Power semiconductor device with electrostatic discharge structure
    14.
    发明授权
    Power semiconductor device with electrostatic discharge structure 有权
    功率半导体器件具有静电放电结构

    公开(公告)号:US09166037B2

    公开(公告)日:2015-10-20

    申请号:US13101155

    申请日:2011-05-05

    申请人: Wei-Chieh Lin

    发明人: Wei-Chieh Lin

    摘要: A power semiconductor device with an electrostatic discharge (ESD) structure includes an N-type semiconductor substrate, at least one ESD device, and at least one trench type transistor device. The N-type semiconductor has at least two trenches, and the ESD device is disposed in the N-type semiconductor substrate between the trenches. The ESD device includes a P-type first doped region, and an N-type second doped region and an N-type third doped region disposed in the P-type first doped region. The N-type second doped region is electrically connected to a gate of the trench type transistor device, and the N-type third doped region is electrically connected to a drain of the trench type transistor device.

    摘要翻译: 具有静电放电(ESD)结构的功率半导体器件包括N型半导体衬底,至少一个ESD器件和至少一个沟槽型晶体管器件。 N型半导体具有至少两个沟槽,并且ESD器件设置在沟槽之间的N型半导体衬底中。 ESD器件包括P型第一掺杂区域和设置在P型第一掺杂区域中的N型第二掺杂区域和N型第三掺杂区域。 N型第二掺杂区域电连接到沟槽型晶体管器件的栅极,并且N型第三掺杂区域电连接到沟槽型晶体管器件的漏极。

    BOTTOM SOURCE NMOS TRIGGERED ZENER CLAMP FOR CONFIGURING AN ULTRA-LOW VOLTAGE TRANSIENT VOLTAGE SUPPRESSOR (TVS)
    16.
    发明申请
    BOTTOM SOURCE NMOS TRIGGERED ZENER CLAMP FOR CONFIGURING AN ULTRA-LOW VOLTAGE TRANSIENT VOLTAGE SUPPRESSOR (TVS) 审中-公开
    底电源NMOS触发钳位钳位用于配置超低电压瞬态电压抑制器(TVS)

    公开(公告)号:US20150084117A1

    公开(公告)日:2015-03-26

    申请号:US14037205

    申请日:2013-09-25

    申请人: Madhur Bobde

    发明人: Madhur Bobde

    IPC分类号: H01L29/78 H01L29/70 H01L29/66

    摘要: A low voltage transient voltage suppressing (TVS) device supported on a semiconductor substrate supporting an epitaxial layer to form a bottom-source metal oxide semiconductor field effect transistor (BS-MOSFET) that comprises a trench gate surrounded by a drain region encompassed in a body region disposed near a top surface of the semiconductor substrate. The drain region interfaces with the body region constituting a junction diode. The drain region on top of the epitaxial layer constituting a bipolar transistor with a top electrode disposed on the top surface of the semiconductor functioning as a drain/collector terminal and a bottom electrode disposed on a bottom surface of the semiconductor substrate functioning as a source/emitter electrode. The body regions further comprises a surface body contact region electrically connected to a body-to-source short-connection thus connecting the body region to the bottom electrode functioning as the source/emitter terminal.

    摘要翻译: 一种支撑在支撑外延层以形成底部源极金属氧化物半导体场效应晶体管(BS-MOSFET)的半导体衬底上的低电压瞬态电压抑制(TVS)器件,其包括被包围在体内的漏极区域包围的沟槽栅极 区域设置在半导体衬底的顶表面附近。 漏区与构成结二极管的体区接合。 外延层顶部的漏极区域构成双极晶体管,其顶部电极设置在用作漏极/集电极端子的半导体的顶表面上,而底部电极设置在用作源极/集电极端子的半导体衬底的底表面上, 发射电极。 主体区域还包括电连接到主体到源短路连接的表面体接触区域,从而将身体区域连接到用作源极/发射极端子的底部电极。

    SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
    17.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20150001579A1

    公开(公告)日:2015-01-01

    申请号:US14485554

    申请日:2014-09-12

    摘要: A capacitive component region is formed below a temperature detecting diode or below a protective diode. In addition, the capacitive component region is formed below an anode metal wiring line connecting the temperature detecting diode and an anode electrode pad and below a cathode metal wiring line connecting the temperature detecting diode and a cathode electrode pad. The capacitive component region is an insulating film interposed between polysilicon layers. Specifically, a first insulating film, a polysilicon conductive layer, and a second insulating film are sequentially formed on a first main surface of a semiconductor substrate, and the temperature detecting diode, the protective diode, the anode metal wiring line, or the cathode metal wiring line is formed on the upper surface of the second insulating film. Therefore, it is possible to improve the static electricity resistance of the temperature detecting diode or the protective diode.

    摘要翻译: 电容分量区形成在温度检测二极管的下方或保护二极管的下方。 此外,电容分量区域形成在连接温度检测二极管和阳极电极焊盘的阳极金属布线下方以及连接温度检测二极管和阴极电极焊盘的阴极金属布线的下方。 电容分量区域是介于多晶硅层之间的绝缘膜。 具体地,在半导体衬底的第一主表面上依次形成第一绝缘膜,多晶硅导电层和第二绝缘膜,并且温度检测二极管,保护二极管,阳极金属布线或阴极金属 布线在第二绝缘膜的上表面上形成。 因此,可以提高温度检测二极管或保护二极管的静电电阻。

    Semiconductor device with an integrated poly-diode
    19.
    发明授权
    Semiconductor device with an integrated poly-diode 有权
    具有集成多极二极管的半导体器件

    公开(公告)号:US08878343B2

    公开(公告)日:2014-11-04

    申请号:US13849825

    申请日:2013-03-25

    摘要: A field effect semiconductor device includes a semiconductor body having a main horizontal surface and a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type arranged between the first semiconductor region and the main horizontal surface, an insulating layer arranged on the main horizontal surface, and a first metallization arranged on the insulating layer. The first and second semiconductor regions form a pn-junction. The semiconductor body further has a deep trench extending from the main horizontal surface vertically below the pn-junction and including a conductive region insulated from the first semiconductor region and the second semiconductor region, and a narrow trench including a polycrystalline semiconductor region extending from the first metallization, through the insulating layer and at least to the conductive region. A vertical poly-diode structure including a horizontally extending pn-junction is arranged at least partly in the narrow trench.

    摘要翻译: 场效应半导体器件包括具有主水平表面和第一导电类型的第一半导体区域的半导体本体,布置在第一半导体区域和主水平表面之间的第二导电类型的第二半导体区域,布置成 在主水平表面上,以及布置在绝缘层上的第一金属化。 第一和第二半导体区域形成pn结。 半导体本体还具有从垂直于pn结的下方的主水平表面延伸的深沟槽,并且包括与第一半导体区域和第二半导体区域绝缘​​的导电区域,以及包括从第一半导体区域延伸的多晶半导体区域的窄沟槽 通过绝缘层和至少导电区域进行金属化。 包括水平延伸的pn结的垂直多极二极管结构至少部分地布置在窄沟槽中。