Adhesion promoting layer for composite assemblies
    11.
    发明授权
    Adhesion promoting layer for composite assemblies 有权
    用于复合组件的粘合促进层

    公开(公告)号:US09328262B2

    公开(公告)日:2016-05-03

    申请号:US12598569

    申请日:2007-05-23

    Inventor: Chris Harrington

    CPC classification number: C09J5/06 C08J3/242 Y10T428/249939 Y10T428/28

    Abstract: The adhesion between an underlying composite material and its surface finish is increased by including an adhesion promoting layer at the interface where the uncured composite material and the surface finish meet during the lay up of the uncured composite assembly. The adhesion promoting layer includes a cure accelerating agent for the composite material matrix resin.

    Abstract translation: 通过在未固化的复合材料组合物的铺设期间在未固化的复合材料和表面光洁度相交的界面处包含粘附促进层来增加下面的复合材料与其表面光洁度之间的粘附。 粘合促进层包括用于复合材料基体树脂的固化促进剂。

    Process for manufacturing composite materials
    12.
    发明授权
    Process for manufacturing composite materials 有权
    复合材料制造工艺

    公开(公告)号:US09187606B2

    公开(公告)日:2015-11-17

    申请号:US13634988

    申请日:2011-03-15

    Abstract: The invention relates to a prepreg comprising a structural layer of conductive fibers comprising thermosetting resin in the interstices, and a first outer layer of resin comprising thermosetting resin, and comprising a population of conductive free filaments located at the interface between the structural layer and the outer resin layer which, when cured under elevated temperature, produces a cured composite material comprising a cured structural layer of packed conductive fibers and a first outer layer of cured resin, the outer layer of cured resin, comprising a proportion of the population of conductive free filaments dispersed therein, and to a process for manufacturing prepregs wherein the electrically conductive fibers pass a fiber disrupting means to cause a proportion of the fibers on an external face of the sheet to become free filaments.

    Abstract translation: 本发明涉及一种预浸料,其包括在空隙中包含热固性树脂的导电纤维的结构层,以及包含热固性树脂的第一外层树脂,并且包含位于结构层和外层之间的界面处的一组无导电性细丝 树脂层,其在高温下固化时产生固化的复合材料,其包含填充导电纤维的固化结构层和固化树脂的第一外层,固化树脂的外层包含一定数量的导电自由丝 分散在其中,以及制造预浸料的方法,其中导电纤维通过纤维破碎装置,以使一部分纤维在片材的外表面上变成游离长丝。

    Cure accelerators
    17.
    发明授权
    Cure accelerators 有权
    治疗加速器

    公开(公告)号:US08859694B2

    公开(公告)日:2014-10-14

    申请号:US12834206

    申请日:2010-07-12

    CPC classification number: C08G59/686

    Abstract: An epoxy resin composition comprising an epoxy resin component combined with a sufficient amount of an imidazole curative to provide curing of the epoxy resin composition. The epoxy resin composition further includes a non-hydroxyl containing cure accelerator for the imidazole curative.

    Abstract translation: 一种环氧树脂组合物,其包含与足量的咪唑固化剂组合的环氧树脂组分以提供环氧树脂组合物的固化。 环氧树脂组合物还包含用于咪唑治疗剂的非羟基固化促进剂。

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