公开(公告)号：US20160181760A1

公开(公告)日：2016-06-23

申请号：US15057770

申请日：2016-03-01

Applicant: NICHIA CORPORATION

Inventor： Hiroki SAKATA ,  Hiroaki YUTO ,  Eiichiro OKAHISA ,  Kazuma KOZURU

IPC: H01S5/024 ,  H01S5/022

CPC classification number: H01S5/02469 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01S5/02212 ,  H01S5/02236 ,  H01S5/02256 ,  H01S5/02276 ,  H01S5/02476 ,  H01S5/32341 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor laser device can include an insulating single crystal SiC having a first surface, a second surface, and micropipes having openings in the first surface and the second surface. A conductive base can be provided on a side of the first surface of the single crystal SiC, and a semiconductor laser element can be provided on a side of the second surface of the single crystal SiC. An insulating member can be formed in the micropipes.

Abstract translation: 半导体激光器件可以包括具有第一表面，第二表面和在第一表面和第二表面中具有开口的微管的绝缘单晶SiC。 可以在单晶SiC的第一表面的一侧设置导电性基材，并且可以在单晶SiC的第二面的一侧设置半导体激光元件。 可以在微管中形成绝缘构件。

公开(公告)号：US20140321491A1

公开(公告)日：2014-10-30

申请号：US14261520

申请日：2014-04-25

Applicant: NICHIA CORPORATION

Inventor： Hiroki SAKATA ,  Hiroaki YUTO ,  Eiichiro OKAHISA ,  Kazuma KOZURU

IPC: H01S5/02

CPC classification number: H01S5/02469 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01S5/02212 ,  H01S5/02236 ,  H01S5/02256 ,  H01S5/02276 ,  H01S5/02476 ,  H01S5/32341 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor laser device can include an insulating single crystal SiC having a first surface, a second surface, and micropipes having openings in the first surface and the second surface. A conductive base can be provided on a side of the first surface of the single crystal SiC, and a semiconductor laser element can be provided on a side of the second surface of the single crystal SiC. An insulating member can be formed in the micropipes.

Abstract translation: 半导体激光器件可以包括具有第一表面，第二表面和在第一表面和第二表面中具有开口的微管的绝缘单晶SiC。 可以在单晶SiC的第一表面的一侧设置导电性基材，并且可以在单晶SiC的第二面的一侧设置半导体激光元件。 可以在微管中形成绝缘构件。

公开(公告)号：US20130195134A1

公开(公告)日：2013-08-01

申请号：US13748194

申请日：2013-01-23

Applicant: Nichia Corporation

Inventor： Eiichiro OKAHISA

IPC: H01S5/022 ,  H01S5/024

CPC classification number: H01S5/02236 ,  H01L2224/48091 ,  H01S5/02212 ,  H01S5/024 ,  H01S5/02469 ,  H01S5/02476 ,  H01S5/32341 ,  H01L2924/00014

Abstract: A semiconductor laser device having stable heat dissipation property is provided. The semiconductor laser device includes a semiconductor laser element, a mounting body on which the semiconductor laser element is mounted, and a base body connected to the mounting body. The base body has a recess configured to engage with the mounting body and a through portion penetrating through a part of a bottom of the recess. In the specification, the remainder, which is a part of the bottom of the recess except for the through portion has a thickness equal or less than half of the largest thickness of the base body. The lowermost surface of the mounting body is spaced apart from the lowermost surface of the base body through the remainder.

Abstract translation: 提供具有稳定散热性能的半导体激光器件。 半导体激光装置包括半导体激光元件，安装有半导体激光元件的安装体以及与安装体连接的基体。 基体具有凹部，该凹部构造成与安装体接合并穿过贯穿凹部的底部的一部分的贯穿部。 在说明书中，作为除了贯通部以外的凹部的一部分的其余部分的厚度等于或小于基体的最大厚度的一半。 安装体的最下表面通过其余部分与基体的最下表面间隔开。

公开(公告)号：US20240125455A1

公开(公告)日：2024-04-18

申请号：US18394233

申请日：2023-12-22

Applicant: NICHIA CORPORATION

Inventor： Seiji KIYOTA ,  Kazuma KOZURU ,  Eiichiro OKAHISA

IPC: F21V5/00 ,  F21V5/04 ,  G02B3/00 ,  G02B19/00 ,  H01S5/00 ,  H01S5/02216 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/40

CPC classification number: F21V5/007 ,  F21V5/04 ,  G02B3/0056 ,  G02B19/0057 ,  H01S5/0071 ,  H01S5/02216 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/4018 ,  H01S5/4025 ,  H01S5/405 ,  H01S5/02345

Abstract: A light-emitting device includes: a substrate including a base and a side wall; a plurality of semiconductor laser elements arrayed in a first direction on an upper surface of the base; a sealing member fixed to the substrate, wherein the sealing member and the substrate define a sealed space in which the semiconductor laser element is located; and a lens array disposed above the sealing member, the lens array including a plurality of lens sections arrayed in the first direction. In the lens array, a maximum outer diameter of each lens sections is 1.25 times or more than an inter-vertex distance between adjacent ones of the lens sections in the first direction.

公开(公告)号：US20230324633A1

公开(公告)日：2023-10-12

申请号：US18042440

申请日：2021-08-06

Applicant: NICHIA CORPORATION

Inventor： Tatsuya KANAZAWA ,  Eiichiro OKAHISA

IPC: G02B6/42

CPC classification number: G02B6/4214 ,  G02B6/4286

Abstract: A light source device, including: a reflective member including a plurality of reflective surfaces including a first reflective surface and a second reflective surface, and one or more transmissive surfaces including a first transmissive surface that connects between the first reflective surface and the second reflective surface; a plurality of light-emitting elements including a first light-emitting element emitting first light that travels in a direction in which the reflective member is arranged to be incident on the first reflective surface, and a second light-emitting element emitting second light that travels in a direction in which the reflective member is arranged to be incident on the second reflective surface; and a first photodetector having a first light-receiving surface on which the first light that travels in the direction in which the reflective member is arranged and is transmitted through the first transmissive surface is irradiated.

公开(公告)号：US20230243484A1

公开(公告)日：2023-08-03

申请号：US18298784

申请日：2023-04-11

Applicant: NICHIA CORPORATION

Inventor： Seiji KIYOTA ,  Kazuma KOZURU ,  Eiichiro OKAHISA

IPC: F21V5/00 ,  H01S5/00 ,  F21V5/04 ,  G02B19/00 ,  G02B3/00 ,  H01S5/40 ,  H01S5/02216 ,  H01S5/02253 ,  H01S5/02255

CPC classification number: F21V5/007 ,  H01S5/0071 ,  F21V5/04 ,  G02B19/0057 ,  G02B3/0056 ,  H01S5/405 ,  H01S5/4018 ,  H01S5/02216 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/4025 ,  H01S5/02345

Abstract: A light-emitting device includes: a substrate including a base and a side wall; a plurality of semiconductor laser elements arrayed in a first direction on an upper surface of the base; a sealing member fixed to the substrate, wherein the sealing member and the substrate define a sealed space in which the semiconductor laser element is located; and a lens array disposed above the sealing member, the lens array including a plurality of lens sections arrayed in the first direction. In the lens array, a maximum outer diameter of each lens sections is 1.25 times or more than an inter-vertex distance between adjacent ones of the lens sections in the first direction.

公开(公告)号：US20210159665A1

公开(公告)日：2021-05-27

申请号：US17169224

申请日：2021-02-05

Applicant: NICHIA CORPORATION

Inventor： Takuya HASHIMOTO ,  Eiichiro OKAHISA

IPC: H01S5/02345 ,  H01S5/024 ,  H01L23/00 ,  H01S5/0222 ,  H01S5/02253 ,  H01S5/02257

Abstract: A light emitting device includes: a base including: a main body, and a frame disposed on an upper surface of the main body; one or more laser elements disposed on the upper surface of the main body and positioned inward of the frame; and a cover including: a support member that is fixed to an upper surface of the frame and that has an opening inside the frame, and a light transmissive portion that is fixed to the support member and that is disposed so as to close the opening. A first interface, between the light transmissive portion and the support member, is located inward of and lower than a second interface, between the support member and the frame. A portion of the support member that extends at least from an outermost end of the first interface to an innermost end of the second interface has a constant thickness.

公开(公告)号：US20190165542A1

公开(公告)日：2019-05-30

申请号：US16203477

申请日：2018-11-28

Applicant: NICHIA CORPORATION

Inventor： Takuya HASHIMOTO ,  Eiichiro OKAHISA

IPC: H01S5/022 ,  H01L23/00 ,  H01S5/024

Abstract: A light emitting device includes: a base including: a main body, and a frame disposed on an upper surface of the main body; one or more laser elements disposed on the upper surface of the main body inward of the frame; a cover comprising: a support member that is fixed on an upper surface of the frame and has an opening inside the frame, and a light transmissive portion disposed so as to close the opening; and a lens body disposed above the light transmissive portion. The support member includes; a first portion fixed on the upper surface of the frame, a second portion on which the lens body is disposed, the second portion being positioned inward of and lower than the first portion, and a third portion on which the light transmissive portion is disposed, the third portion being disposed inward of and lower than the second portion.

公开(公告)号：US20180254604A1

公开(公告)日：2018-09-06

申请号：US15966847

申请日：2018-04-30

Applicant: NICHIA CORPORATION ,  SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Shigeru MATSUSHITA ,  Katsuya NAKAZAWA ,  Eiichiro OKAHISA ,  Kazuma KOZURU

IPC: H01S5/022 ,  H01S5/40 ,  H01S5/30 ,  H01S5/024 ,  H01L25/075 ,  H01L33/48 ,  H01L33/62 ,  H01L33/60 ,  H01L33/64

CPC classification number: H01S5/022 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01S5/02216 ,  H01S5/02256 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/02292 ,  H01S5/02469 ,  H01S5/3013 ,  H01S5/4025 ,  H01L2924/00014

Abstract: A light-emitting device includes a base body; light-emitting elements mounted on an upper surface of the base body; a frame body bonded to the upper surface of the base body, the frame body including inner lateral surfaces, outer lateral surfaces, and first through-holes that extend through the frame body in a lateral direction; lead terminals that extend through the first through-holes, and each of which is electrically connected to the light-emitting elements; a cover bonded to the frame body; plate bodies bonded to an outer lateral surface or inner lateral surface of the frame body, each of the plate bodies having one or more second through-holes, wherein each of the lead terminals extends through a respective through-hole; and fixing members, each of which is disposed in a second through-hole and fixes a respective one of the one or more lead terminals.

公开(公告)号：US20170317467A1

公开(公告)日：2017-11-02

申请号：US15496846

申请日：2017-04-25

Applicant: NICHIA CORPORATION

Inventor： Soichiro MIURA ,  Seiji KIYOTA ,  Eiichiro OKAHISA

IPC: H01S5/022 ,  H01S5/40 ,  H01L33/58

CPC classification number: H01S5/02252 ,  H01S5/0071 ,  H01S5/02216 ,  H01S5/02276 ,  H01S5/02288 ,  H01S5/02469 ,  H01S5/32341 ,  H01S5/4018 ,  H01S5/4031

Abstract: A method of manufacturing a light-emitting device includes providing a base body including a base section; fixing a plurality of semiconductor laser elements on an upper surface of the base section; and fixing an optical member to the base body, the optical member including a plurality of lens sections, and a non-lens section disposed at a periphery of the plurality of lens sections in a top view. In the step of fixing the optical member: the optical member is arranged above the base body; (i) an inclination and a height of the optical member are adjusted after interposing an adhesive between the base body and the non-lens section, or (ii) an adhesive is interposed between the base body and the non-lens section after adjusting the inclination and the height of the optical member; and subsequently, the adhesive is cured to fix the optical member to the base body.