

发明人： Cheol-jun YOO ,  Young-hee Song

IPC分类号： H01L33/62 ,  H01L33/58 ,  H01L33/50

CPC分类号： H01L25/167 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/15151 ,  H01L2924/00014

摘要： A light-emitting device package and a method of manufacturing the light-emitting device package. The light-emitting device package includes a wiring substrate; a Zener diode mounted on a first region of the wiring substrate; a light-emitting device chip mounted on the first region and a second region of the wiring substrate; and a molding member for fixing at least a portion of the wiring substrate, wherein the Zener diode is embedded in the molding member.

摘要翻译： 发光器件封装以及制造发光器件封装的方法。 发光器件封装包括布线基板; 安装在所述布线基板的第一区域上的齐纳二极管; 安装在所述第一区域上的发光器件芯片和所述布线基板的第二区域; 以及用于固定所述布线基板的至少一部分的模制构件，其中所述齐纳二极管嵌入所述模制构件中。

公开(公告)号：US20060038291A1

公开(公告)日：2006-02-23

申请号：US11080956

申请日：2005-03-16

申请人： Hyun-soo Chung ,  Sung-min Sim ,  Myeong-soon Park ,  Dong-hyeon Jang ,  Young-hee Song

发明人： Hyun-soo Chung ,  Sung-min Sim ,  Myeong-soon Park ,  Dong-hyeon Jang ,  Young-hee Song

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H05K3/3436 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3171 ,  H01L23/525 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05655 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H05K3/0023 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49149 ,  H01L2224/05552 ,  H01L2924/00014 ,  H01L2924/013

摘要： In the manufacture of a semiconductor device, a photosensitive layer is deposited to cover an exposed portion of an electrode with the photosensitive layer. The photosensitive layer is then subjected to a photolithography process to partially remove the photosensitive layer covering the electrode. The electrode may be a ball electrode or a bump electrode, and the semiconductor device may be contained in a wafer level package (WLP) or flip-chip package.

摘要翻译： 在半导体器件的制造中，沉积感光层以覆盖具有感光层的电极的暴露部分。 然后对感光层进行光刻处理，以部分去除覆盖电极的感光层。 电极可以是球形电极或凸块电极，并且半导体器件可以包含在晶片级封装（WLP）或倒装芯片封装中。

公开(公告)号：US5428247A

公开(公告)日：1995-06-27

申请号：US165021

申请日：1993-12-10

申请人： Hai-jeong Sohn ,  Young-hee Song

发明人： Hai-jeong Sohn ,  Young-hee Song

IPC分类号： H01L21/52 ,  H01L21/60 ,  H01L23/495 ,  H01L23/50 ,  H01L23/48 ,  H01L23/02 ,  H01L23/12 ,  H01L29/40

CPC分类号： H01L23/4951 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014

摘要： Disclosed is a semiconductor device wherein the down bonding and the mounting of multi-pin is made possible. A conductive member adhered to the bottom surface of the semiconductor element. The conductive member and the specific pad of the semiconductor element are connected by the connecting member, which enables the entire bottom surface of the semiconductor element to be used for down bonding. Further, the more effective latch-up suppression, noise dispersion and speed improvement compared with the conventional LOC-type package structure is possible.

摘要翻译： 公开了一种半导体器件，其中多引脚的向下接合和安装成为可能。 导电构件粘附到半导体元件的底表面。 导电构件和半导体元件的特定焊盘通过连接构件连接，这使得半导体元件的整个底表面能够用于下焊。 此外，与传统的LOC型封装结构相比，可以实现更有效的闭锁抑制，噪声分散和速度改进。