公开(公告)号：US20180277735A1

公开(公告)日：2018-09-27

申请号：US15824194

申请日：2017-11-28

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Dae Hun JEONG ,  Sang Uk SON ,  Tae Yoon KIM ,  Dae Ho KIM

IPC: H01L41/047 ,  H01L41/22

CPC classification number: H01L41/047 ,  H01L41/187 ,  H01L41/22 ,  H03H3/02 ,  H03H9/02118 ,  H03H9/174 ,  H03H9/54 ,  H03H2003/023

Abstract: An acoustic resonator includes a resonant portion including a piezoelectric layer disposed between a first electrode and a second electrode, and a frame portion disposed along an outer edge of the second electrode. The frame portion includes three reflective portions reflecting lateral waves generated in the resonant portion.

公开(公告)号：US20180254764A1

公开(公告)日：2018-09-06

申请号：US15797265

申请日：2017-10-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Kyung LEE ,  Won HAN ,  Tae Yoon KIM ,  Jong Woon KIM ,  Moon Chul LEE ,  Chang Hyun LIM ,  Sang Kee YOON ,  Hwa Sun LEE ,  Dae Hun JEONG

IPC: H03H9/17 ,  H03H9/05 ,  H03H3/02

CPC classification number: H03H9/174 ,  H03H3/02 ,  H03H9/02118 ,  H03H9/0504 ,  H03H9/173 ,  H03H9/547 ,  H03H2003/021 ,  H03H2003/023

Abstract: An acoustic resonator includes: a central portion; an extension portion extended outwardly of the central portion; a first electrode, a piezoelectric layer, and a second electrode sequentially stacked on a substrate, in the central portion; and an insertion layer disposed below the piezoelectric layer in the extension portion, wherein the piezoelectric layer includes a piezoelectric portion disposed in the central portion, and a bent portion disposed in the extension portion and extended from the piezoelectric portion at an incline depending on a shape of the insertion layer.

公开(公告)号：US20180062608A1

公开(公告)日：2018-03-01

申请号：US15647660

申请日：2017-07-12

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Kyung LEE ,  Tae Yoon KIM ,  Dae Ho KIM ,  Chang Hyun LIM ,  Tae Hun LEE ,  Sang Kee YOON ,  Jong Woon KIM ,  Won HAN ,  Moon Chul LEE

IPC: H03H9/02 ,  H03H9/54 ,  H01L41/047 ,  H03H9/56

CPC classification number: H03H9/02015 ,  H01L41/047 ,  H03H3/02 ,  H03H9/02062 ,  H03H9/02118 ,  H03H9/02157 ,  H03H9/173 ,  H03H9/542 ,  H03H9/545 ,  H03H9/547 ,  H03H9/562 ,  H03H9/568 ,  H03H9/605 ,  H03H2003/021

Abstract: A bulk acoustic resonator includes: a substrate including an upper surface on which a substrate protection layer is disposed; and a membrane layer forming a cavity together with the substrate, wherein a thickness deviation of either one or both of the substrate protection layer and the membrane layer is 170 Å or less.

公开(公告)号：US20180054182A1

公开(公告)日：2018-02-22

申请号：US15635551

申请日：2017-06-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Yoon KIM ,  Tae Kyung LEE ,  Sung Min CHO ,  Sang Kee YOON ,  Moon Chul LEE

IPC: H03H9/17 ,  H03H9/02

CPC classification number: H03H9/173 ,  H03H9/02133 ,  H03H9/174

Abstract: A bulk acoustic wave resonator includes: a support part disposed on a substrate; a layer disposed on the support part, wherein an air cavity is formed between the support part, the substrate and the layer; and a frame extending along the layer, within the air cavity, and spaced apart from the support part.

公开(公告)号：US20170174503A1

公开(公告)日：2017-06-22

申请号：US15091057

申请日：2016-04-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Moon Chul LEE ,  Duck Hwan KIM ,  Yeong Gyu LEE ,  Jae Chang LEE ,  Tae Yoon KIM ,  Kyong Bok MIN

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B2201/0271 ,  B81B2203/0315 ,  B81C1/00269 ,  B81C2203/0118 ,  H01L21/561 ,  H01L23/10 ,  H01L23/3114

Abstract: A wafer level package includes a wafer member having inner cavities in which circuit elements are disposed, element wall members disposed on an internal surface of the wafer member and enclosing element sections in which the circuit elements are disposed, and clearance wall members disposed on external surfaces of the element wall members and dividing a space between the element sections into clearance sections.

公开(公告)号：US20160214854A1

公开(公告)日：2016-07-28

申请号：US15003099

申请日：2016-01-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Woon KIM ,  Tae Yoon KIM ,  Dae Hun JEONG

IPC: B81B3/00

CPC classification number: B81B3/0051 ,  B81B2201/0235 ,  B81B2203/053 ,  B81B2203/058

Abstract: A microelectromechanical systems (MEMS) sensor includes a first layer on which a first displacement limiting part and a second displacement limiting part are formed; a third layer on which a mass body part and a support part are formed; and a second layer connecting the first layer and the third layer to each other, wherein at least a portion of the first displacement limiting part is directly opposed to the mass body part, and at least a portion of the second displacement limiting part is directly opposed to the support part.

Abstract translation: 微机电系统（MEMS）传感器包括：第一层，其上形成有第一位移限制部分和第二位移限制部分; 第三层，其上形成有质量体部分和支撑部分; 以及将第一层和第三层彼此连接的第二层，其中第一位移限制部的至少一部分与质量体部直接相对，并且第二位移限制部的至少一部分直接相对 到支撑部分。

公开(公告)号：US20140152980A1

公开(公告)日：2014-06-05

申请号：US13772491

申请日：2013-02-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Gyu Seok KIM ,  Hee Suk CHUNG ,  Suk Jin HAM ,  Dong Yong KIM ,  Yong Choon PARK ,  Mi Yang KIM ,  Tae Yoon KIM

IPC: G01N1/28

CPC classification number: G01N1/28 ,  G01M99/002 ,  G01N3/60 ,  G01N2203/0023 ,  G01N2203/0282 ,  G01N2203/0647

Abstract: There are provided an inspection device for substrate deformation at high temperatures and an inspection method for substrate deformation at high temperatures, the inspection device for substrate deformation at high temperatures, including a crucible including an internal space, an inspection hole disposed in an upper portion thereof so as to inspect the internal space, and a heating unit heating the internal space, an indenter tip disposed in the crucible such that a substrate fixed to the internal space is warped, and an inspection unit disposed above the crucible so as to inspect a cross-section of the substrate.

Abstract translation: 在高温下设置基板变形检查装置和高温基板变形检查方法，高温基板变形检查装置，包括内部空间的坩埚，设置在其上部的检查孔 检查内部空间，加热单元加热内部空间，设置在坩埚中的压头，使得固定在内部空间的基板翘曲;以及检查单元，其设置在坩埚上方，以检查十字 切片的底物。

公开(公告)号：US20230216470A1

公开(公告)日：2023-07-06

申请号：US17824145

申请日：2022-05-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Won HAN ,  Hwa Sun LEE ,  Jeong Hoon RYOU ,  Moon Chul LEE ,  Tae Yoon KIM ,  Sang Kee YOON ,  Yong Suk KIM ,  Joung Hun KIM ,  Sung Jun LEE ,  Sung Joon PARK

IPC: H03H9/02 ,  H03H9/17

CPC classification number: H03H9/0211 ,  H03H9/173 ,  H03H9/02102

Abstract: A bulk acoustic wave resonator includes a substrate; a central portion including a first portion of a first electrode, a first portion of a piezoelectric layer, and a first portion of a second electrode laminated in order on the substrate; and a reflective region disposed laterally of the central portion and including a second portion of the first electrode, an insertion layer, a second portion of the piezoelectric layer, and a second portion of the second electrode. A side surface of the insertion layer adjacent to the central portion has an inclined surface, the first portion of the second electrode and the second portion of the second electrode are coplanar, and an end of the second electrode overlaps the inclined surface of the insertion layer in the reflective region.

公开(公告)号：US20230084640A1

公开(公告)日：2023-03-16

申请号：US17684732

申请日：2022-03-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Nam Jung LEE ,  Tae Yoon KIM

IPC: H03H9/10 ,  H03H9/17 ,  H03H3/02

Abstract: An acoustic resonator package includes a substrate, a cap including a protrusion portion protruding toward the substrate, an acoustic resonator disposed between the substrate and the cap and including a first electrode, a piezoelectric layer, and a second electrode, a metal layer connected to one of the first electrode and the second electrode, and a conductive pad at least partially disposed between the protrusion portion and the metal layer and extending in a first direction different from a second direction in which the acoustic resonator faces the conductive pad.

公开(公告)号：US20200373900A1

公开(公告)日：2020-11-26

申请号：US16992434

申请日：2020-08-13

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Kyung LEE ,  Tae Yoon KIM ,  Sang Kee YOON ,  Chang Hyun LIM ,  Jong Woon KIM ,  Moon Chul LEE

IPC: H03H9/02 ,  H03H9/54 ,  H03H9/17 ,  H03H9/13 ,  H01L41/053 ,  H01L41/29 ,  H01L41/31 ,  H03H3/02

Abstract: An acoustic wave resonator includes a resonating part disposed on and spaced apart from a substrate by a cavity, the resonating part including a membrane layer, a first electrode, a piezoelectric layer, and a second electrode that are sequentially stacked. 0 Å≤ΔMg≤170 Å may be satisfied, ΔMg being a difference between a maximum thickness and a minimum thickness of the membrane layer disposed in the cavity.