公开(公告)号：US5148181A

公开(公告)日：1992-09-15

申请号：US624599

申请日：1990-12-10

申请人： Yukio Yokoyama ,  Takao Ono

发明人： Yukio Yokoyama ,  Takao Ono

IPC分类号： H01Q13/08 ,  H01Q1/24 ,  H01Q9/04 ,  H01Q9/36 ,  H01Q9/42 ,  H04B1/38 ,  H04Q7/32

CPC分类号： H01Q9/0421 ,  H01Q1/243 ,  H01Q9/42

摘要： A mobile radio communication apparatus with an improved antenna for promoting easy manual operations, insuring desirable acoustic characteristics, and preventing the antenna gain from being lowered by user's head or hand during communication. An antenna is mounted on the upper surface of a casing and made up of a rectangular first conductive plate parallel to and spaced apart from the upper surface by a predetermined distance and having a length L.sub.1, a rectangular second conductive plate extending perpendicularly from the first conductive plate and having a height H.sub.2, and a rectangular third conductive plate extending perpendicularly from the second conductive plate and in parallel to the first conductive plate. A short-circuiting plate extending perpendicularly from one side of the first conductive plate by a height H.sub.1 and has a length M as measured in a direction parallel to the length L.sub.1. The short-circuiting plate has the end thereof connected and affixed to the upper end of a particular surface of the casing where the earpiece, mouthpiece and operation secton are arranged. The height H.sub.1 of the short-circuiting plate is greater than said height H.sub.2 of the second conductive plate, while the length M of the short-circuiting plate is equal to or smaller than the length L.sub.1 of the first conductive plate.

摘要翻译： 一种具有改进的天线的移动无线电通信装置，用于促进便于手动操作，确保期望的声学特性，并且防止在通信期间用户的头部或手部降低天线增益。 天线安装在壳体的上表面上，由平行于上表面并与之隔开预定距离的矩形第一导电板构成，并具有长度L1，从第一导电层垂直延伸的矩形第二导电板 并且具有高度H2，以及从第二导电板垂直延伸并平行于第一导电板的矩形第三导电板。 从第一导电板的一侧垂直地延伸高度H1的短路板，并且具有沿与长度L1平行的方向测量的长度M. 短路板的端部连接并固定到壳体的特定表面的上端，其中耳机，接口管和操作构造被布置。 短路板的高度H1大于第二导电板的高度H2，而短路板的长度M等于或小于第一导电板的长度L1。

公开(公告)号：US20100061072A1

公开(公告)日：2010-03-11

申请号：US12374602

申请日：2007-07-11

申请人： Masaharu Imazato ,  Takao Ono

发明人： Masaharu Imazato ,  Takao Ono

IPC分类号： H05K1/11

CPC分类号： H05K1/0218 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/09181 ,  H05K2201/09354 ,  H05K2201/09618

摘要： Ground via provided in an end portion of a multi-layer printed circuit board so as to suppress a leakage of magnetic field from the end portion of the board causes a problem that a digital circuit of high density cannot be mounted on the board due to necessity of area for locating the ground via. Further, a case of using solder plating for the end portion of the board causes a problem that manufacturing process is added and that numbers of days and costs for manufacturing the multi-layer printed circuit board are increased.In a multi-layer printed circuit board has a plurality of ground layers and at least one signal layer, the signal layer in which a signal pattern is wired at an end portion of the multi-layer printed circuit board is sandwiched between upper adjacent and lower adjacent ground layers, and the upper adjacent and lower adjacent ground layers are connected to each other by recessed conductors at the end portion thereof. In addition, an interval between the recessed conductors is not larger than λ/8 of a higher harmonic frequency as an operable frequency.

摘要翻译： 通过设置在多层印刷电路板的端部的接地通路，以抑制来自电路板端部的磁场的泄漏，导致高密度的数字电路由于必要而无法安装在电路板上的问题 用于定位地面通孔。 此外，使用焊料电镀用于电路板端部的情况引起了加工制造工艺的问题，并且增加了用于制造多层印刷电路板的天数和成本。 在多层印刷电路板中具有多个接地层和至少一个信号层，其中在多层印刷电路板的端部布置有信号图案的信号层被夹在上邻近和下层之间 相邻的接地层，并且上邻近和下相邻的接地层在其端部处由凹入的导体彼此连接。 此外，凹入导体之间的间隔不大于作为可操作频率的高次谐波频率的λ/ 8。

公开(公告)号：US06990363B2

公开(公告)日：2006-01-24

申请号：US10007015

申请日：2001-12-04

申请人： Ryo Ito ,  Takao Ono

发明人： Ryo Ito ,  Takao Ono

IPC分类号： H04M1/00

CPC分类号： H01Q9/045 ,  H01Q1/243

摘要： The present invention provides a wireless device including: at least an antenna; and at least a conductive ground serving as a ground, through which a high frequency current flows, and the conductive ground having at least a side which is approximately one quarter wavelength of a radio wave transmitted from the antenna, the at least side of the conductive ground having a feeding point, at which the antenna is electrically connected to the conductive ground, wherein the feeding point on the side is positioned closer to one end of the side than a center position, so that the feeding point is positioned asymmetrical to the conductive ground in any directions included in a plane parallel to the conductive ground, whereby the high frequency current flowing, through the conductive ground has an asymmetrical distribution of current over the conductive ground.

公开(公告)号：US06790293B2

公开(公告)日：2004-09-14

申请号：US10147171

申请日：2002-05-13

申请人： Masahiro Nomura ,  Toshiyuki Oga ,  Takanobu Gido ,  Takao Ono ,  Yoshiyuki Takahashi ,  Rika Sasaki

发明人： Masahiro Nomura ,  Toshiyuki Oga ,  Takanobu Gido ,  Takao Ono ,  Yoshiyuki Takahashi ,  Rika Sasaki

IPC分类号： B23K35363

CPC分类号： B23K35/025 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0244 ,  B23K35/36 ,  B23K35/3613 ,  H05K3/3489

摘要： There is provided a solder work material for forming solder-coated circuit boards, which is capable of preventing the malfunction of circuit that may be caused to generate by voltage noises that tend to be generated by the volumetrical expansion of the flux residue in a soldered laminated ceramic capacitor, etc. even under the environments where temperatures fluctuate widely (for example, −40° C. to +85° C.), or that may be caused to generate by voltage noises to be generated by the fluctuation of parasitic capacity between circuits which may be caused to generate due to a flux residue. There is also provided a circuit board having a residual film of flux left thereon after the deposition of the solder work material. This solder work material is formed of a solder paste composition or a resin flux-cored solder, both comprising a flux containing, as a resin component, acrylic resin for preventing the generation of voltage noises in electronic devices. The circuit board is accompanied with a residual film of such a flux.

摘要翻译： 提供了一种用于形成焊料涂覆的电路板的焊料加工材料，其能够防止由焊接层压体中的焊剂残留物的体积膨胀而倾向于产生的电压噪声产生的电路的故障 陶瓷电容器等，即使在温度波动较大的环境（例如-40℃至+ 85℃）下，或者可能由于电压噪声而产生的电压噪声将由寄生电容的波动产生， 可能由于助焊剂残留而产生的电路。 还提供了一种电路板，其在沉积焊料加工材料之后具有留在其上的残留的残余膜。 这种焊料加工材料由焊膏组合物或树脂药芯焊料形成，两者都包含含有作为树脂成分的助熔剂，用于防止在电子器件中产生电压噪声的丙烯酸树脂。 电路板伴随着这种焊剂的残留膜。

公开(公告)号：US5909194A

公开(公告)日：1999-06-01

申请号：US838065

申请日：1997-04-18

申请人： Koji Umeda ,  Takao Ono

发明人： Koji Umeda ,  Takao Ono

IPC分类号： H01Q1/10 ,  H01Q1/08 ,  H01Q1/24

CPC分类号： H01Q1/085 ,  H01Q1/244

摘要： The antenna for a radio equipment includes a base portion boot made of a flexible material and secured to an edge of an opening of a support hole in a radio equipment body such that it partially extends outwardly over a predetermined length from the radio equipment body. A flexible pipe is integrally coated on an outer periphery of a portion of a linear antenna element which is positioned in a through-hole of the base portion boot when the linear antenna element is at its retracted position in the radio equipment body.

摘要翻译： 用于无线电设备的天线包括由柔性材料制成并且固定到无线电设备主体中的支撑孔的开口的边缘的基部护罩，使得其从无线电设备主体部分地向外延伸预定长度。 当线状天线元件处于其无线电设备主体中的缩回位置时，柔性管整体地涂覆在线状天线元件的位于基部护罩的通孔中的一部分的外周上。

公开(公告)号：US5467096A

公开(公告)日：1995-11-14

申请号：US201340

申请日：1994-02-24

申请人： Kenji Takamoro ,  Koji Umeda ,  Takao Ono

发明人： Kenji Takamoro ,  Koji Umeda ,  Takao Ono

IPC分类号： H01Q1/10 ,  H01Q1/24 ,  H01Q1/36

CPC分类号： H01Q1/10 ,  H01Q1/243

摘要： A miniature and high performance antenna applicable to a radio communication apparatus and made up of a straight antenna rod and a loading coil. The tip of the straight antenna rod is received in the coil such that capacity coupling is set up between them. An antenna configuration is provided for setting up capacity coupling between the antenna rod and a feed portion.

摘要翻译： 适用于无线电通信设备并由直的天线杆和负载线圈组成的微型和高性能天线。 直线天线杆的尖端被接收在线圈中，使得它们之间建立电容耦合。 提供天线配置用于设置天线杆和馈电部分之间的容量耦合。

公开(公告)号：US07633147B2

公开(公告)日：2009-12-15

申请号：US10672551

申请日：2003-09-26

申请人： Seiji Funaba ,  Hisashi Abo ,  Takao Ono ,  Koji Hosokawa ,  Yoji Nishio ,  Atsushi Nakamura ,  Tomohiko Sato

发明人： Seiji Funaba ,  Hisashi Abo ,  Takao Ono ,  Koji Hosokawa ,  Yoji Nishio ,  Atsushi Nakamura ,  Tomohiko Sato

IPC分类号： H01L23/538

CPC分类号： H01L25/105 ,  H01L23/50 ,  H01L23/552 ,  H01L23/60 ,  H01L23/64 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6627 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/15173 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/19032 ,  H01L2924/19041 ,  H01L2924/19051 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H05K1/112 ,  H05K1/14 ,  H05K1/181 ,  H05K2201/09236 ,  H05K2201/10159 ,  H05K2201/10545 ,  Y02P70/611 ,  H01L2224/45099 ,  H01L2924/00

摘要： A semiconductor unit constituting a memory device has a memory chip, a package substrate having three wiring layers. Power-supply surfaces (VDD surface) and (GND surface) are wired on the package substrate while an intra-package DQ bus is wired on an intermediate layer between both of the power-supply surfaces. The memory device has two DQ pins every one intra-package DQ bus. The intra-package DQ bus is connected to a signal terminal pad of the memory chip through a via hole. In view of the two DW pins, a via hole for connecting the intra-package DQ bus with the signal terminal pad constitutes a branch wire.

摘要翻译： 构成存储器件的半导体单元具有存储芯片，具有三个布线层的封装基板。 电源表面（VDD表面）和（GND表面）被布线在封装衬底上，而封装内的DQ总线布线在两个电源表面之间的中间层上。 存储器件每一个封装内DQ总线具有两个DQ引脚。 封装内的DQ总线通过通孔连接到存储器芯片的信号端子焊盘。 鉴于两个DW引脚，用于将封装内DQ DQ总线与信号端子焊盘连接的通孔构成分支线。

公开(公告)号：US06975026B2

公开(公告)日：2005-12-13

申请号：US10409929

申请日：2003-04-10

申请人： Morihiko Mouri ,  Sadayuki Okuma ,  Yasushi Takahashi ,  Takao Ono ,  Yosihiro Sakaguchi ,  Atsushi Nakamura ,  Toshio Miyazawa

发明人： Morihiko Mouri ,  Sadayuki Okuma ,  Yasushi Takahashi ,  Takao Ono ,  Yosihiro Sakaguchi ,  Atsushi Nakamura ,  Toshio Miyazawa

IPC分类号： H01L23/29 ,  H01L23/31 ,  H01L23/34 ,  H01L23/373 ,  H01L23/10

CPC分类号： H01L23/3135 ,  H01L23/3164 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

摘要： A package for mounting a semiconductor device has a surface exposed to an atmosphere. The exposed surface is covered with a covering material such as a paint, a tape or a seal.

摘要翻译： 用于安装半导体器件的封装具有暴露于大气的表面。 暴露的表面被覆盖材料覆盖，例如涂料，胶带或密封件。

公开(公告)号：US06833618B2

公开(公告)日：2004-12-21

申请号：US09964474

申请日：2001-09-28

申请人： Takao Ono ,  Hironori Iwasaki ,  Mitsuya Tanaka

发明人： Takao Ono ,  Hironori Iwasaki ,  Mitsuya Tanaka

IPC分类号： H01L2334

CPC分类号： H01L25/065 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/14 ,  H05K2201/10159 ,  H05K2201/10484 ,  H01L2924/00

摘要： The invention provides a memory system that allows connection of a memory controller to each of plural memory modules in an equal distance. The memory system includes a memory controller, three memory modules, a single socket which the three memory modules can be inserted into and pulled out from, and a mother board on which the memory controller and the socket are mounted, etc. And, the memory controller and each of the memory modules are connected in an equal distance through the socket pins of the socket that are branched from bus wirings on the mother board. The socket is furnished with three sets of the plural socket pins in a radial form, in correspondence with each of the memory modules. The socket has two types of structures: one has three module-board contacts for one board-bus connection, and the other has one module-board contact for one board-bus connection.

摘要翻译： 本发明提供一种存储器系统，其允许存储器控制器以等距离连接到多个存储器模块中的每一个。 存储器系统包括存储器控制器，三个存储器模块，三个存储器模块可插入和拔出的单个插座，以及安装存储器控制器和插座的母板等。而且，存储器 控制器和每个存储器模块通过从主板上的总线布线分支的插座的插座销以相等的距离连接。 该插座与径向形式配备有三组多个插座销，与每个存储器模块相对应。 插座具有两种类型的结构：一个具有三个模块板触点，用于一个板卡总线连接，另一个具有一个模块板触点用于一个板卡总线连接。

公开(公告)号：US06712262B2

公开(公告)日：2004-03-30

申请号：US10197764

申请日：2002-07-18

申请人： Shinichi Akaike ,  Kazutaka Nakanami ,  Yoshiyuki Takahashi ,  Takao Ono

发明人： Shinichi Akaike ,  Kazutaka Nakanami ,  Yoshiyuki Takahashi ,  Takao Ono

IPC分类号： B23K120

CPC分类号： H05K3/282 ,  B23K35/3615 ,  B23K35/3616 ,  C23F11/08 ,  C23F11/149

摘要： The invention provides a water-soluble preflux that can solve problems with a soldering land array having a narrow spacing in that fused solder is likely to cause soldering bridges with defective soldering, a printed circuit board with its film formed thereon, and a surface treatment process for a metal in that circuit. The water-soluble preflux comprises given two different benzimidazoles compound and an iodine-based compound optionally with an amino acid, etc. The invention provides a printed circuit board with a film of that preflux formed thereon, and a surface treatment process for the metal in that circuit.

摘要翻译： 本发明提供了可以解决具有窄间距的焊接焊盘阵列的问题的水溶性预焊料，因为熔焊焊料可能导致焊接不良的焊接桥，其上形成有其的膜的印刷电路板和表面处理工艺 用于该电路中的金属。 水溶性前驱物包括给定的两种不同的苯并咪唑化合物和任选具有氨基酸的碘基化合物等。本发明提供一种印刷电路板，其上形成有预过氧化物的膜，以及用于金属的表面处理方法 那个电路。