公开(公告)号：US08222733B2

公开(公告)日：2012-07-17

申请号：US12729034

申请日：2010-03-22

申请人： Ming-Hsiang Cheng ,  Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Hsiao-Chuan Chang

发明人： Ming-Hsiang Cheng ,  Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Hsiao-Chuan Chang

IPC分类号： H01L23/00 ,  H01L21/50

CPC分类号： H01L25/0652 ,  H01L23/053 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19105

摘要： A first substrate has a first surface facing a second surface of the second substrate. The active chips are disposed on and electrically connected to the first surface, and spaced apart from each other by an interval, wherein the active chips respectively have a first active surface. The bridge chip is mechanically and electrically connected to the second surface, and has a second active surface partially overlapped with the first active surfaces of the active chips, such that the bridge chip is used for providing a proximity communication between the active chips. The connection structure is disposed between the first surface and the second surface for combining the first substrate and the second substrate.

摘要翻译： 第一基板具有面向第二基板的第二表面的第一表面。 有源芯片设置在第一表面上并电连接到第一表面，并且间隔彼此间隔开，其中有源芯片分别具有第一有源表面。 桥芯片机械地和电连接到第二表面，并且具有与有源芯片的第一有源表面部分地重叠的第二有源表面，使得桥接芯片用于提供有源芯片之间的邻近通信。 连接结构设置在第一表面和第二表面之间，用于组合第一基板和第二基板。

公开(公告)号：US20110233764A1

公开(公告)日：2011-09-29

申请号：US12749191

申请日：2010-03-29

申请人： Hsiao-Chuan CHANG ,  Tsung-Yueh Tsai ,  Yi-Shao Lai ,  Ming-Hsiang Cheng

发明人： Hsiao-Chuan CHANG ,  Tsung-Yueh Tsai ,  Yi-Shao Lai ,  Ming-Hsiang Cheng

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L21/563 ,  H01L23/48 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/30155 ,  H01L2224/30181 ,  H01L2224/73103 ,  H01L2224/73153 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/92143 ,  H01L2224/92242 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device package and a method of fabricating the same are disclosed. The semiconductor device package includes a substrate, a buffer structure, two active chips and a bridge chip. The substrate has a cavity, a first surface and a second surface opposite to the first surface. The cavity is extended from the first surface toward the second surface, and the buffer structure is disposed in the cavity. The active chips are mechanically disposed on and electrically connected to the first surface and around the cavity, wherein the active chips both have a first active surface. The bridge chip is disposed in the cavity and above the buffer structure, wherein the bridge chip has a second active surface, the second active surface faces the first active surfaces and is partially overlapped with the first active surfaces, the bridge chip is used for providing a proximity communication between the active chips.

摘要翻译： 公开了一种半导体器件封装及其制造方法。 半导体器件封装包括衬底，缓冲结构，两个有源芯片和桥接芯片。 衬底具有空腔，第一表面和与第一表面相对的第二表面。 空腔从第一表面延伸到第二表面，并且缓冲结构设置在空腔中。 有源芯片被机械地设置在第一表面上并且电连接到第一表面并且围绕空腔，其中有源芯片都具有第一有源表面。 桥芯片设置在空腔中并且在缓冲结构上方，其中桥芯片具有第二有源表面，第二有源表面面向第一有源表面并与第一有源表面部分重叠，桥芯片用于提供 活动芯片之间的邻近通信。

公开(公告)号：US20110227212A1

公开(公告)日：2011-09-22

申请号：US12729034

申请日：2010-03-22

申请人： Ming-Hsiang CHENG ,  Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Hsiao-Chuan Chang

发明人： Ming-Hsiang CHENG ,  Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Hsiao-Chuan Chang

IPC分类号： H01L23/00 ,  H01L21/50

CPC分类号： H01L25/0652 ,  H01L23/053 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19105

摘要： A semiconductor device package and a method of fabricating the same are disclosed. The semiconductor device package includes a first substrate, a second substrate, two active chips, a bridge chip and a connection structure. The first substrate has a first surface facing a second surface of the second substrate. The active chips are disposed on and electrically connected to the first surface, and spaced apart from each other by an interval, wherein the active chips respectively have a first active surface. The bridge chip is mechanically and electrically connected to the second surface, and has a second active surface partially overlapped with the first active surfaces of the active chips, such that the bridge chip is used for providing a proximity communication between the active chips. The connection structure is disposed between the first surface and the second surface for combining the first substrate and the second substrate.

摘要翻译： 公开了一种半导体器件封装及其制造方法。 半导体器件封装包括第一衬底，第二衬底，两个有源芯片，桥芯片和连接结构。 第一基板具有面向第二基板的第二表面的第一表面。 有源芯片设置在第一表面上并电连接到第一表面，并且间隔彼此间隔开，其中有源芯片分别具有第一有源表面。 桥芯片机械地和电连接到第二表面，并且具有与有源芯片的第一有源表面部分地重叠的第二有源表面，使得桥接芯片用于提供有源芯片之间的邻近通信。 连接结构设置在第一表面和第二表面之间，用于组合第一基板和第二基板。

公开(公告)号：US08592982B2

公开(公告)日：2013-11-26

申请号：US13252850

申请日：2011-10-04

申请人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Ming-Kun Chen ,  Tai-Ping Wang ,  Ming-Hsiang Cheng

发明人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Ming-Kun Chen ,  Tai-Ping Wang ,  Ming-Hsiang Cheng

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L23/48 ,  H01L23/3114 ,  H01L23/522 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06565 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor package includes a semiconductor structure. The semiconductor structure includes a plurality of dielectric layers and a plurality of conductive interconnects embedded in the semiconductor structure. The semiconductor structure also includes a plurality of proximity communication signal input terminals. At least one of the plurality of proximity communication signal input terminals includes a first electrode and a second electrode. The first electrode and the second electrode are spaced apart so as to be configured to provide proximity communication through capacitive coupling. The first electrode is exposed proximate to a surface of the semiconductor structure.

摘要翻译： 半导体封装包括半导体结构。 半导体结构包括多个介电层和嵌入在半导体结构中的多个导电互连。 半导体结构还包括多个邻近通信信号输入端。 多个邻近通信信号输入端中的至少一个包括第一电极和第二电极。 间隔开第一电极和第二电极，以便配置成通过电容耦合提供邻近通信。 第一电极在半导体结构的表面附近露出。

公开(公告)号：US08253431B2

公开(公告)日：2012-08-28

申请号：US12784121

申请日：2010-05-20

申请人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Ming-Kun Chen ,  I. L. Lin ,  Ken Juang ,  Ming-Hsiang Cheng

发明人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Ming-Kun Chen ,  I. L. Lin ,  Ken Juang ,  Ming-Hsiang Cheng

IPC分类号： G01R31/20 ,  G01R31/00

CPC分类号： G01R1/0483 ,  G01R1/0466 ,  G01R31/2886

摘要： The present invention relates to an apparatus and a method for testing non-contact pads of a semiconductor device to be tested. The apparatus includes an insulating body, at least one testing module and a plurality of probes. The insulating body includes an accommodating cavity, a lower opening and at least one side opening. The side opening communicates with the accommodating cavity and the lower opening. The testing module is disposed in the side opening, and each testing module includes a circuit board and an active chip. The active chip is disposed on and electrically connected to the circuit board. The active chip has a plurality of testing pads exposed to the accommodating cavity. The probes are disposed in the lower opening. Whereby, the non-contact pads of the semiconductor device to be tested face but not in physically contact with the testing pads of the active chip, so as to test the proximity communication between the non-contact pads of the semiconductor device and the testing pads of the active chip.

摘要翻译： 本发明涉及一种用于测试待测半导体器件的非接触焊盘的装置和方法。 该装置包括绝缘体，至少一个测试模块和多个探针。 绝缘体包括容纳腔，下开口和至少一个侧开口。 侧开口与容纳腔和下开口连通。 测试模块设置在侧开口中，每个测试模块包括电路板和有源芯片。 有源芯片设置在电路板上并与之电连接。 有源芯片具有暴露于容纳腔的多个测试焊盘。 探针设置在下开口中。 因此，要测试的半导体器件的非接触焊盘面对但不与有源芯片的测试焊盘物理接触，以便测试半导体器件的非接触焊盘与测试焊盘之间的接近连接 的有源芯片。

公开(公告)号：US20110291690A1

公开(公告)日：2011-12-01

申请号：US12784121

申请日：2010-05-20

申请人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Ming-Kun Chen ,  I.L. Lin ,  Ken Juang ,  Ming-Hsiang Cheng

发明人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Ming-Kun Chen ,  I.L. Lin ,  Ken Juang ,  Ming-Hsiang Cheng

IPC分类号： G01R31/26

CPC分类号： G01R1/0483 ,  G01R1/0466 ,  G01R31/2886

摘要： The present invention relates to an apparatus and a method for testing non-contact pads of a semiconductor device to be tested. The apparatus includes an insulating body, at least one testing module and a plurality of probes. The insulating body includes an accommodating cavity, a lower opening and at least one side opening. The side opening communicates with the accommodating cavity and the lower opening. The testing module is disposed in the side opening, and each testing module includes a circuit board and an active chip. The active chip is disposed on to and electrically connected to the circuit board. The active chip has a plurality of testing pads exposed to the accommodating cavity. The probes are disposed in the lower opening. Whereby, the non-contact pads of the semiconductor device to be tested face but not in physically contact with the testing pads of the active chip, so as to test the proximity communication between the non-contact pads of the semiconductor device and the testing pads of the active chip.

摘要翻译： 本发明涉及一种用于测试待测半导体器件的非接触焊盘的装置和方法。 该装置包括绝缘体，至少一个测试模块和多个探针。 绝缘体包括容纳腔，下开口和至少一个侧开口。 侧开口与容纳腔和下开口连通。 测试模块设置在侧开口中，每个测试模块包括电路板和有源芯片。 有源芯片设置在电路板上并与电路板电连接。 有源芯片具有暴露于容纳腔的多个测试焊盘。 探针设置在下开口中。 因此，要测试的半导体器件的非接触焊盘面对但不与有源芯片的测试焊盘物理接触，以便测试半导体器件的非接触焊盘与测试焊盘之间的接近连接 的有源芯片。

公开(公告)号：US20090051048A1

公开(公告)日：2009-02-26

申请号：US12222610

申请日：2008-08-13

申请人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Hsiao-Chuan Chang

发明人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Hsiao-Chuan Chang

IPC分类号： H01L21/60 ,  H01L23/48

CPC分类号： H01L24/32 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L24/91 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/81136 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/78 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A package structure and a manufacturing method thereof are provided. The package structure includes a carrier, a chip-bonding structure and a chip. The chip-bonding structure is formed on a first surface of the carrier. The chip-bonding structure includes a cavity, a dam, several via holes and several solder bumps. The solder bumps are received in the via holes and are correspond to the first connecting pads located on the carrier. The chip is embedded in the cavity of the chip-bonding structure. An active surface of the chip is tightly pasted on the first surface of the chip-bonding structure, and the first solder pads form electrical contact with the corresponding solder bumps. The chip of the package structure is precisely disposed on the carrier, not only simplifying the manufacturing process but also forming stable electrical connection between the chip and the carrier of the package structure.

摘要翻译： 提供一种封装结构及其制造方法。 封装结构包括载体，芯片结合结构和芯片。 芯片接合结构形成在载体的第一表面上。 芯片结合结构包括空腔，坝，几个通孔和几个焊料凸块。 焊料凸块被容纳在通孔中并且对应于位于载体上的第一连接焊盘。 芯片嵌入在芯片结合结构的空腔中。 芯片的有源表面被牢固地粘贴在芯片接合结构的第一表面上，并且第一焊盘与相应的焊料凸块形成电接触。 封装结构的芯片精确地布置在载体上，不仅简化了制造工艺，而且还在封装结构的芯片和载体之间形成稳定的电连接。

公开(公告)号：US07980757B2

公开(公告)日：2011-07-19

申请号：US12350643

申请日：2009-01-08

申请人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Hsiao-Chuan Chang

发明人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Hsiao-Chuan Chang

IPC分类号： G01K1/00 ,  G01N25/00

CPC分类号： G01N19/04

摘要： A bonding strength measuring device for measuring the bonding strength between a substrate and a molding compound disposed on the substrate is provided. The measuring device includes a heating platform, a heating slide plate, and a fixing bracket. The heating platform has a first heating area and a first replaceable fixture. The substrate is disposed on the first heating area, and the first replaceable fixture is used to fix the substrate and has an opening exposing the molding compound. The heating slide plate has a second heating area and a second replaceable fixture. The second heating area is used to heat the molding compound, and the second replaceable fixture has a cavity for accommodating the molding compound. The fixing bracket is used to fix the heating slide plate above the heating platform.

摘要翻译： 提供了用于测量基板和设置在基板上的模塑料之间的接合强度的接合强度测量装置。 测量装置包括加热平台，加热滑板和固定支架。 加热平台具有第一加热区域和第一可更换夹具。 基板设置在第一加热区域上，并且第一可更换夹具用于固定基板，并具有露出模塑料的开口。 加热滑板具有第二加热区域和第二可更换夹具。 第二加热区域用于加热模塑料，第二可更换夹具具有容纳模塑料的空腔。 固定支架用于将加热滑板固定在加热平台上。

公开(公告)号：US20090175312A1

公开(公告)日：2009-07-09

申请号：US12350643

申请日：2009-01-08

申请人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Hsiao-Chuan Chang

发明人： Yi-Shao Lai ,  Tsung-Yueh Tsai ,  Hsiao-Chuan Chang

IPC分类号： G01N3/00

CPC分类号： G01N19/04

摘要： A bonding strength measuring device for measuring the bonding strength between a substrate and a molding compound disposed on the substrate is provided. The measuring device includes a heating platform, a heating slide plate, and a fixing bracket. The heating platform has a first heating area and a first replaceable fixture. The substrate is disposed on the first heating area, and the first replaceable fixture is used to fix the substrate and has an opening exposing the molding compound. The heating slide plate has a second heating area and a second replaceable fixture. The second heating area is used to heat the molding compound, and the second replaceable fixture has a cavity for accommodating the molding compound. The fixing bracket is used to fix the heating slide plate above the heating platform.

摘要翻译： 提供了用于测量基板和设置在基板上的模塑料之间的接合强度的接合强度测量装置。 测量装置包括加热平台，加热滑板和固定支架。 加热平台具有第一加热区域和第一可更换夹具。 基板设置在第一加热区域上，并且第一可更换夹具用于固定基板，并具有露出模塑料的开口。 加热滑板具有第二加热区域和第二可更换夹具。 第二加热区域用于加热模塑料，第二可更换夹具具有用于容纳模塑料的空腔。 固定支架用于将加热滑板固定在加热平台上。

公开(公告)号：US08115285B2

公开(公告)日：2012-02-14

申请号：US12192805

申请日：2008-08-15

申请人： Chien-Wen Chen ,  Yi-Shao Lai ,  Hsiao-Chuan Chang ,  Tsung-Yueh Tsai ,  Pao-Huei Chang Chien ,  Ping-Cheng Hu ,  Hsu-Yang Lee

发明人： Chien-Wen Chen ,  Yi-Shao Lai ,  Hsiao-Chuan Chang ,  Tsung-Yueh Tsai ,  Pao-Huei Chang Chien ,  Ping-Cheng Hu ,  Hsu-Yang Lee

IPC分类号： H01L21/00

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, multiple leads, a chip, a package body, and a protective layer. The die pad includes an upper sloped portion, a lower sloped portion, and a peripheral edge region defining a cavity with a cavity bottom. Each lead includes an upper sloped portion and a lower sloped portion. The chip is disposed on the cavity bottom and is coupled to the leads. The package body is formed over the chip and the leads, substantially fills the cavity, and substantially covers the upper sloped portions of the die pad and the leads. The lower sloped portions of the die pad and the leads at least partially extend outwardly from a lower surface of the package body. The protective layer substantially covers the lower sloped portion and the lower surface of at least one lead.

摘要翻译： 描述半导体封装和相关方法。 在一个实施例中，封装包括管芯焊盘，多个引线，芯片，封装体和保护层。 管芯焊盘包括上倾斜部分，下倾斜部分和限定具有空腔底部的空腔的周边边缘区域。 每个引线包括上倾斜部分和下倾斜部分。 芯片设置在腔体底部并耦合到引线。 封装体形成在芯片和引线上，基本上填充空腔，并且基本上覆盖芯片焊盘和引线的上倾斜部分。 芯片焊盘和引线的下倾斜部分至少部分地从封装主体的下表面向外延伸。 保护层基本上覆盖至少一个引线的下倾斜部分和下表面。