公开(公告)号：US20130332769A1

公开(公告)日：2013-12-12

申请号：US13970055

申请日：2013-08-19

Applicant: Micron Technology, Inc.

Inventor： Krishna K. Parat ,  Akira Goda ,  Koichi Kawai ,  Brian J. Soderling ,  Jeremy Binfet ,  Arnaud A. Furnemont ,  Tejas Krishnamohan ,  Tyson M. Stichka ,  Giuseppina Puzzilli

IPC: G11C29/00

CPC classification number: G11C29/765 ,  G11C11/5628 ,  G11C16/0483 ,  G11C16/16 ,  G11C16/349 ,  G11C29/789

Abstract: Memory devices and methods are disclosed, including a method involving erasing a block of memory cells. After erasing the block, and before subsequent programming of the block, a number of bad strings in the block are determined based on charge accumulation on select gate transistors. The block is retired from use if the number of bad strings exceeds a threshold. Additional embodiments are disclosed.

Abstract translation: 公开了存储器件和方法，包括涉及擦除存储器单元块的方法。 在擦除块之后，并且在块的后续编程之前，基于选择栅晶体管上的电荷积累来确定块中的多个不良串。 如果坏字符串的数量超过阈值，则该块将从使用中退出。 公开了另外的实施例。

公开(公告)号：US20240186234A1

公开(公告)日：2024-06-06

申请号：US18441767

申请日：2024-02-14

Applicant: Micron Technology, Inc.

Inventor： Sanh D. Tang ,  Roger W. Lindsay ,  Krishna K. Parat

IPC: H01L23/52 ,  G11C13/00 ,  H01L23/528 ,  H01L27/10 ,  H10B41/27 ,  H10B41/35 ,  H10B43/27 ,  H10B43/35 ,  H10B63/00 ,  H10N70/00

CPC classification number: H01L23/52 ,  G11C13/0007 ,  H01L23/528 ,  H01L27/10 ,  H01L27/101 ,  H10B41/27 ,  H10B43/27 ,  H10B43/35 ,  H10B63/845 ,  H10N70/8822 ,  H10N70/8825 ,  H10N70/8828 ,  H10N70/8833 ,  H10N70/8836 ,  G11C2213/11 ,  G11C2213/31 ,  G11C2213/32 ,  G11C2213/71 ,  G11C2213/75 ,  H01L2924/0002 ,  H10B41/35 ,  H10N70/882 ,  H10N70/883

Abstract: A method of forming circuitry components includes forming a stack of horizontally extending and vertically overlapping features. The features extend horizontally though a primary portion of the stack with at least some of the features extending farther in the horizontal direction in an end portion. Operative structures are formed vertically through the features in the primary portion and dummy structures are formed vertically through the features in the end portion. Openings are formed through the features to form horizontally elongated and vertically overlapping lines from material of the features. The lines individually extend laterally about sides of vertically extending portions of both the operative structures and the dummy structures. Sacrificial material that is elevationally between the lines is at least partially removed in the primary and end portions laterally between the openings. Other aspects and implementations are disclosed.

公开(公告)号：US20220284959A1

公开(公告)日：2022-09-08

申请号：US17706087

申请日：2022-03-28

Applicant: Micron Technology, Inc.

Inventor： Benben Li ,  Akira Goda ,  Ramey M. Abdelrahaman ,  Ian C. Laboriante ,  Krishna K. Parat

IPC: G11C16/04 ,  H01L27/11558 ,  H01L27/11524 ,  H01L45/00 ,  G11C11/408 ,  H01L27/24 ,  H01L27/11597 ,  G11C8/08 ,  H01L27/11556 ,  H01L27/11582 ,  H01L27/1157

Abstract: Some embodiments include apparatuses and methods of forming such apparatuses. One of the apparatus includes first memory cells located in different levels in a first portion of the apparatus, second memory cells located in different levels in a second portion of the apparatus, a switch located in a third portion of the apparatus between the first and second portions, first and second control gates to access the first and second memory cells, an additional control gate located between the first and second control gates to control the switch, a first conductive structure having a thickness and extending perpendicular to the levels in the first portion of the apparatus, a first dielectric structure between the first conductive structure and charge-storage portions of the first memory cells, a second dielectric structure having a second thickness between the second conductive structure and a sidewall of the additional control gate, the second thickness being greater than the first thickness.

公开(公告)号：US10825523B2

公开(公告)日：2020-11-03

申请号：US16667465

申请日：2019-10-29

Applicant: Micron Technology, Inc.

Inventor： Benben Li ,  Akira Goda ,  Ramey M. Abdelrahaman ,  Ian C. Laboriante ,  Krishna K. Parat

IPC: G11C16/04 ,  H01L27/11558 ,  H01L27/11524 ,  H01L45/00 ,  G11C11/408 ,  H01L27/24 ,  H01L27/11597 ,  G11C8/08 ,  H01L27/11556 ,  H01L27/11582 ,  H01L27/1157

Abstract: Some embodiments include apparatuses and methods of forming such apparatuses. One of the apparatus includes first memory cells located in different levels in a first portion of the apparatus, second memory cells located in different levels in a second portion of the apparatus, a switch located in a third portion of the apparatus between the first and second portions, first and second control gates to access the first and second memory cells, an additional control gate located between the first and second control gates to control the switch, a first conductive structure having a thickness and extending perpendicular to the levels in the first portion of the apparatus, a first dielectric structure between the first conductive structure and charge-storage portions of the first memory cells, a second dielectric structure having a second thickness between the second conductive structure and a sidewall of the additional control gate, the second thickness being greater than the first thickness.

公开(公告)号：US10796778B2

公开(公告)日：2020-10-06

申请号：US16694043

申请日：2019-11-25

Applicant: Micron Technology, Inc.

Inventor： Han Zhao ,  Akira Goda ,  Krishna K. Parat ,  Aurelio Giancarlo Mauri ,  Haitao Liu ,  Toru Tanzawa ,  Shigekazu Yamada ,  Koji Sakui

IPC: G11C16/34 ,  G11C16/06 ,  G11C16/08 ,  G11C16/04 ,  G11C16/32 ,  G11C16/26 ,  G11C16/16 ,  G11C8/08

Abstract: Some embodiments include apparatuses and methods having a memory cell string including memory cells located in different levels of the apparatus and a data line coupled to the memory cell string. The memory cell string includes a pillar body associated with the memory cells. At least one of such apparatus can include a module configured to store information in a memory cell among memory cells and/or to determine a value of information stored in a memory cell among memory cells. The module can also be configured to apply a voltage having a positive value to the data line and/or a source to control a potential of the body. Other embodiments are described.

公开(公告)号：US20190279715A1

公开(公告)日：2019-09-12

申请号：US16237337

申请日：2018-12-31

Applicant: Micron Technology, Inc.

Inventor： Akira Goda ,  Shafqat Ahmed ,  Khaled Hasnat ,  Krishna K. Parat

IPC: G11C16/04 ,  G11C16/06 ,  G11C16/34 ,  G11C16/14 ,  G11C16/12 ,  G11C16/26 ,  H01L27/11582 ,  H01L27/11565 ,  H01L27/11556 ,  H01L27/11519

Abstract: Apparatus and methods are disclosed, such as an apparatus that includes a string of charge storage devices associated with a pillar (e.g., of semiconductor material), a source gate device, and a source select device coupled between the source gate device and the string. Additional apparatus and methods are described.

公开(公告)号：US20190273120A1

公开(公告)日：2019-09-05

申请号：US16253111

申请日：2019-01-21

Applicant: Micron Technology, Inc.

Inventor： Fatma Arzum Simsek-Ege ,  Krishna K. Parat

IPC: H01L27/24 ,  H01L45/00 ,  H01L27/11553 ,  H01L27/1158 ,  H01L29/788 ,  H01L29/66 ,  H01L29/792

Abstract: Various embodiments comprise apparatuses and methods, such as a memory stack having a continuous cell pillar. In various embodiments, the apparatus includes a source material, a buffer material, a select gate drain (SGD), and a memory stack arranged between the source material and the SGD. The memory stack comprises alternating levels of conductor materials and dielectric materials. A continuous channel-fill material forms a cell pillar that is continuous from the source material to at least a level corresponding to the SGD.

公开(公告)号：US20180175059A1

公开(公告)日：2018-06-21

申请号：US15900188

申请日：2018-02-20

Applicant: Micron Technology, Inc.

Inventor： Sanh D. Tang ,  Roger W. Lindsay ,  Krishna K. Parat

IPC: H01L27/11582 ,  H01L27/1157 ,  H01L27/11524 ,  H01L45/00

CPC classification number: H01L23/52 ,  G11C13/0007 ,  G11C2213/11 ,  G11C2213/31 ,  G11C2213/32 ,  G11C2213/71 ,  G11C2213/75 ,  H01L23/528 ,  H01L27/10 ,  H01L27/101 ,  H01L27/11524 ,  H01L27/11556 ,  H01L27/1157 ,  H01L27/11582 ,  H01L27/249 ,  H01L45/141 ,  H01L45/142 ,  H01L45/143 ,  H01L45/144 ,  H01L45/145 ,  H01L45/146 ,  H01L45/147 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of forming circuitry components includes forming a stack of horizontally extending and vertically overlapping features. The stack has a primary portion and an end portion. At least some of the features extend farther in the horizontal direction in the end portion moving deeper into the stack in the end portion. Operative structures are formed vertically through the features in the primary portion and dummy structures are formed vertically through the features in the end portion. Horizontally elongated openings are formed through the features to form horizontally elongated and vertically overlapping lines from material of the features. The lines individually extend from the primary portion into the end portion, and individually laterally about sides of vertically extending portions of both the operative structures and the dummy structures. Sacrificial material that is elevationally between the lines is at least partially removed in the primary and end portions laterally between the horizontally elongated openings. Other aspects and implementations are disclosed.

公开(公告)号：US09991273B2

公开(公告)日：2018-06-05

申请号：US15691477

申请日：2017-08-30

Applicant: Micron Technology, Inc.

Inventor： Charles H. Dennison ,  Akira Goda ,  John Hopkins ,  Fatma Arzum Simsek-Ege ,  Krishna K. Parat

IPC: H01L27/1156 ,  H01L27/11556 ,  H01L29/66 ,  H01L21/28 ,  H01L27/11578

CPC classification number: H01L27/11556 ,  H01L21/28273 ,  H01L27/11578 ,  H01L29/66666 ,  H01L29/66825 ,  H01L29/66833

Abstract: Floating gate memory cells in vertical memory. A control gate is formed between a first tier of dielectric material and a second tier of dielectric material. A floating gate is formed between the first tier of dielectric material and the second tier of dielectric material, wherein the floating gate includes a protrusion extending towards the control gate. A charge blocking structure is formed between the floating gate and the control gate, wherein at least a portion of the charge blocking structure wraps around the protrusion.

公开(公告)号：US09881686B2

公开(公告)日：2018-01-30

申请号：US15393719

申请日：2016-12-29

Applicant: Micron Technology, Inc.

Inventor： Han Zhao ,  Akira Goda ,  Krishna K. Parat ,  Aurelio Giancarlo Mauri ,  Haitao Liu ,  Toru Tanzawa ,  Shigekazu Yamada ,  Koji Sakui

IPC: G11C16/34 ,  G11C16/32 ,  G11C16/04 ,  G11C16/16 ,  G11C16/26 ,  G11C16/08

CPC classification number: G11C16/3459 ,  G11C8/08 ,  G11C16/0483 ,  G11C16/06 ,  G11C16/08 ,  G11C16/16 ,  G11C16/26 ,  G11C16/32 ,  G11C16/3445 ,  G11C2213/71

Abstract: Some embodiments include apparatuses and methods having a memory cell string including memory cells located in different levels of the apparatus and a data line coupled to the memory cell string. The memory cell string includes a pillar body associated with the memory cells. At least one of such apparatus can include a module configured to store information in a memory cell among memory cells and/or to determine a value of information stored in a memory cell among memory cells. The module can also be configured to apply a voltage having a positive value to the data line and/or a source to control a potential of the body. Other embodiments are described.