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    Method and apparatus for improving packaging density of discrete electronic components
    231.
    发明授权
    Method and apparatus for improving packaging density of discrete electronic components 失效
    用于提高分立电子部件的封装密度的方法和装置

    公开(公告)号：US4085433A

    公开(公告)日：1978-04-18

    申请号：US744136

    申请日：1976-11-22

    Applicant: Conrad J. Baranowski

    Inventor： Conrad J. Baranowski

    IPC: H05K1/18 ,  H05K1/04

    CPC classification number: H05K1/189 ,  H05K2201/042 ,  H05K2201/046 ,  H05K2201/09445 ,  H05K2201/10303 ,  H05K2201/10454 ,  H05K2201/10515 ,  H05K2201/10651

    Abstract: A method for increasing the packaging density of discrete electronic components. The components are mounted to a flexible printed circuit board at predetermined locations with normal orientation with respect to the board. The board is then folded in such a manner that the bodies of the components are mutually interleaved and are interleaved with other circuit components and terminals. A package with such interleaved components is also disclosed.

    Abstract translation: 一种用于提高分立电子部件的封装密度的方法。 组件在相对于板的正常定向的预定位置安装到柔性印刷电路板。 然后以这样一种方式折叠该板，使得这些部件的主体相互交错并与其他电路部件和端子交错。 还公开了具有这种交错部件的封装。

    Electrical circuit assemblies
    232.
    发明授权
    Electrical circuit assemblies 失效
    电路总成

    公开(公告)号：US3810300A

    公开(公告)日：1974-05-14

    申请号：US27399472

    申请日：1972-07-21

    Applicant: FERRANTI LTD

    Inventor： HULMES H ,  PICKIN J

    IPC: H01L23/495 ,  H05K1/18 ,  H05K3/20 ,  H05K3/32 ,  H05K3/34 ,  B01J17/00

    CPC classification number: H01L23/49558 ,  H01L23/49575 ,  H01L2924/0002 ,  H05K1/187 ,  H05K3/202 ,  H05K3/32 ,  H05K3/3447 ,  H05K2201/09118 ,  H05K2201/10424 ,  H05K2201/10651 ,  H05K2203/1316 ,  H05K2203/175 ,  Y10T29/49004 ,  Y10T29/49121 ,  H01L2924/00

    Abstract: An electrical circuit assembly having a plurality of components and including at least one semiconductor device is formed, without employing a printed circuit board as is conventional with such arrangements, by mounting the semiconductor device on a lead frame, encapsulating the semiconductor device to form together with conductors associated with the semiconductor device a unitary construction, and providing a completed assembly of sufficient strength, after all the conductors of the lead frame have been rendered electrically discrete, by connecting the remainder of the assembly to the unitary construction and/or by encapsulating at least another part of the assembly; it being possible thereby also to test the different components either individually or in appropriate combinations during the manufacture of the assembly.

    Abstract translation: 形成具有多个部件并且包括至少一个半导体器件的电路组件，不采用常规的这种布置的印刷电路板，通过将半导体器件安装在引线框架上，封装半导体器件与 与半导体器件相关联的导体是单一结构的，并且在引线框架的所有导体已经变得电离散之后，通过将组件的其余部分连接到单一构造和/或通过封装在 装配的另一部分; 因此，也可以在组装的制造期间单独地或以适当的组合来测试不同的部件。

    Method of and device for mounting electric components on a mounting panel
    233.
    发明授权
    Method of and device for mounting electric components on a mounting panel 失效
    用于安装安装面板上的电气部件的方法和装置

    公开(公告)号：US3793720A

    公开(公告)日：1974-02-26

    申请号：US3793720D

    申请日：1972-03-29

    Applicant: PHILIPS CORP

    Inventor： VAN RIJSEWIJK H ,  MEGENS L ,  OSKAM G

    IPC: H01C1/01 ,  H01G2/06 ,  H01G13/00 ,  H05K3/30 ,  H05K3/34 ,  H05K13/04

    CPC classification number: H05K3/306 ,  H05K3/301 ,  H05K3/3447 ,  H05K13/04 ,  H05K2201/10424 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2203/0173 ,  Y10T29/49139 ,  Y10T29/53174 ,  Y10T29/53265

    Abstract: A method of and device for mounting electric components on a mounting panel in which the components are provided in recesses of a dual jig and their connection wires are forced into the apertures of a mounting panel. During mounting, the connection wires are held at pitch and are accurately positioned relative to the recesses. Each component is provided with a sliding block surrounding the ends of the connection wires and the circumference of which corresponds to the circumference of a recess in the jig. By moving the two parts of the jig against each other, the sliding block is moved relative to the connection wires so that the ends thereof are freed and are forced into the apertures of the mounting panel.

    Abstract translation: 一种用于将电气部件安装在安装面板上的方法和装置，其中部件设置在双夹具的凹部中并且其连接线被迫进入安装板的孔中。 在安装期间，连接线保持间距并且相对于凹部精确定位。 每个部件设置有围绕连接线的端部并且其圆周对应于夹具中的凹部的圆周的滑块。 通过使夹具的两个部分彼此相对移动，滑动块相对于连接线移动，使得其端部被释放并被迫进入安装面板的孔中。

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