摘要:
A semiconductor memory device includes: a memory cell configured with two transistors and one capacitor; two word drivers for controlling two word lines alternately, the two word lines controlling reading/writing with respect to the memory cell; two address latch circuits for latching a first address signal to select one of the word drivers, the two address latch circuits being respectively provided upstream from the two word drivers; and an address decoder for decoding a second address signal to generate the first address signal. In this device, the address decoder supplies the first address signal in common to both of the two address latch circuits.
摘要:
A port A of the path including a first transistor of a memory cell to be accessed, a first bit line pair, a first column selection switch and a data line pair interleaves with a port B of the path including a second transistor of the memory cell to be accessed, a second bit line pair, a second column selection switch and the data line pair in two cycles of a clock. A read amplifier amplifies data transferred from a bit line pair to the data line pair and outputs the resultant data to an input/output buffer in one cycle of the clock. The input/output buffer outputs the data received from the read amplifier to the outside in one cycle of the clock.
摘要:
A semiconductor memory device includes a memory cell array block including a plurality of memory cells each including a data holding circuit configured to store data using a first and a second circuit elements and a transistor configured to connect the data holding circuit and a bit line together, sense amplifiers connected to bit lines directly or via switches, and a dummy memory cell array including a plurality of dummy memory cells each having the same circuit configuration as that of the memory cell with respect to the element size and the layout configuration. The plurality of dummy memory cells each include at least one inverter circuit configuration, and are connected together by the inverter circuits being connected together in series. An output signal of the inverter circuit of one in the final stage of the dummy memory cells is an activation signal for the sense amplifiers.
摘要:
A technique is provided for achieving reduction in size of an electronic device with a power amplifier circuit, while enhancing the performance of the electronic device. An RF power module for a mobile communication device includes first and second semiconductor chips, a passive component, and first and second integrated passive components, which are mounted over a wiring board. In the first semiconductor chip, MISFET elements constituting power amplifier circuits for the GSM 900 and for the DCS 1800 are formed, and a control circuit is also formed. In the first integrated passive component, a low pass filter circuit for the GSM 900 is formed, and in the second integrated passive component, a low pass filter circuit for the DCS 1800 is formed. In the second semiconductor chip, antenna switch circuits for the GSM 900 and DCS 1800 are formed. Over the upper surface of the wiring board, the second semiconductor chip is disposed next to the first semiconductor chip between the integrated passive components.
摘要:
A semiconductor memory device includes a first inverter and a second inverter each having an input and an output, the output of each of the first and second inverters being connected to the input of the other so that data is stored, a CMOS switch configured to connect the input of the first inverter and a write bit line, a read MOS transistor having a gate connected to the output of the first inverter, and a MOS switch configured to connect the read MOS transistor to a read bit line. The first and second inverters have different sizes and are connected to different source power supplies.
摘要:
A semiconductor integrated circuit including on a single chip a plurality of circuit blocks and a plurality of internal power supply circuits for delivering a common supply voltage to the plurality of circuit blocks includes: a shared power supply interconnection for connecting the plurality of circuit blocks and the plurality of internal power supply circuits; and an external pad connected to the shared power supply interconnection. Whether or not each of the internal power supply circuits delivers the supply voltage is controlled by a certain power supply control signal.
摘要:
A port A of the path including a first transistor of a memory cell to be accessed, a first bit line pair, a first column selection switch and a data line pair interleaves with a port B of the path including a second transistor of the memory cell to be accessed, a second bit line pair, a second column selection switch and the data line pair in two cycles of a clock. A read amplifier amplifies data transferred from a bit line pair to the data line pair and outputs the resultant data to an input/output buffer in one cycle of the clock. The input/output buffer outputs the data received from the read amplifier to the outside in one cycle of the clock.
摘要:
In recent system LSIs, a plurality of RAMs differing in capacity and in bit width have come to be mounted on a single chip according to the needs on the system side. However, when testing the plurality of RAMs, if the RAMs differ in capacity, they cannot be tested using the same test pattern (for example, HALF-MARCH) even if a special pin is provided for each RAM, because X, Y address mapping differs between the different RAMs; accordingly, the test has to be performed by dividing the RAMs into groups each consisting of RAMs having the same memory space, and this has lead to increased test time. An external address signal and a test-only address signal are provided as RAM control signals and, in the latter case, the number of X, Y addresses in each of the RAMs 4 and 5 is set equal to that of the largest capacity RAM 3 within the same chip, thereby making the X, Y address mapping the same for all the RAMs 3 to 5.
摘要:
An apparatus and method for producing a filament harness which comprises feeding a plurality of strands in a downstream direction onto a support which receives the strands. There is a head which contacts the strands and a control means for causing relative motion between the support and the head to form the plurality of wires into a predetermined, desired pattern. In addition, the product produced by the method is also disclosed.
摘要:
A semiconductor integrated circuit including on a single chip a plurality of circuit blocks and a plurality of internal power supply circuits for delivering a common supply voltage to the plurality of circuit blocks includes: a shared power supply interconnection for connecting the plurality of circuit blocks and the plurality of internal power supply circuits; and an external pad connected to the shared power supply interconnection. Whether or not each of the internal power supply circuits delivers the supply voltage is controlled by a certain power supply control signal.