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公开(公告)号：US10225635B2
公开(公告)日：2019-03-05
申请号：US15143207
申请日：2016-04-29
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS (MALTA) LTD
Inventor： Roberto Brioschi , Alex Gritti , Kevin Formosa , Paul Anthony Barbara
Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
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公开(公告)号：US10189703B2
公开(公告)日：2019-01-29
申请号：US15362556
申请日：2016-11-28
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Marco Omar Ghidoni , Roberto Brioschi
Abstract: A transducer module, comprising: a supporting substrate, having a first side and a second side; a cap, which extends over the first side of the supporting substrate and defines therewith a first chamber and a second chamber internally isolated from one another; a first transducer in the first chamber; a second transducer in the second chamber; and a control chip, which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.
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公开(公告)号：US09769554B2
公开(公告)日：2017-09-19
申请号：US14943848
申请日：2015-11-17
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS (MALTA) LTD
Inventor： Roberto Brioschi , Silvia Adorno , Kenneth Fonk
CPC classification number: H04R1/086 , B81B7/0058 , B81B7/0061 , B81B2201/0257 , B81B2203/0127 , B81B2207/012 , B81B2207/07 , B81C1/00309 , B81C2203/0785 , H01L2224/48137 , H01L2224/48227 , H04R19/005 , H04R19/04 , H04R31/00 , H04R31/006
Abstract: A semiconductor integrated device, comprising: a package defining an internal space and having an acoustic-access opening in acoustic communication with an environment external to the package; a MEMS acoustic transducer, housed in the internal space and provided with an acoustic chamber facing the acoustic-access opening; and a filtering module, which is designed to inhibit passage of contaminating particles having dimensions larger than a filtering dimension and is set between the MEMS acoustic transducer and the acoustic-access opening. The filtering module defines at least one direct acoustic path between the acoustic-access opening and the acoustic chamber.
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14.发明申请公开(公告)号：US20160236471A1
公开(公告)日：2016-08-18
申请号：US15138997
申请日：2016-04-26
Applicant: STMicroelectronics, Inc. , STMicroelectronics S.r.l. , STMicroelectronics Asia Pacific Pte Ltd
Inventor： Simon Dodd , Joe Scheffelin , Dana Gruenbacher , Roberto Brioschi , Teck Khim Neo , Dave Hunt , Faiz Sherman
CPC classification number: B41J2/1623 , B05B1/14 , B05B11/0054 , B05B15/40 , B41J2/14024 , B41J2/14145 , B41J2/1433 , B41J2/162 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/97 , H01L41/1132 , H01L2224/2732 , H01L2224/29011 , H01L2224/29013 , H01L2224/2919 , H01L2224/32225 , H01L2224/48096 , H01L2224/48097 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/838 , H01L2224/83862 , H01L2224/83874 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/19106 , H05K1/0272 , H05K1/09 , H05K1/181 , H05K3/305 , H05K2201/10083 , H05K2201/10515 , H05K2201/10545 , Y02P70/613 , Y10T156/1089 , H01L2224/83 , H01L2224/85 , H01L2224/45099 , H01L2924/00
Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instance, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.
Abstract translation: 实施例涉及微流体补充盒及其组装方法。 微流体补充盒包括微流体递送构件，其包括用于过滤通过其中的流体的过滤器。 过滤器可以被配置为阻挡高于阈值尺寸的颗粒以防止喷嘴中的堵塞。 例如，具有大于喷嘴直径的尺寸的颗粒可以阻挡或减少通过喷嘴的流体流动。
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公开(公告)号：US11851319B2
公开(公告)日：2023-12-26
申请号：US16560518
申请日：2019-09-04
Applicant: STMicroelectronics S.r.l.
Inventor： Anna Angela Pomarico , Giuditta Roselli , Daniele Caltabiano , Roberto Brioschi , Mohammad Abbasi Gavarti
CPC classification number: B81B3/0072 , B60T1/065 , B60T8/17 , B60T8/171 , G01L1/18 , G01L3/00 , G01L9/06 , B81B2201/0264 , B81B2201/0292 , B81B2203/0127 , B81B2203/0315
Abstract: A device includes: a micromechanical sensing structure configured to provide an electrical detection quantity as a function of a load; and a package enclosing the micromechanical sensing structure and providing a mechanical and electrical interface with respect to an external environment. The package includes a housing structure defining a cavity housing the micromechanical sensing structure; and a package coating that coats, at least in part, the housing structure, the package coating including a mechanical interface configured to transfer, in a uniform manner, the load on the housing structure and on the micromechanical sensing structure, wherein the housing structure includes a deformable layer interposed and in contact between the micromechanical sensing structure and the package coating, and wherein the deformable layer defines a mechanical-coupling interface.
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Patent Agency Ranking
公开(公告)号：US10597287B2
公开(公告)日：2020-03-24
申请号：US16233682
申请日：2018-12-27
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Marco Omar Ghidoni , Roberto Brioschi
Abstract: A transducer module, comprising: a supporting substrate, having a first side and a second side; a cap, which extends over the first side of the supporting substrate and defines therewith a first chamber and a second chamber internally isolated from one another; a first transducer in the first chamber; a second transducer in the second chamber; and a control chip, which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.
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公开(公告)号：US10531204B2
公开(公告)日：2020-01-07
申请号：US16137439
申请日：2018-09-20
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Roberto Brioschi , Marco Omar Ghidoni
IPC: B06B1/02 , B81B7/02 , B81B7/04 , B81C1/00 , H04R1/44 , H04R3/00 , H04R7/06 , H04R19/00 , H04R19/04 , H04R31/00
Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.
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18.发明申请公开(公告)号：US20190028815A1
公开(公告)日：2019-01-24
申请号：US16137439
申请日：2018-09-20
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Roberto Brioschi , Marco Omar Ghidoni
IPC: H04R19/04 , H04R7/06 , H04R31/00 , H04R19/00 , H04R3/00 , B81C1/00 , B06B1/02 , H04R1/44 , B81B7/04
CPC classification number: H04R19/04 , B06B1/0292 , B81B7/02 , B81B7/04 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/0292 , B81B2201/047 , B81B2207/012 , B81B2207/07 , B81C1/0023 , B81C2203/0792 , H01L2224/48091 , H01L2224/48137 , H01L2924/15151 , H04R1/44 , H04R3/005 , H04R7/06 , H04R19/005 , H04R31/003 , H04R31/006 , H04R2201/003 , H04R2499/11 , H01L2924/00014
Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.
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公开(公告)号：US10159150B2
公开(公告)日：2018-12-18
申请号：US15253615
申请日：2016-08-31
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS S.R.L.
Inventor： Simon Dodd , Roberto Brioschi
Abstract: The present disclosure is directed to a ceramic substrate that includes a plurality of contact pads, a plurality of electrical traces, and a microelectromechanical die. Contacts on the die are coupled to the plurality of contact pads through the plurality of electrical traces. The substrate also includes a plurality of memory bits formed directly on the substrate. Each memory bit is coupled between a first one of the contact pads and a second one of the contact pads.
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公开(公告)号：US10091587B2
公开(公告)日：2018-10-02
申请号：US15377627
申请日：2016-12-13
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Roberto Brioschi , Marco Omar Ghidoni
IPC: H04R25/00 , H04R19/04 , B06B1/02 , B81C1/00 , H04R3/00 , H04R19/00 , B81B7/04 , H04R1/44 , H04R7/06 , H04R31/00
Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.
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