公开(公告)号：US20210050487A1

公开(公告)日：2021-02-18

申请号：US16990573

申请日：2020-08-11

Applicant: NICHIA CORPORATION

Inventor： Masaya MIYAZAKI ,  Ryo SUZUKI

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/00

Abstract: A light-emitting device efficiently performs wavelength conversion and includes a light-emitting element having a light-emitting surface, a wavelength conversion member having an incident surface that is larger than the light-emitting surface of the light-emitting element, a light-transmissive member that includes a first portion disposed across a lateral surface of the light-emitting element and the incident surface of the wavelength conversion member, and a light-reflective member disposed to cover the lateral surface of the light-emitting element while being in contact with the first portion of the light-transmissive member. The incident surface of the wavelength conversion member faces the light-emitting surface of the light-emitting element and has an outer periphery located outward of an outer periphery of the light-emitting surface. The light-transmissive member further includes a second portion that extends from an end portion of the first portion between the light-reflective member and the incident surface of the wavelength conversion member.

公开(公告)号：US20180190886A1

公开(公告)日：2018-07-05

申请号：US15908577

申请日：2018-02-28

Applicant: NICHIA CORPORATION

Inventor： Ryo SUZUKI

IPC: H01L33/60 ,  H01L33/50 ,  H01L33/56 ,  H01L33/00

CPC classification number: H01L33/60 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/486 ,  H01L33/50 ,  H01L33/56 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light emitting device includes a light emitting element having a first face positioned on an emission face side of the light emitting device, a second face opposing the first face, and lateral faces disposed between the first face and the second face, a light transmissive member formed from a resin-containing material, covering at least a portion of the lateral faces of the light emitting element and having a first face positioned on the emission face side, a covering member covering an exterior of the light transmissive member and having a first face positioned on the emission face side, a wavelength converting member covering the first face of the light emitting element, the first face of the light transmissive member, and the first face of the covering member, and a light reflective film including a first reflective film portion made of an inorganic material disposed between the exterior of the light transmissive member and the covering member, and a second reflective film portion made of an inorganic material disposed between the first face of the covering member and the wavelength converting member.

公开(公告)号：US20170077373A1

公开(公告)日：2017-03-16

申请号：US15361630

申请日：2016-11-28

Applicant: NICHIA CORPORATION

Inventor： Ryo SUZUKI ,  Yoshikazu TAKEUCHI ,  Hirokazu SASA

IPC: H01L33/64 ,  H01L33/56 ,  H01L33/28 ,  H01L33/50 ,  H01L33/00 ,  H01L33/32 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/641 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/28 ,  H01L33/32 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A method for manufacturing a light emitting device includes preparing a light emitting element that includes a light transmissive substrate comprising a first main surface, a second main surface, and a side surface having a light transmitting part and a light absorbing part whose optical transmissivity is lower than that of the light transmitting part, and a semiconductor laminate that is provided to the first main surface of the light transmissive substrate, joining the light emitting element to an upper surface of a base body such that the base body is opposite to the side where the semiconductor laminate is provided, providing a support member that covers the side surface of the light emitting element and part of the base body, and removing the light absorbing part by thinning the light transmissive substrate from the second main surface side.

Abstract translation: 一种发光器件的制造方法，其特征在于，具备：准备包括透光性基板的发光元件，所述透光性基板包括第一主面，第二主面以及具有透光部的透光部和光透射率较低的光吸收部的侧面 与透光部的上表面接合，并且设置在透光性基板的第一主面上的半导体层叠体，将该发光元件与基体的上表面接合，使得基体与 提供半导体层叠体，提供覆盖发光元件的侧面和基体的一部分的支撑构件，并且通过使透光性基板从第二主面侧变薄来除去光吸收部。

公开(公告)号：US20160351768A1

公开(公告)日：2016-12-01

申请号：US15169133

申请日：2016-05-31

Applicant: NICHIA CORPORATION

Inventor： Yoshikazu MATSUDA ,  Ryo SUZUKI

IPC: H01L33/62 ,  H01L33/64 ,  H01L33/50 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L24/81 ,  H01L33/50 ,  H01L33/54 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0075

Abstract: A metal coating method includes forming a metal layer on a substrate including a first member and a second member, the second member having a lower thermal conductivity than a thermal conductivity of the first member, and irradiating the metal layer formed on the first member and the second member with a laser beam such that, after irradiation, the metal layer formed on the first member remains, and the metal layer formed on the second member is removed.

Abstract translation: 金属涂覆方法包括在包括第一构件和第二构件的基板上形成金属层，第二构件具有比第一构件的热导率低的热导率，并且照射形成在第一构件上的金属层和 第二构件，其具有激光束，使得在照射之后，保留形成在第一构件上的金属层，并且去除形成在第二构件上的金属层。

公开(公告)号：US20190189868A1

公开(公告)日：2019-06-20

申请号：US16269562

申请日：2019-02-06

Applicant: NICHIA CORPORATION

Inventor： Ikuko BAIKE ,  Ryo SUZUKI

IPC: H01L33/52 ,  H01L33/32 ,  H01L33/00 ,  H01L33/60 ,  H01L33/40

CPC classification number: H01L33/52 ,  H01L33/0075 ,  H01L33/20 ,  H01L33/32 ,  H01L33/38 ,  H01L33/40 ,  H01L33/505 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2933/005

Abstract: A method for manufacturing a light emitting device includes: preparing a wavelength conversion member; preparing a light emitting element comprising a pair of electrodes at a second face side of the light emitting element; forming a light transmissive member, which includes: disposing a liquid resin material on a second main face of the wavelength conversion member, disposing the light emitting element on the liquid resin material such that (i) a first face of the light emitting element is opposed to the second main face of the wavelength converting member, (ii) a portion of a first lateral face of the light emitting element and a portion of a second lateral face of the light emitting element are covered by the liquid resin material, and (iii) a first corner of the light emitting element is exposed from the liquid resin material, and curing the liquid resin material; and forming a covering member.

公开(公告)号：US20150340546A1

公开(公告)日：2015-11-26

申请号：US14716451

申请日：2015-05-19

Applicant: NICHIA CORPORATION

Inventor： Ryo SUZUKI ,  Yoshikazu TAKEUCHI ,  Hirokazu SASA

IPC: H01L33/00

CPC classification number: H01L33/641 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/28 ,  H01L33/32 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A method for manufacturing a light emitting device has: preparing a base body which comprises a pair of connection terminals; preparing a light emitting element which includes a substrate, a semiconductor laminate that is laminated on the substrate, and a pair of electrodes formed on the surface of the semiconductor laminate; joining the electrodes of the light emitting element to the connection terminals of the base body; covering the light emitting element with a sealing member; and removing at least a part of the sealing member and a part of the substrate of the light emitting element from the opposite side from the base body so that an upper surface of the sealing member is lower than an upper surface of the substrate of the light emitting element.

Abstract translation: 一种制造发光器件的方法具有：准备包括一对连接端子的基体; 制备包括基板的发光元件，层叠在基板上的半导体层叠体和形成在半导体层叠体的表面上的一对电极; 将发光元件的电极连接到基体的连接端子; 用密封构件覆盖发光元件; 以及从所述基体的相反侧除去所述密封构件的至少一部分和所述发光元件的所述基板的一部分，使得所述密封构件的上表面比所述光的基板的上表面低 发光元件。

公开(公告)号：US20150021641A1

公开(公告)日：2015-01-22

申请号：US14333748

申请日：2014-07-17

Applicant: NICHIA CORPORATION

Inventor： Ryo SUZUKI

IPC: H01L33/50

CPC classification number: H01L33/502 ,  H01L33/007 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A light emitting device includes a substrate member, a light emitting element, a resin member, an insulating layer and a fluorescent material layer. The light emitting element is arranged on the substrate member. The resin member surrounds sides of the light emitting element, and has a top portion located higher than a light emission surface of the light emitting element. The insulating layer covers the light emission surface of the light emitting element and an outer wall surface and an inner wall surface of the top portion of the resin member. The fluorescent material layer covers a surface of the insulating layer.

Abstract translation: 发光器件包括衬底构件，发光元件，树脂构件，绝缘层和荧光材料层。 发光元件设置在基板构件上。 树脂构件围绕发光元件的侧面，并且具有位于比发光元件的发光表面高的顶部。 绝缘层覆盖发光元件的发光面以及树脂构件的顶部的外壁面和内壁面。 荧光材料层覆盖绝缘层的表面。

公开(公告)号：US20130163244A1

公开(公告)日：2013-06-27

申请号：US13726483

申请日：2012-12-24

Applicant: NICHIA CORPORATION

Inventor： Ryo SUZUKI

IPC: F21V21/00 ,  F21V7/00 ,  F21V9/16

CPC classification number: H01L25/0753 ,  F21V7/00 ,  F21V9/30 ,  F21V21/00 ,  H01L33/0079 ,  H01L33/62 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2933/0066 ,  Y10T29/49117

Abstract: A method of manufacturing a light emitting device includes: disposing a group of electrically conductive members on a support substrate, the group of the electrically conductive members forming a plurality of mounting portions arranged in two or more columns and two or more rows with the mounting portions respectively corresponding to a plurality of light emitting elements; placing the light emitting elements on the group of the electrically conductive members with a bonding member being disposed between the light emitting elements and the electrically conductive members, each of the light emitting elements being shifted from a corresponding one of the mounting portions; and melting the bonding member to mount the light emitting elements respectively on the mounting portions by self-alignment effect generated by the melting of the bonding member.

Abstract translation: 一种制造发光器件的方法包括：在支撑衬底上设置一组导电构件，所述导电构件组形成多个安装部分，所述多个安装部分布置成两列或更多列，并具有安装部分 分别对应于多个发光元件; 将发光元件放置在导电构件的组上，其中接合构件设置在发光元件和导电构件之间，每个发光元件从相应的一个安装部分移位; 并且通过熔接接合部件而产生的自对准效应，使接合部件熔融，从而将发光元件分别安装在安装部上。