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    Adhesive composition and adhesive film or sheet on which the composition is coated
    14.
    发明授权
    Adhesive composition and adhesive film or sheet on which the composition is coated 失效
    粘合剂组合物和其上涂覆有组合物的粘合剂膜或片材

    公开(公告)号：US4717609A

    公开(公告)日：1988-01-05

    申请号：US934944

    申请日：1986-11-19

    申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Hidenori Kimbara

    发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Hidenori Kimbara

    IPC分类号： C09J7/00 ,  C09J167/00 ,  C08L67/02

    CPC分类号： C09J167/00 ,  C09J7/00 ,  Y10T428/14

    摘要： An adhesive composition comprising at least(A) at least one cyanate ester compound selected from the group consisting of:(i) polyfunctional aromatic cyanate ester monomers having the formulaR--O--C.tbd.N).sub.n wherein n is integer of 2-10 and R is an aromatic organic group, the cyanate groups being bonded to an aromatic ring or said aromatic organic group;(ii) homoprepolymers of (i) and(iii) coprepolymer of (i) and an amine, and(B) at least one thermoplastic saturated polyester resin which is non-crystalline, substantially non-crystalline or of low crystallinity is disclosed. The adhesive composition has excellent heat resistance, moisture resistance and chemical resistance.

    摘要翻译： 一种粘合剂组合物，其至少包含（A）至少一种选自以下的氰酸酯化合物：（i）具有式ROC 3BOND N的多官能芳族氰酸酯单体）n，其中n为2-10的整数，R为 芳族有机基团，氰酸酯基团键合到芳环或所述芳族有机基团; （ⅱ）（ⅰ）和（ⅲ）与（ⅰ）的共聚合物与胺的高分子量聚合物，和（B）至少一种非结晶，基本上非结晶或低结晶度的热塑性饱和聚酯树脂。 粘合剂组合物具有优异的耐热性，耐湿性和耐化学性。

    Process for producing a curable resin from cyanate ester compound and unsaturated 1,2-epoxy compound
    15.
    发明授权
    Process for producing a curable resin from cyanate ester compound and unsaturated 1,2-epoxy compound 失效
    由氰酸酯化合物和不饱和1,2-环氧化合物制备可固化树脂的方法

    公开(公告)号：US4533727A

    公开(公告)日：1985-08-06

    申请号：US596086

    申请日：1984-04-03

    申请人： Morio Gaku ,  Hidenori Kimbara ,  Satoshi Ayano ,  Susumu Yoshimura

    发明人： Morio Gaku ,  Hidenori Kimbara ,  Satoshi Ayano ,  Susumu Yoshimura

    IPC分类号： C08F2/46 ,  C08F20/32 ,  C08F20/36 ,  C08G83/00

    CPC分类号： C08F20/36 ,  C08F20/32 ,  Y10T428/31511 ,  Y10T428/31518

    摘要： A process for producing a curable resin comprises reacting (a) at least one cyanate ester compound selected from the group consisting of polyfunctional cyanate esters having 2 or more cyanato groups per one molecule, prepolymers of the cyanate esters or mixtures thereof with (b) at least one compound having 1,2-epoxy group(s) and radical-polymerizable unsaturated double bond(s) in its molecule, the cyanate ester compound (a) and the compound (b) being used so that the ratio of the cyanato group to the 1,2-epoxy group is in the range of about 1:0.25 to about 1:2, in the presence of (c) a radical polymerization inhibitor at a temperature of about 90.degree.--about 140.degree. C.The curable resin produced according to the present invention is capable of giving cured products having excellent heat resistance and electrical properties.

    摘要翻译： 制备可固化树脂的方法包括使（a）至少一种氰化酯化合物，其选自由每分子具有2个或更多个氰基的多官能氰酸酯组成的组，氰酸酯的预聚物或其混合物与（b）在 在分子中具有1,2-环氧基和自由基聚合性不饱和双键的至少一种化合物，使用氰酸酯化合物（a）和化合物（b），使得氰基的比例 在（c）自由基聚合抑制剂的存在下，在大约90°-140℃的温度下，1,2-环氧基的量在约1:0.25至约1:2的范围内。可固化树脂 根据本发明生产的能够得到具有优异的耐热性和电性能的固化产物。

    Curable resin composition
    16.
    发明授权
    Curable resin composition 失效
    可固化树脂组合物

    公开(公告)号：US4383903A

    公开(公告)日：1983-05-17

    申请号：US250897

    申请日：1981-04-03

    申请人： Satoshi Ayano ,  Morio Gaku ,  Nobuyuki Ikeguchi ,  Hidenori Kinbara ,  Yasunari Osaki

    发明人： Satoshi Ayano ,  Morio Gaku ,  Nobuyuki Ikeguchi ,  Hidenori Kinbara ,  Yasunari Osaki

    IPC分类号： C08G73/00 ,  C08F2/20 ,  C08F2/50 ,  C08F283/00 ,  C08F299/02 ,  C08G73/02 ,  C08G73/06 ,  C08J5/24 ,  H05K3/28 ,  G03C1/68 ,  G03C1/70

    CPC分类号： C08F2/20 ,  C08F283/00 ,  C08F299/024 ,  Y10S430/12 ,  Y10S430/128

    摘要： A photo-curable resin composition is disclosed comprising (i) a mixture and/or a preliminary reaction product of (a) at least one cyanate compound selected from the group consisting of polyfunctional cyanate esters, prepolymers of the cyanate esters, coprepolymers of the cyanate esters and an amine and mixtures thereof, (b) at least one compound selected from the group consisting of monomers having at least one olefinically double bond prepolymers of the monomers, liquid rubbers having one or more acryloyl or methacryloyl groups and mixtures thereof and optionally (c) at least one maleimide compound selected from the group consisting of polyfunctional maleimides, prepolymers of the maleimides, coprepolymers of the maleimides and an amine and mixtures thereof and (ii) a photo polymerization initiator or a photo sensitizer.

    摘要翻译： 公开了一种光固化树脂组合物，其包含（i）（a）至少一种氰化物化合物的混合物和/或预反应产物，所述氰化物选自多官能氰酸酯，氰酸酯的预聚物，氰酸的共聚物 酯和胺及其混合物，（b）至少一种选自具有至少一种单体的烯属双键预聚物的单体，具有一个或多个丙烯酰基或甲基丙烯酰基的液体橡胶及其混合物和任选（ c）至少一种选自多官能马来酰亚胺，马来酰亚胺的预聚物，马来酰亚胺的共聚物和胺及其混合物的马来酰亚胺化合物和（ii）光聚合引发剂或光敏剂。

    Novel crosslinkable resin composition and method for producing a laminate using said composition
    17.
    发明授权
    Novel crosslinkable resin composition and method for producing a laminate using said composition 失效
    新型交联性树脂组合物及其制造方法

    公开(公告)号：US4287014A

    公开(公告)日：1981-09-01

    申请号：US107614

    申请日：1979-12-27

    申请人： Morio Gaku ,  Norio Nagai ,  Yasunari Osaki

    发明人： Morio Gaku ,  Norio Nagai ,  Yasunari Osaki

    IPC分类号： B32B29/00 ,  C08L23/06 ,  C08L67/06 ,  H05K1/03 ,  C09J5/06

    CPC分类号： C08L23/06 ,  B32B29/00 ,  C08L67/06 ,  H05K1/0353 ,  C08K5/02 ,  C08K5/14 ,  C08K7/14 ,  C08L2312/00 ,  C08L63/00 ,  C08L67/00 ,  Y10S428/901 ,  Y10T29/49126

    摘要： A crosslinkable resin composition comprising (A) a polyethylene resin composition containing 0.1 to 10% by weight of a crosslinking agent and (B) a thermosetting resin composition selected from the group consisting of cyanate ester resin compositions, polyester resin compositions and epoxy resin compositions; said crosslinkable resin composition comprising (1) 95 to 5% by weight of the resin composition (A) and 5 to 95% by weight of the resin composition (B) when the resin composition (B) is a cyanate ester resin composition, and (2) 95 to 20% by weight of the resin composition (A) and 5 to 80% by weight of the resin composition (B) when the resin composition (B) is a polyester resin composition or an epoxy resin composition; and a method for producing a laminate using said composition.

    摘要翻译： 一种交联性树脂组合物，其包含（A）含有0.1〜10重量％交联剂的聚乙烯树脂组合物和（B）选自氰酸酯树脂组合物，聚酯树脂组合物和环氧树脂组合物的热固性树脂组合物; 所述交联性树脂组合物含有（1）树脂组合物（A）的95〜5重量％和树脂组合物（B）的5〜95重量％为氰酸酯树脂组合物，和 （2）当树脂组合物（B）为聚酯树脂组合物或环氧树脂组合物时，树脂组合物（A）为95〜20重量％，树脂组合物（B）为5〜80重量％ 以及使用该组合物制造层压体的方法。

    Nonwoven reinforcement for printed wiring base board and process for producing the same
    19.
    发明授权
    Nonwoven reinforcement for printed wiring base board and process for producing the same 有权
    印刷布线基板用无纺布加固件及其制造方法

    公开(公告)号：US06229096B1

    公开(公告)日：2001-05-08

    申请号：US09166578

    申请日：1998-10-06

    申请人： Morio Gaku ,  Mitsuru Nozaki ,  Kenji Saimen ,  Tamemaru Esaki

    发明人： Morio Gaku ,  Mitsuru Nozaki ,  Kenji Saimen ,  Tamemaru Esaki

    IPC分类号： H05K109

    CPC分类号： D21H13/24 ,  D21H17/53 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/24322 ,  Y10T442/2475

    摘要： There are disclosed a nonwoven reinforcement for a printed wiring base board which nonwoven reinforcement contains a wet system nonwoven fabric constituted of thermotropic cystalline polyester fiber having a melting point of 290° C. or higher (component A) and a thermotropic cystalline polyester binder which has a melting point of 290° C. or higher and is in the form of a film having holes including at least 5 holes/mm2 each with an area of opening of 400 to 1000 &mgr;m2 (component B), the component A being fixed by the component B; a process for producing the above nonwoven reinforcement; a printed wiring base board produced from the above nonwoven reinforcement; and a printed wiring board produced from the above printed wiring base board. The nonwoven reinforcement and the printed wiring (base) board are excellent in various performances such as uniformity, dimensional stability, heat resistance and electrical characteristics such as dielectric constasnt and dielectric loss tangent.

    摘要翻译： 公开了一种用于印刷布线基板的无纺布加强件，其中非织造材料增强件包含由熔点为290℃或更高的（A组分）的热致变性结晶聚酯纤维构成的湿系非织造织物和具有 熔点为290℃以上，并且为具有包含至少5个孔/ mm 2的孔的膜的形式，每个孔的开口面积为400〜1000mum2（B成分），成分A被固定在 组分B; 一种生产上述无纺布增强件的方法; 由上述无纺布加强件制成的印刷布线基板; 以及由上述印刷布线基板制造的印刷电路板。 非织造布加强件和印刷布线（基底）板在诸如均匀性，尺寸稳定性，耐热性和电特性如介电常数和介电损耗角正切性等各种性能方面都是优异的。

    Process for producing cyanate ester resin cure product
    20.
    发明授权
    Process for producing cyanate ester resin cure product 失效
    生产氰酸酯树脂固化产品的方法

    公开(公告)号：US5186880A

    公开(公告)日：1993-02-16

    申请号：US547207

    申请日：1990-07-03

    申请人： Morio Gaku ,  Mitsuru Nozaki

    发明人： Morio Gaku ,  Mitsuru Nozaki

    IPC分类号： C08K5/17 ,  C08G73/06 ,  C08K5/56 ,  C08L79/04

    CPC分类号： C08G73/0655

    摘要： The invention is a process for making a cyanate ester resin cured product by (1) adding organic metal compound (a) and triethanol amine(b) to a cyanate resin composition which is flowable at a temperature of not more than 50.degree. C. comprising as its main component polyfunctional cyanate ester compound having at least two cyanate groups, thereby forming a cyanate resin composition having 0.1-5% by weight of (a) and 0.1-5% by weight of (b), which is flowable at a temperature of not more than 50.degree. C.; (2) molding the composition at a temperature of not more than 50.degree. C. (3) primary curing at a temperature of not more than 50.degree. C.; and (4) post-curing at a temperature of not less than 170.degree. C.