公开(公告)号：US20170110641A1

公开(公告)日：2017-04-20

申请号：US15394464

申请日：2016-12-29

Applicant: XINTEC INC.

Inventor： Chien-Hung LIU

IPC: H01L35/08 ,  H01L27/146 ,  H01L35/34 ,  H01L21/78 ,  H01L35/10

CPC classification number: H01L35/08 ,  G01J5/024 ,  G01J5/045 ,  G01J5/20 ,  H01L21/78 ,  H01L23/053 ,  H01L23/3178 ,  H01L23/3185 ,  H01L23/498 ,  H01L24/33 ,  H01L24/94 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/1876 ,  H01L35/02 ,  H01L35/10 ,  H01L35/34 ,  H01L2224/11

Abstract: A semiconductor package includes a substrate, at lest one support, a cover, and a plate. The substrate has at least one light sensor or thermal sensor, a first surface, and a second surface opposite to the first surface. The light sensor or the thermal sensor is disposed on the first surface. The second surface has an opening to expose the light sensor (or the thermal sensor). The support is disposed on the first surface. The cover is disposed on the support, such that the cover is above the light sensor (or the thermal sensor) to form a first space between the cover and the light sensor (or the thermal sensor). The plate is placed on the second surface to cover the opening, such that a second space is formed between the plate and the light sensor (or the thermal sensor).

公开(公告)号：US09612159B2

公开(公告)日：2017-04-04

申请号：US14840320

申请日：2015-08-31

Applicant: Mitsubishi Electric Corporation

Inventor： Takaki Sugino

IPC: G01J5/02 ,  G01J5/08 ,  G01J5/10 ,  G01J5/20 ,  G01J5/04 ,  G01J5/06 ,  G01J5/34

CPC classification number: G01J5/0853 ,  G01J5/045 ,  G01J5/06 ,  G01J5/0818 ,  G01J5/0831 ,  G01J5/0875 ,  G01J5/10 ,  G01J5/20 ,  G01J2005/345

Abstract: An infrared sensor includes: a package; an infrared detecting element formed on the package, the infrared detecting element including a thermal detector and an absorber formed on the thermal detector which is configured to absorb infrared light rays of a specific wavelength that are detected by conversion of the infrared light rays into heat; and a cap formed on the package to cover the infrared detecting element, the cap including: a body having front and rear surfaces, through which the infrared light rays transmit; and a shielding film, with a window formed therein, provided on at least one of the front and rear surfaces of the body, the infrared light rays being reflected by the shielding film other than a portion of the shielding film having the window, and every one of the infrared light rays passing through the window of the cap impinging on the absorber.

公开(公告)号：US20160245702A1

公开(公告)日：2016-08-25

申请号：US15048058

申请日：2016-02-19

Applicant: Commissariat A L'Energie Atomique et aux Energies Alternatives

Inventor： Geoffroy DUMONT ,  Laurent CARLE ,  Pierre IMPERINETTI ,  Stephane POCAS ,  Jean-Jacques YON

IPC: G01J5/04 ,  G01J5/20 ,  G01J5/34

CPC classification number: G01J5/045 ,  G01J5/0225 ,  G01J5/10 ,  G01J5/20 ,  G01J5/34 ,  G01J2005/0077

Abstract: A device for detecting electromagnetic radiation, including a substrate; at least one thermal detector, placed on the substrate, including an absorbing membrane suspended above the substrate; and an encapsulating structure encapsulating the thermal detector, including an encapsulating layer extending around and above the thermal detector so as to define with the substrate a cavity in which the thermal detector is located; wherein the encapsulating layer includes at least one through-orifice that is what is referred to as an exhaust vent, each exhaust vent being placed so that at least one thermal detector has a single exhaust vent located facing the corresponding absorbing membrane, preferably plumb with the centre of said absorbing membrane.

Abstract translation: 一种用于检测电磁辐射的装置，包括一基板; 至少一个热检测器，放置在基底上，包括悬浮在基底上方的吸收膜; 以及封装所述热检测器的封装结构，包括在所述热检测器周围和上方延伸的封装层，以便在所述基板上限定所述热检测器所在的腔; 其特征在于，所述封装层包括至少一个称为排气口的通孔，每个排气口被放置成使得至少一个热检测器具有面向相应的吸收膜的单个排气口，优选地， 所述吸收膜的中心。

公开(公告)号：US09394653B2

公开(公告)日：2016-07-19

申请号：US14249691

申请日：2014-04-10

Applicant: JOSEPH VOEGELE AG

Inventor： Arnold Rutz ,  Henning Delius ,  Martin Buschmann ,  Tobias Gotterbarm ,  Christian Pawlik

IPC: E01C23/07 ,  E01C19/48 ,  E01C23/01

CPC classification number: E01C23/01 ,  E01C19/48 ,  G01J5/025 ,  G01J5/045 ,  G01J5/048 ,  G01J2005/0077 ,  G01J2005/0081 ,  G06K9/00791 ,  H04N5/33

Abstract: The present disclosure relates to a road finishing machine with a thermographic device releasably fixed to a portion of the machine for recording a georeferenced thermographic data record of at least one region of a pavement layer. The thermographic device includes a housing in which a detection unit for detecting a thermographic data record and a further detection unit for detecting a space-related data record for the thermographic data record are disposed.

Abstract translation: 本公开涉及具有可释放地固定到机器的一部分的热成像设备的道路整理机，用于记录路面层的至少一个区域的地理参考热成像数据记录。 热成像设备包括壳体，其中设置有用于检测温度记录数据记录的检测单元和用于检测热成像数据记录的空间相关数据记录的另外的检测单元。

公开(公告)号：US09299862B2

公开(公告)日：2016-03-29

申请号：US14282559

申请日：2014-05-20

Applicant: Challentech International Corporation

Inventor： Chung-I Chiang ,  Yun-Kuei Chiu

IPC: H01L31/0203 ,  H01L31/09

CPC classification number: H01L31/0203 ,  G01J5/045 ,  H01L21/50 ,  H01L23/10 ,  H01L27/14618 ,  H01L27/14649 ,  H01L27/14683 ,  H01L31/09 ,  H01L2924/15153 ,  H01L2924/16195 ,  H01L2924/165

Abstract: A device package method and structure thereof. The method includes steps of: providing a base and a cover, and placing a sensing device on the bottom of cavity base; placing sealant between the cover and edge part of the base, and then covering the cover on the base; irradiating a laser on the edge part for melting the sealant, so as to bond the cover and edge part; and enabling the sealed space formed between the cover and the cavity base to be in vacuum. Therefore, sensing element with high sensitivity can be packaged and manufactured efficiently.

Abstract translation: 一种器件封装方法及其结构。 该方法包括以下步骤：提供基座和盖子，并将感测装置放置在腔体底部; 将密封剂放置在基座的盖和边缘部分之间，然后覆盖基座上的盖; 在边缘部分照射激光以熔化密封剂，以便将盖和边缘部分结合; 并且使得形成在盖和空腔基座之间的密封空间成为真空。 因此，可以有效地包装和制造具有高灵敏度的感测元件。

公开(公告)号：US09236522B2

公开(公告)日：2016-01-12

申请号：US14091550

申请日：2013-11-27

Applicant: Robert Bosch GmbH

Inventor： Ashwin K. Samarao ,  Gary O'Brien ,  Ando Feyh ,  Fabian Purkl ,  Gary Yama

IPC: H01L31/0232 ,  H01L31/18 ,  G01J5/04 ,  G01J5/08 ,  G01J5/02 ,  G01J5/10 ,  G01J5/20

CPC classification number: H01L31/18 ,  G01J5/024 ,  G01J5/045 ,  G01J5/0815 ,  G01J5/0837 ,  G01J5/0856 ,  G01J5/10 ,  G01J5/20

Abstract: A method of fabricating a semiconductor device includes forming an absorber on a substrate, and supporting a cap layer over the substrate to define a cavity between the substrate and the cap layer in which the absorber is located. The method further includes forming a lens layer on the cap layer. The lens layer is spaced apart from the cavity and defines a plurality of grooves and an opening located over the absorber.

Abstract translation: 制造半导体器件的方法包括在衬底上形成吸收体，并在衬底上支撑覆盖层以在衬底和吸收体所在的覆盖层之间限定空腔。 该方法还包括在盖层上形成透镜层。 透镜层与空腔间隔开并且限定多个凹槽和位于吸收体上方的开口。

公开(公告)号：US20150369668A1

公开(公告)日：2015-12-24

申请号：US14761807

申请日：2014-01-20

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Yoshifumi WATABE ,  Sadayuki SUMI ,  Yuichi INABA ,  Junichi HOZUMI ,  Takahiko HIRAI ,  Tsuyoshi KURODA

IPC: G01J5/00 ,  G01J5/34

CPC classification number: G01J5/0014 ,  G01J1/0271 ,  G01J3/42 ,  G01J5/045 ,  G01J5/046 ,  G01J5/0815 ,  G01J5/0831 ,  G01J5/0853 ,  G01J5/0862 ,  G01J5/0875 ,  G01J5/16 ,  G01J5/34 ,  H01L37/02

Abstract: An infrared detection element includes first and second pyroelectric elements which are arranged in a single pyroelectric substrate. First pyroelectric element includes a first surface electrode. a first back face electrode, and a first portion interposed between first surface and back face electrodes. First portion is provided as part of pyroelectric substrate. Second pyroelectric element includes a second surface electrode, a second back face electrode, and a second portion interposed between second surface and back face electrodes. Second portion is provided as part of pyroelectric substrate. Pyroelectric substrate is provided in part thereof surrounding first pyroelectric element with a slit shaped along an outer periphery of first pyroelectric element. Slit is formed out of regions in which a first surface wiring and a first back face wiring are disposed. Part of pyroelectric substrate surrounding second pyroelectric element is continuously formed over an entire circumference of second portion.

Abstract translation: 红外线检测元件包括布置在单个热电基底中的第一和第二热电元件。 第一热电元件包括​​第一表面电极。 第一背面电极和介于第一表面和背面电极之间的第一部分。 第一部分被提供为热电基片的一部分。 第二热电元件包括​​第二表面电极，第二背面电极和介于第二表面和背面电极之间的第二部分。 第二部分被提供为热电基片的一部分。 热电基板的一部分设置有第一热电元件，沿着第一热电元件的外周形成有狭缝。 在其中设置有第一表面布线和第一背面布线的区域中形成狭缝。 围绕第二热电元件的热电基板的一部分在第二部分的整个圆周上连续地形成。

公开(公告)号：US09157805B2

公开(公告)日：2015-10-13

申请号：US13845897

申请日：2013-03-18

Applicant: NEC CORPORATION

Inventor： Takao Yamazaki ,  Seiji Kurashina

IPC: G01J5/04 ,  G01J5/06

CPC classification number: G01J5/045 ,  G01J5/048 ,  G01J5/061 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: According to the present invention, the gas adsorption capability of a getter can be maintained while the characteristics of an infrared ray sensor element are prevented from being deteriorated. An infrared ray sensor package has an infrared ray sensor element, a base substrate, a housing, an infrared ray transmission window, and a getter. The infrared ray sensor element is vacuum-sealed in a space surrounded by the base substrate, the housing, and the infrared ray transmission window. A spacer is disposed between the infrared ray sensor element and the base substrate to form a gap between the infrared ray sensor element and the base substrate. The getter is arranged in the gap formed between the infrared ray sensor element and the base substrate. A heat shielding member is disposed between the infrared ray sensor element and the getter. The heat shielding member is a heater for heating the infrared ray sensor element or an element formed of alloy containing Ni or heat-resistant glass.

Abstract translation: 根据本发明，可以保持吸气剂的气体吸附能力，同时防止红外线传感器元件的特性劣化。 红外线传感器封装具有红外线传感器元件，基底基板，外壳，红外线透射窗和吸气剂。 红外线传感器元件被真空密封在由基底基板，壳体和红外线透射窗包围的空间中。 在红外线传感器元件和基底基板之间设置间隔物，以在红外线传感器元件和基底基板之间形成间隙。 吸气剂布置在形成在红外线传感器元件和基底基板之间的间隙中。 在红外线传感器元件和吸气剂之间设置有热屏蔽构件。 隔热构件是用于加热红外线传感器元件的加热器或由含有Ni或耐热玻璃的合金形成的元件。

公开(公告)号：US20150144795A1

公开(公告)日：2015-05-28

申请号：US14547581

申请日：2014-11-19

Applicant: FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

Inventor： Ulrich Hofmann ,  Manfred Weiss ,  Joachim Janes ,  Frank Senger

IPC: G01J5/10 ,  G01J5/08 ,  G01J5/02

CPC classification number: G01J5/047 ,  G01J5/045 ,  G01J5/0806 ,  G01J5/0837 ,  G01J5/084 ,  G01J5/0871 ,  G01J5/44 ,  G01J2005/0077

Abstract: The present invention relates to a radiation imaging sensor with at least one detection element, which is implemented on a substrate as a micromechanical resonator and which absorbs the radiation to be detected. The resonator is set into a resonant oscillation with an excitation device and a shift in the resonance frequency of the detection element under exposure to radiation is detected with a detection device. The radiation sensor is characterized by the fact that it comprises a scanning device with a single-axis or multi-axis tiltable scanning element. The facility to tilt the device means that the detection element can be used to detect radiation from different directions. The imaging sensor can be realized in a compact manner and be economically produced.

Abstract translation: 本发明涉及具有至少一个检测元件的放射线成像传感器，该检测元件在作为微机械谐振器的基板上实现并且吸收待检测的辐射。 谐振器被设置为具有激励装置的谐振振荡，并且利用检测装置检测在暴露于辐射下的检测元件的谐振频率的偏移。 辐射传感器的特征在于它包括具有单轴或多轴可倾斜扫描元件的扫描装置。 倾斜设备的设备意味着检测元件可用于检测来自不同方向的辐射。 成像传感器可以以紧凑的方式实现并且经济地制造。

公开(公告)号：US20150022816A1

公开(公告)日：2015-01-22

申请号：US13947633

申请日：2013-07-22

Applicant: Honeywell International Inc.

Inventor： Christina Marie Schober ,  James A. Vescera ,  Jennifer S. Strabley

IPC: G01N21/59

CPC classification number: G01N21/59 ,  G01D11/245 ,  G01J5/045 ,  G01L19/144 ,  G04F5/14 ,  H05H7/14 ,  Y10T29/49002

Abstract: One embodiment is directed towards a physics package of an atomic sensor. The physics package includes a plurality of panes of optically transparent material enclosing a vacuum chamber and one or more wedges attached to an external surface of one or more of the panes. The physics package also includes at least one of a light source, photodetector, or mirror attached to the one or more wedges, the light source configured to generate an input light beam for the vacuum chamber, the photodetector configured to detect an output light beam from the vacuum chamber, and the mirror configured to reflect a light beam from the vacuum chamber back into the vacuum chamber, wherein the wedge is configured to oriented such a light source, photodetector, or mirror such that a respective light beam corresponding thereto transmits through a corresponding pane at an acute angle with respect to the corresponding pane.

Abstract translation: 一个实施例针对原子传感器的物理封装。 物理包装包括多个光学透明材料的窗格，其包围真空室以及附接到一个或多个窗格的外表面的一个或多个楔形物。 所述物理封装还包括附接到所述一个或多个楔块的光源，光电检测器或反射镜中的至少一个，所述光源被配置为产生用于所述真空室的输入光束，所述光电检测器被配置为检测来自 所述真空室和所述反射镜被配置为将来自所述真空室的光束反射回所述真空室中，其中所述楔构造成将所述光源，光电检测器或反射镜定向成使得与其对应的相应光束通过 相应的窗格相对于相应的窗格呈锐角。