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11.发明授权公开(公告)号：US11234329B2
公开(公告)日：2022-01-25
申请号：US16954020
申请日：2018-12-04
Inventor： Rihoko Watanabe , Keiko Kashihara , Hiroharu Inoue
Abstract: A prepreg is used to fabricate a semiconductor package including a chip and a substrate to mount the chip thereon. The prepreg is in a semi-cured state. The substrate includes a cured product of the prepreg. The chip has: a first chip surface located opposite from the substrate; and a second chip surface located opposite from the first chip surface. The prepreg satisfies the relational expression: 0.9≤X2/X1≤1.0 (I), where X1 is a coefficient of thermal expansion of the first chip surface of the chip before the chip is mounted on the substrate, and X2 is a coefficient of thermal expansion of the first chip surface of the chip after the chip has been mounted on the substrate.
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12.发明授权公开(公告)号：US11066548B2
公开(公告)日：2021-07-20
申请号：US16880593
申请日：2020-05-21
Inventor： Hiroaki Umehara , Hiroharu Inoue
IPC: C08L51/08 , C08J5/24 , B32B15/08 , C08L71/12 , C08L101/12 , C08F222/10 , C08L33/04 , H05K1/03 , C08L71/00 , C08F2/44 , C08G65/48 , C08F290/06 , H05K1/02
Abstract: A polyphenylene ether resin composition includes a modified polyphenylene ether copolymer, a high-molecular-weight compound, and a crosslinking agent for the modified polyphenylene ether copolymer. The modified polyphenylene ether copolymer includes a substituent having a carbon-carbon unsaturated double bond at a molecular chain end of the modified polyphenylene ether copolymer. The high-molecular-weight compound has a glass transition temperature (Tg) measured by differential scanning calorimetry of 20° C. or lower and has a number-average molecular weight Mn ranging from 1000 to 10000, inclusive. The crosslinking agent includes at least two carbon-carbon unsaturated double bonds per molecule, and includes at least one of dicyclopentadiene acrylate and dicyclopentadiene methacrylate. In a cured state of the polyphenylene ether resin composition, the modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound.
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Patent Agency Ranking
公开(公告)号：US09795030B2
公开(公告)日：2017-10-17
申请号：US15468333
申请日：2017-03-24
Inventor： Hiroharu Inoue , Koji Kishino
CPC classification number: H05K1/036 , B32B5/022 , B32B5/024 , B32B7/02 , B32B15/12 , B32B15/14 , B32B2255/06 , B32B2255/26 , B32B2260/021 , B32B2260/028 , B32B2260/046 , B32B2262/0269 , B32B2262/0276 , B32B2262/10 , B32B2307/30 , B32B2307/306 , B32B2457/08 , H05K1/00 , H05K3/022 , H05K3/025 , H05K2201/0212 , H05K2201/0275 , H05K2201/029 , H05K2201/068 , Y10T428/24942
Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.
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公开(公告)号：US12275846B2
公开(公告)日：2025-04-15
申请号：US18012176
申请日：2021-06-14
Inventor： Jun Yasumoto , Rihoko Watanabe , Teppei Washio , Hiroharu Inoue
Abstract: A resin composition contains a curable resin. A minimum value (Min) of loss tangent (tan δ=E″/E′) of a cured product of the resin composition is equal to or greater than 0.04. The loss tangent is a ratio of a loss modulus (E″) of the cured product of the resin composition to a storage modulus (E′) thereof. The loss modulus (E″), the storage modulus (E′), and the loss tangent (tan δ=E″/E′) are obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.
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公开(公告)号：US10543661B2
公开(公告)日：2020-01-28
申请号：US15753571
申请日：2016-09-02
Inventor： Akihiro Yamauchi , Yoshiaki Esaki , Takayoshi Ozeki , Hiroaki Umehara , Hiroharu Inoue , Yoshihiko Nakamura
Abstract: A metal foil with resin is a metal foil with resin including a metal foil and a resin layer disposed on the metal foil, resin layer being obtained by half-curing a resin composition. The resin composition contains a first component that is a polymer, a second component that is a polyarylene ether copolymer, and a third component that is an epoxy resin. The first component has structures represented by formulae (1) and (2) below, with no unsaturated bond between carbon atoms. The third component has two or more epoxy groups per molecule. The second component is compatible with the first component, and the third component is incompatible with the first component.In the formulae (1) and (2), a ratio between x and y is x:y=0:1 to 0.35:0.65, R1 represents hydrogen atom or methyl group, and R2 represents hydrogen atom or an alkyl group.
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公开(公告)号：US10371612B2
公开(公告)日：2019-08-06
申请号：US15757002
申请日：2016-09-09
Inventor： Keiko Kashihara , Hiroharu Inoue , Shingo Yoshioka , Takashi Hoshi
IPC: B32B5/28 , C08J5/24 , G01N3/18 , H05K1/02 , H05K1/03 , H05K3/06 , B32B15/08 , B32B37/10 , B32B38/00
Abstract: A prepreg includes a resin layer constituted by a half-cured product of a thermosetting resin composition, and a fibrous substrate provided in the resin layer. A prepreg test piece that is a cured product obtained by heat curing the thermosetting resin composition has a maximum value of 400 kPa or less for thermal shrinkage stress measured by a predetermined thermal stress test.
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17.发明授权Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board 有权树脂组合物，树脂清漆，预浸料，金属包覆层压板和印刷线路板公开(公告)号：US09585248B2
公开(公告)日：2017-02-28
申请号：US14988085
申请日：2016-01-05
Inventor： Hiroharu Inoue , Shingo Yoshioka
IPC: B32B15/08 , B32B15/09 , B32B15/092 , B32B15/098 , B32B27/04 , C09J163/00 , H05K1/03 , C08L63/00 , C08J5/24 , C08L79/08 , C09D163/00 , C09D179/08 , C08G59/24 , C08G59/62
CPC classification number: H05K1/0373 , B32B2311/00 , B32B2457/08 , C08G59/245 , C08G59/621 , C08J5/24 , C08J2363/00 , C08J2379/08 , C08J2433/00 , C08L63/00 , C08L79/08 , C08L2203/20 , C08L2205/03 , C09D163/00 , C09D179/08 , H05K1/0346 , H05K1/0353 , H05K1/0366 , H05K2201/0162 , H05K2201/09136 , Y10T156/10 , Y10T428/31529 , C08L33/08
Abstract: A resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.
Abstract translation: 通过以999μm/分钟拉伸，当应变量从0％增加到0.3％时，成为表现出力响应性能使得由拉伸应力 - 应变曲线f1（x）包围的面积的固化产物的树脂组合物 而当x轴上的应变量和y轴上的拉伸应力也被x轴包围时，大于应变应变曲线f2（x）所包围的面积，当应变量减小时 0.3％，并且在施加拉伸应力之前和之后，由x轴包围，拉伸应力为0时的应变量的变化量为0.05％以下。
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