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    DROPLET OPERATIONS DEVICE
    12.
    发明申请
    DROPLET OPERATIONS DEVICE 审中-公开
    DROPLET操作装置

    公开(公告)号：US20150068903A1

    公开(公告)日：2015-03-12

    申请号：US14498418

    申请日：2014-09-26

    Applicant: Advanced Liquid Logic, Inc.

    Inventor： Vijay Srinivasan ,  Arjun Sudarsan ,  Vamsee K. Pamula ,  Michael G. Pollack ,  Ramakrishna Sista ,  Raymond Kozikowski ,  Nicole Bell

    IPC: G01N27/447

    CPC classification number: G01N27/44756 ,  B01F13/0071 ,  B01F13/0076 ,  B01L3/502707 ,  B01L3/502792 ,  B01L2300/0816 ,  B01L2300/0819 ,  B01L2400/0427 ,  B01L2400/0688 ,  B01L2400/086 ,  B29C59/02 ,  B41J2/1601 ,  B81B7/0061 ,  B81B2201/058 ,  B81B2201/13 ,  F04B17/00 ,  F04B19/006

    Abstract: The invention provides droplet actuators with droplet operations surfaces for manipulating droplets, e.g., by conducting droplet operations. The droplet operations surfaces are typically exposed to a droplet operations gap. One or more regions of a droplet operation surface may include patterned topographic features. The invention also provides a droplet actuator in which one or both gap-facing droplet operations surfaces is formed using a removable film. The removable film may, in various embodiments, also include other components ordinarily associated with the droplet actuator substrate, such as the dielectric layer and the electrodes. Further, the invention provides droplet actuator devices and methods for coupling and/or sealing substrates of a droplet actuator, such as techniques for self-aligning assembly of droplet actuator substrates. The invention provides droplet actuators and methods of disassembling the droplet actuator in order to provide access for cleaning and/or recycling of droplet actuator surfaces.

    Abstract translation: 本发明提供了液滴致动器，其具有用于操纵液滴的液滴操作表面，例如通过进行液滴操作。 液滴操作表面通常暴露于液滴操作间隙。 液滴操作表面的一个或多个区域可以包括图案化的地形特征。 本发明还提供一种液滴致动器，其中使用可去除的膜形成一个或两个面向间隙的液滴操作表面。 在各种实施例中，可除去膜可以包括通常与液滴致动器基底（例如电介质层和电极）相关联的其它部件。 此外，本发明提供了液滴致动器装置和用于联接和/或密封液滴致动器的基板的方法，例如用于液滴致动器基板的自对准组装的技术。 本发明提供了液滴致动器和拆卸液滴致动器的方法，以便为液滴致动器表面的清洁和/或回收提供通路。

    Sockets for microassembly
    13.
    发明授权
    Sockets for microassembly 失效
    微组装插座

    公开(公告)号：US07025619B2

    公开(公告)日：2006-04-11

    申请号：US11074448

    申请日：2005-03-08

    Applicant: Kenneth Tsui ,  Aaron Geisberger

    Inventor： Kenneth Tsui ,  Aaron Geisberger

    IPC: H01R13/627

    CPC classification number: B81C3/008 ,  B81B2201/13 ,  B81C99/002

    Abstract: An apparatus including at least three deflectable members each configured to deflect during assembly with a component, and also configured to remain in contact with the component after assembly with the component. At least one of the deflectable members and the component has a thickness not greater than about 1000 microns.

    Abstract translation: 一种装置，包括至少三个可偏转构件，每个可挠曲构件构造成在与构件组装期间偏转，并且还构造成在与构件组装之后保持与构件接触。 可偏转构件和部件中的至少一个具有不大于约1000微米的厚度。

    Micromachined fluidic coupler and method of making the same
    15.
    发明授权
    Micromachined fluidic coupler and method of making the same 失效
    微加工流体耦合器及其制造方法

    公开(公告)号：US06672629B2

    公开(公告)日：2004-01-06

    申请号：US10198013

    申请日：2002-07-18

    Applicant: Yu-Chong Tai ,  Shuyun Wu ,  Ellis Fan-chuin Meng

    Inventor： Yu-Chong Tai ,  Shuyun Wu ,  Ellis Fan-chuin Meng

    IPC: F16L1700

    CPC classification number: B81B1/00 ,  B81B2201/13

    Abstract: A micromachined coupler for coupling a capillary having a first size to an orifice having a shape and a second size, has a body which has a shape conforming the shape of the cavity into which the body must fit. A through hole is defined through the body. The through hole has a size conforming to the first size of the capillary. The capillary is disposable into the through hole so that the capillary is communicated to the orifice without the first and second sizes necessarily being the same. The cavity and the body have conforming slanting surfaces, and in particular the cavity and the body define truncated pyramidal shapes. The cavity and the body each have a truncated pyramidal shape. The pyramidal shape may be square, triangular, or conical. A method of fabricating the micromachined coupler is achieved either by micromaching or micromolding.

    Abstract translation: 用于将具有第一尺寸的毛细管耦合到具有形状和第二尺寸的孔口的微机械加工器具有具有与主体必须配合的空腔形状一致的形状的主体。 通孔穿过身体。 通孔的尺寸符合毛细管的第一尺寸。 毛细管一次性进入通孔，使得毛细管连通到孔口，而第一和第二尺寸必须相同。 空腔和主体具有一致的倾斜表面，特别是空腔和主体限定截锥形的形状。 空腔和身体各具有截头锥形。 锥体形状可以是正方形，三角形或圆锥形。 微加工耦合器的制造方法可以通过微机械加工或微型成型来实现。

    System and method for latching a micro-structure and a process for fabricating a micro-latching structure
    16.
    发明授权
    System and method for latching a micro-structure and a process for fabricating a micro-latching structure 失效
    用于锁定微结构的系统和方法以及用于制造微型锁存结构的工艺

    公开(公告)号：US06617185B1

    公开(公告)日：2003-09-09

    申请号：US10071772

    申请日：2002-02-07

    Applicant: Aaron Geisberger

    Inventor： Aaron Geisberger

    IPC: H01L2100

    CPC classification number: B81C1/00126 ,  B81B2201/031 ,  B81B2201/13 ,  B81C2201/0109 ,  H01H2001/0047 ,  H01H2001/0063 ,  H01H2061/006

    Abstract: In one embodiment, the present invention is directed to a method of fabricating a micro-mechanical latching device, comprising: depositing a structural layer in a fabrication plane, wherein the first structural layer possesses a topography; depositing a sacrificial layer adjacent to the first layer such that the sacrificial layer conforms to the topography of the first layer; depositing a second structural layer that conforms to the topography of the first layer; removing the sacrificial layer; and using at least the first structural layer and second structural layer to fabricate the micro-mechanical latching device.

    Abstract translation: 在一个实施例中，本发明涉及一种制造微机械闭锁装置的方法，包括：在制造平面中沉积结构层，其中所述第一结构层具有形貌; 沉积与第一层相邻的牺牲层，使得牺牲层符合第一层的形貌; 沉积符合第一层的形貌的第二结构层; 去除牺牲层; 并且至少使用第一结构层和第二结构层来制造微机械闭锁装置。

    Micromachined fluidic coupler and method of making the same
    17.
    发明授权
    Micromachined fluidic coupler and method of making the same 失效
    微加工流体耦合器及其制造方法

    公开(公告)号：US06428053B1

    公开(公告)日：2002-08-06

    申请号：US09516487

    申请日：2000-03-01

    Applicant: Yu-Chong Tai ,  Shuyun Wu

    Inventor： Yu-Chong Tai ,  Shuyun Wu

    IPC: F16L5700

    CPC classification number: B81B1/00 ,  B81B2201/13

    Abstract: A micromachined coupler for coupling a capillary having a first size to an orifice having a shape and a second size, has a body which has a shape conforming the shape of the cavity into which the body must fit. A through hole is defined through the body. The through hole has a size conforming to the first size of the capillary. The capillary is disposable into the through hole so that the capillary is communicated to the orifice without the first and second sizes necessarily being the same. The cavity and the body have conforming slanting surfaces, and in particular the cavity and the body define truncated pyramidal shapes. The cavity and the body each have a truncated pyramidal shape. The pyramidal shape may be square, triangular, or conical. A method of fabricating the micromachined coupler is achieved either by micromaching or micromolding.

    Abstract translation: 用于将具有第一尺寸的毛细管耦合到具有形状和第二尺寸的孔口的微机械加工器具有具有与主体必须配合的空腔形状一致的形状的主体。 通孔穿过身体。 通孔的尺寸符合毛细管的第一尺寸。 毛细管一次性进入通孔，使得毛细管连通到孔口，而第一和第二尺寸必须相同。 空腔和主体具有一致的倾斜表面，特别是空腔和主体限定截锥形的形状。 空腔和身体各具有截头锥形。 锥体形状可以是正方形，三角形或圆锥形。 微加工耦合器的制造方法可以通过微机械加工或微型成型来实现。

    Micromachining method and micromachined structure
    18.
    发明授权
    Micromachining method and micromachined structure 失效
    微加工方法和微加工结构

    公开(公告)号：US5976390A

    公开(公告)日：1999-11-02

    申请号：US769376

    申请日：1996-12-19

    Applicant: Hiroshi Muramatsu

    Inventor： Hiroshi Muramatsu

    IPC: B23K26/00 ,  B29C67/00 ,  B81C1/00 ,  B81C99/00 ,  G01P15/08 ,  G01P15/18 ,  H01L29/84 ,  H01L41/08 ,  H01L41/22 ,  H01L21/00 ,  B44C1/22

    CPC classification number: B81C3/008 ,  B81B2201/0235 ,  B81B2201/13 ,  B81B2203/0118 ,  B81B2203/0353

    Abstract: A minute structure such as a cantilever 11 is formed on a silicon substrate 10 and heated by irradiating a laser beam to a part of the cantilever 11, by which the cantilever 11 is bent. The two bent cantilevers 11 are inserted into through holes 14 in a crystal substrate 10 formed in advance, and the tip end portions 15 thereof are heated. The heared tip end portions 15 become thicker and at the same time shorter, so that the crystal substrate 12 can be fixed to the silicon substrate 10 without play. By heating a part of the minute structure by such a method, plastic deformation is produced, so that bending and deforming can be performed. Thereby, a three-dimensional micromachined structure is constructed and assembled.

    Abstract translation: 在硅基板10上形成诸如悬臂11的微小结构，并通过将激光束照射到悬臂11的一部分进行加热，悬臂11弯曲。 将两个弯曲的悬臂11插入到预先形成的晶体基板10中的通孔14中，并且其前端部15被加热。 再有，前端部15越来越厚，同时变短，晶体基板12能够在不发生游隙的情况下固定在硅基板10上。 通过这种方法加热微小结构的一部分，产生塑性变形，从而可进行弯曲变形。 由此，构造并组装三维微加工结构。

    THREE-DIMENSIONAL ELECTROMECHANICAL ADHESIVE DEVICES AND RELATED SYSTEMS AND METHODS
    19.
    发明申请
    THREE-DIMENSIONAL ELECTROMECHANICAL ADHESIVE DEVICES AND RELATED SYSTEMS AND METHODS 审中-公开

    公开(公告)号：US20190240845A1

    公开(公告)日：2019-08-08

    申请号：US16268381

    申请日：2019-02-05

    Applicant: MASSACHUSETTS INSTITUTE OF TECHNOLOGY

    Inventor： Anastasios John Hart ,  Sanha Kim

    IPC: B25J15/00 ,  H02N13/00 ,  B81B3/00

    CPC classification number: B25J15/0085 ,  B81B3/0054 ,  B81B2201/13 ,  H02N13/00

    Abstract: Controllable electromechanical adhesive devices including three-dimensional dielectrically-coated microstructures that are mechanically compliant are provided. The microstructures can be controlled to provide tunable electromechanical surface adhesion, allowing for dexterous gripping of microscale and/or macroscale objects. For example, the devices can tune the surface adhesion strength of one or more microstructures without complex mechanical actuation in a wide range of on/off ratios with low voltage. The devices can be configured as a force sensor capable of providing tactile feedback for determining the load applied against the microstructures by the surface of an object. For example, the devices can provide output indicative of changes in an electrical property of one or more microstructures for determining the applied load of an object. The devices can be pixelated or otherwise configured to provide localized force sensing and/or surface adhesion. Related systems and methods for controlling the disclosed electromechanical adhesive devices are also described.

    Method of manufacturing micro structure, and substrate structure
    20.
    发明授权
    Method of manufacturing micro structure, and substrate structure 有权
    微结构制造方法及基板结构

    公开(公告)号：US08974626B2

    公开(公告)日：2015-03-10

    申请号：US13069154

    申请日：2011-03-22

    Applicant: Takamichi Fujii ,  Akihiro Mukaiyama

    Inventor： Takamichi Fujii ,  Akihiro Mukaiyama

    IPC: B29C65/00 ,  H01L21/00 ,  B32B7/02 ,  B81C3/00

    CPC classification number: B32B7/02 ,  B32B2457/14 ,  B81B2201/13 ,  B81B2203/0338 ,  B81B2207/07 ,  B81C3/004 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T156/10 ,  Y10T428/2495

    Abstract: A method of manufacturing a micro structure, includes the steps of: preparing separate first and second substrates, the first substrate having a first surface on which a first structural body having a first height and a second structural body having a second height greater than the first height of the first structural body are arranged, the second substrate having a second surface; then placing the first and second substrates to cause the first and second surfaces to face each other across the first and second structural bodies; and then bonding the first and second substrates to each other while compressing the second structural body in a height direction thereof between the first and second surfaces to cause the second structural body to have a height defined by the first structural body.

    Abstract translation: 一种制造微结构的方法包括以下步骤：制备单独的第一和第二基底，所述第一基底具有第一表面，第一表面具有第一高度的第一结构体和具有第二高度的第二高度的第二结构体 布置第一结构体的高度，第二基底具有第二表面; 然后放置第一和第二基板以使第一和第二表面跨过第一和第二结构体彼此面对; 然后在第一和第二表面之间沿其高度方向压缩第二结构体以使第二结构体具有由第一结构体限定的高度，将第一和第二基板彼此接合。

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