摘要:
A valve train for an internal combustion engine including a plurality of cylinders having different valve mechanism constructions, in which the valve train has a correcting member for correcting a difference in valve lift amount that is produced between the plurality of cylinders due to a difference in construction between valve mechanisms so as to make valve lift amounts of the plurality of cylinders substantially uniform.
摘要:
A semiconductor device has an internal circuit (2), a PAD, a NMOS Tr (QN) as a protective transistor formed between a node (N) on a signal line and a first power source (Vss), and a NOR gate (G1) as a logical gate connected to a gate as a control terminal of the NMOS transistor (QN). The internal circuit (2) is connected to the PAD through the signal line. The NOR gate (G1) keeps the protective transistor (QN) an OFF state during a normal operation of the internal circuit (2). In addition, the semiconductor device further includes a test circuit (21). The output from the NOR gate (G1), whose one input is the output from the test circuit (21), is supplied to the gate of the NMOS transistor (QN). The output from the test circuit (21) is thereby output to outside through the NMOS transistor (QN) and the PAD.
摘要:
A semiconductor memory device having a normal mode of reading and writing data from and to a selected memory cell of a memory cell array. The semiconductor memory device is characterized by control means for switching the normal operation mode to a test mode in response to a test mode signal applied to a certain input terminal, selecting all desired memory cells of the memory cell array at a time, and allowing data applied to a data input terminal to be written to all the selected and desired memory cells at one time.
摘要:
A semiconductor IC device including a main circuit block and at least one subcircuit block, each having a ground terminal, a supply voltage terminal and an input or output terminal. A first ground line is connected to the ground terminal of the main circuit block and arranged within a wiring domain of the main circuit block and adjacent to the subcircuit blocks. A second ground line is connected to the ground terminal of the subcircuit block and arranged within a wiring domain of the subcircuit block and adjacent to the main circuit block. Protective elements are connected between the first and second ground lines so as to form short circuits through at least one of the first and second ground lines. In the IC device thus configured, all of the input and output terminals resist overvoltage, in every case where any one of the ground terminals and the supply voltage terminals is determined as a reference potential terminal, without complicating the protective element wiring arrangement or increasing the chip area and the cost thereof.
摘要:
An integrated circuit includes an input buffer circuit and an output buffer circuit. The source voltage to the input buffer circuit and the output buffer circuit are supplied through bonding pads formed independently on a semiconductor chip, and electrically connected to a source potential lead pin. The input node of the input buffer circuit is coupled to the source potential of the output buffer circuit with a capacitor.
摘要:
A semiconductor integrated circuit having a memory and an adjacent peripheral circuit generating minority carriers which can destroy data in a portion of the memory at low temperatures. The load resistance in the portion is made lower or the storage capacity is made higher in the portion than in the remainder of the memory so that at low temperatures data is not lost and the energy consumption of the circuit is not unduly increased.
摘要:
An MOS transistor circuit contains at least one "zero" threshold mode transistor to provide a power-down function for the circuit. The "zero" threshold mode transistor is connected between an enhancement-mode MOS driver transistor and a depletion-mode MOS load transistor.
摘要:
A semiconductor device includes a package substrate having a chip mounting surface with at least a plurality of first substrate-side pads and a plurality of second substrate-side pads, a rectangular first semiconductor chip having a first main surface fixed on the chip mounting surface, a plurality of first bonding wires through which a plurality of first pads arranged along one side of a second main surface of the first semiconductor chip and the first substrate-side pads are bonded to each other, a rectangular second semiconductor chip having a third main surface fixed on the second main surface, and a plurality of second bonding wires through which a plurality of second pads arranged along one side of a fourth main surface of the second semiconductor chip and the second substrate-side pads are bonded to each other.
摘要:
An improved semiconductor memory device capable of easily detecting the location of a defective bit line and a defective memory cell as a leakage current path for a short time is provided. A region flowing a leakage current no smaller than a predetermined value is determined by detecting one of a first large region and a remaining second large region, either of said first and second large regions being selected by simultaneously selecting a predetermined number of said column selection lines. Then, a region flowing a leakage current no smaller than a predetermined value is determined by detecting one of a first small region and a remaining second small region, said first and second small regions constituting said one of the first and second large regions, either of said first and second small regions being selected by simultaneously selecting a predetermined number of said column selection lines. For this purpose, an address signal output control circuit is provided within the semiconductor memory device. The address signal output control circuit is supplied with an address output control signal as externally given as a control signal for the purpose of selecting said row selection line by taking control of said row addressing signal in order to perform the control process as described above.
摘要:
A semiconductor memory device including a plurality of cell array sections each having a plurality of memory cells disposed in a matrix form, the plurality of cell array sections being juxtaposed in a row direction. Main word lines, are each provided in common for all of the plurality of cell array sections in each row, a row select signal being applied to each main word line. Section word lines are connected to memory cells, in each cell array section at each row, for activating the memory cells. Section select lines are provided for each cell array section, a section selection signal being applied to each section select line. Logical circuits are provided for each cell array section, each logical circuit being connected to each main word line and the section select line, executing a logical operation between the row select signal and the section select signal, and activating the section select line when the logical operation result satisfies a predetermined logical condition. Each logical circuit includes a first inverter, a CMOS type second inverter and an N-channel transistor. Each main word line is connected to the input terminals of the first and second inverters. Each section select line is connected to the drain of the N-type transistor and the source of a P-channel transistor of the second inverter. The gate of the N-channel transistor is connected to the output terminal of the first inverter and each section word line is connected to the source of the N-channel transistor and the output terminal of the second inverter. Bit lines are connected to each memory cell for receiving data from a selected memory cell and outputting the data.