公开(公告)号：US20190004423A1

公开(公告)日：2019-01-03

申请号：US16063893

申请日：2017-01-10

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yu SHOJI ,  Yuki MASUDA ,  Kimio ISOBE ,  Ryoji OKUDA

IPC: G03F7/023 ,  G03F7/022 ,  G03F7/40 ,  C08G73/22

Abstract: Provided is a cured film having high chemical resistance, high elongation, and high adhesion to metal copper. A cured film formed by curing a photosensitive resin composition containing a polybenzoxazole precursor, in which a rate at which the polybenzoxazole precursor is cyclized into polybenzoxazole is not less than 10% and not more than 60%.

公开(公告)号：US20180203353A1

公开(公告)日：2018-07-19

申请号：US15744676

申请日：2016-09-20

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yu SHOJI ,  Yuki MASUDA ,  Kimio ISOBE ,  Ryoji OKUDA

IPC: G03F7/038 ,  C08G69/02 ,  C08G69/40 ,  G03F7/16 ,  G03F7/20 ,  G03F7/26 ,  G03F7/40 ,  H01L23/00

CPC classification number: G03F7/0387 ,  C08G69/02 ,  C08G69/40 ,  G03F7/0226 ,  G03F7/023 ,  G03F7/0233 ,  G03F7/16 ,  G03F7/161 ,  G03F7/168 ,  G03F7/20 ,  G03F7/26 ,  G03F7/40 ,  H01L23/293 ,  H01L23/3192 ,  H01L23/562 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02331 ,  H01L2224/024 ,  H01L2224/03462 ,  H01L2224/03515 ,  H01L2224/0362 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2924/0695 ,  H01L2924/3511 ,  H01L2924/014

Abstract: Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.

公开(公告)号：US20180051136A1

公开(公告)日：2018-02-22

申请号：US15555173

申请日：2016-02-29

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yutaro KOYAMA ,  Ryoji OKUDA ,  Yuki MASUDA ,  Tomohiro KITAMURA ,  Yu SHOJI

IPC: C08G73/10 ,  G03F7/039 ,  G03F7/004 ,  G03F7/031 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  G03F7/022 ,  H01L23/00

CPC classification number: C08G73/1039 ,  C08G73/10 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/022 ,  G03F7/0226 ,  G03F7/0233 ,  G03F7/0236 ,  G03F7/031 ,  G03F7/039 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/322 ,  G03F7/40 ,  H01L23/293 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/02331 ,  H01L2224/02379 ,  H01L2224/024 ,  H01L2224/0362 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/12105 ,  H01L2924/07025 ,  H01L2924/3511

Abstract: Provided is a resin which has high elongation, low stress, high sensitivity and high film retention ratio if used in a photosensitive resin composition. A photosensitive resin composition that contains a resin which has a structure represented by general formula (1) and/or general formula (2), and which is characterized in that (a) 10-80% by mole of an organic group having an alicyclic structure and 4-40 carbon atoms is contained as the R1 moiety of general formulae (1) and (2), and (b) 10-80% by mole of an organic group having a polyether structure with 20-100 carbon atoms is contained as the R2 moiety of general formulae (1) and (2). (In general formulae (1) and (2), R1 represents a tetravalent organic group having a monocyclic or condensed polycyclic alicyclic structure and 4-40 carbon atoms; R2 represents a divalent organic group having a polyether structure with 20-100 carbon atoms; R3 represents a hydrogen atom or an organic group having 1-20 carbon atoms; each of n1 and n2 represents a number within the range of 10-100,000; and p and q represents integers satisfying 0≦p+q≦6.)

公开(公告)号：US20240038819A1

公开(公告)日：2024-02-01

申请号：US18028664

申请日：2021-10-05

Applicant: TORAY INDUSTRIES, INC.

Inventor： Keika HASHIMOTO ,  Yuki MASUDA ,  Takuma NISHIMURA

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/56 ,  H01L33/60

CPC classification number: H01L27/156 ,  H01L33/62 ,  H01L33/56 ,  H01L33/60 ,  H01L2933/005 ,  H01L2933/0066

Abstract: Problems have been presented in terms of the step flatness of cured films used, inter alia, as wiring-insulating insulation films or protective films formed so as to cover metal wirings or light-emitting elements such as LEDs. The present invention overcomes problems relating to the incidence of wiring defects such as short-circuiting and defects associated with light-emitting element connection, and problems relating to the light-emission fault rate when this display device has been produced. The present invention is a display device having at least a metal wiring, a cured film, and a plurality of light-emitting elements, wherein a pair of electrode terminals are provided on one surface of each of the light-emitting elements. The pair of electrode terminals are connected to a plurality of the metal wirings extending in the cured film. The metal wirings are configured so that electrical insulation properties are maintained by the cured film. The metal wirings have a plurality of metal wirings (K1) extending in the thickness direction of the cured film, and a plurality of metal wirings (K2) that are connected to the metal wiring (K1) and that extend in a planar direction perpendicular to the thickness direction of the cured film. The cured film is obtained by curing a resin composition containing resin (A) and has a cured film that is in contact with some of the surfaces of the metal wirings (K2). The display device has at least a region (G) in which the line spacing H1 between two of the metal wirings (K2) that are adjacent to one another is 1-20 μm. In the region (G), the ratio H3/H2 is 1.4-4.0, and the step flattening rate P (%) expressed by (Formula 1) is 70-99%, where H2 (μm) is the thickness of the metal wirings (K2), H3 (μm) is the thickness of the cured film, and H4 (μm) is the depth of a step in the cured film that was formed in the region (G). (Formula 1) P (%)=(1−(H4/H2))×100

公开(公告)号：US20210047470A1

公开(公告)日：2021-02-18

申请号：US16969315

申请日：2019-03-15

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yutaro KOYAMA ,  Yuki MASUDA ,  Masao TOMIKAWA

IPC: C08G73/10 ,  G03F7/038 ,  H01L23/31 ,  H01L23/498

Abstract: The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein X1 represents a divalent organic group having 2 to 100 carbon atoms, Y1 and Y2 each represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, X2 represents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and n1 and n2 each represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as X1 of the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of X1 and X2, and (II) an organic group having a diphenyl ether structure is contained as Y1 of the general formula (1) at a content of 1 to 30 mol % based on 100 mol % of a total of Y1 and Y2.

公开(公告)号：US20180342386A1

公开(公告)日：2018-11-29

申请号：US15559632

申请日：2016-02-29

Applicant: TORAY INDUSTRIES, INC.

Inventor： Hiroyuki ONISHI ,  Yuki MASUDA

IPC: H01L21/027 ,  C08G59/14

Abstract: A photosensitive resin composition which contains a compound represented by general formula (1). (In general formula (1), R1-R4 may be the same or different, and each represents a hydrogen atom or an organic group having 1-4 carbon atoms; and X represents a tetravalent organic group having two or more structural units represented by general formula (2) in the main chain.) (In general formula (2), R5 represents a hydrogen atom or an alkyl group having 1-20 carbon atoms, and a plurality of R5s in the same molecule may be the same or different.) Provided is a photosensitive resin composition which enables the achievement of a cured film having low stress after being heated and fired, and which has excellent long-term stability, high sensitivity and high resolution.

公开(公告)号：US20180066107A1

公开(公告)日：2018-03-08

申请号：US15557623

申请日：2016-03-18

Applicant: TORAY Industries, Inc.

Inventor： Yu SHOJI ,  Yuki MASUDA ,  Yutaro KOYAMA ,  Ryoji OKUDA

IPC: C08G69/26 ,  C08L79/02 ,  G03F7/023 ,  G03F7/20 ,  C08K5/38 ,  C08K5/39 ,  H01L21/02

Abstract: A highly sensitive photosensitive resin composition that can afford a cured film having a low stressfulness, a high degree of elongation, and an excellent adhesion to a metal material, copper among others, is provided. A photosensitive resin composition including an alkali-soluble resin having an organic group derived from an aliphatic diamine.