公开(公告)号：US20200241068A1

公开(公告)日：2020-07-30

申请号：US16746201

申请日：2020-01-17

Applicant: STMicroelectronics Pte Ltd

Inventor： Pedro Jr Santos PERALTA ,  David GANI

IPC: G01R31/28 ,  G01R31/26 ,  G01R31/3185 ,  H01L21/66

Abstract: A method of testing integrated circuit die for presence of a crack includes performing back end integrated circuit fabrication processes on a wafer having a plurality of integrated circuit die, the back end fabrication including an assembly process. The assembly process includes a) lowering a tip of a first manipulator arm to contact a given die such that pogo pins extending from the tip make electrical contact with conductive areas on the given die so that the pogo pins are electrically connected to a crack detector on the given die, b) picking up the given die using the first manipulator arm, and c) performing a conductivity test on the crack detector using the pogo pins to determine presence of a crack in the given die that extends from a periphery of the die, through a die seal ring of the die, and into an integrated circuit region of the die.

公开(公告)号：US10600758B2

公开(公告)日：2020-03-24

申请号：US16189010

申请日：2018-11-13

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jian Zhou

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/31 ,  H01L23/10 ,  H01L21/50

Abstract: A package packaged with a cap. The package features trenches, through holes, and a non-conductive coupling element forming a locking mechanism integrated embedded or integrated within a substrate. The package has a cap coupled to the non-conductive coupling element through ultrasonic plastic welding. The package protects the dice from an outside environment or external stresses or both. A method is desired to form package to reduce glue overflow defects in the package. Fabrication of the package comprises drilling holes in a substrate; forming trenches in the substrate; forming a non-conductive coupling element in the through holes and the trenches to form a locking mechanism; allowing the non-conductive coupling element to harden and cure; coupling a die or dice to the substrate; and coupling a cap to the non-conductive coupling element to protect the die or dice from an outside environment or external stresses or both.

公开(公告)号：US10254261B2

公开(公告)日：2019-04-09

申请号：US15213100

申请日：2016-07-18

Applicant: STMicroelectronics Pte Ltd

Inventor： Olivier Le Neel ,  Tien Choy Loh ,  Shian Yeu Kam ,  Ravi Shankar

IPC: G01N25/22 ,  G01N33/00

Abstract: A microelectronic device capable of detecting multiple gas constituents in ambient air can be used to monitor air quality. The microelectronic air quality monitor includes a plurality of temperature-sensitive gas sensors tuned to detect different gas species. Each gas sensor is tuned by programming an adjacent heater. An insulating air pocket formed below the sensor helps to maintain the sensor at a desired temperature. A temperature sensor may also be integrated with each gas sensor to provide additional feedback control. The heater, temperature sensor, and gas sensors are in the form of patternable thin films integrated on a single microchip. The device can be incorporated into computer workstations, smart phones, clothing, or other wearable accessories to function as a personal air quality monitor that is smaller, more accurate, and less expensive than existing air quality sensors.

公开(公告)号：US09831357B2

公开(公告)日：2017-11-28

申请号：US13907280

申请日：2013-05-31

Applicant: STMicroelectronics Pte Ltd. ,  STMicroelectronics R&D Limited

Inventor： Yonggang Jin ,  David Lawson ,  Colin Campbell ,  Anandan Ramasamy

IPC: H01L31/0216 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/101

CPC classification number: H01L31/02165 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02327 ,  H01L31/1013 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: Embodiments of the present disclosure are directed to optical packages having a package body that includes a light protection coating on at least one surface of a transparent material. The light protection coating includes one or more openings to allow light to be transmitted to the optical device within the package body. In one embodiment, the light protection coating and the openings allow substantially perpendicular radiation to be directed to the optical device within the package body. In one exemplary embodiment the light protection coating is located on an outer surface of the transparent material. In another embodiment, the light protection coating is located on an inner surface of the transparent material inside of the package body.

公开(公告)号：US09824924B2

公开(公告)日：2017-11-21

申请号：US13853856

申请日：2013-03-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Kim-Yong Goh ,  Xueren Zhang ,  Yiyi Ma

IPC: H01L23/02 ,  H01L21/78 ,  H01L23/00 ,  B81B7/00 ,  H01L23/053

CPC classification number: H01L21/78 ,  B81B7/0048 ,  H01L23/053 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/29198 ,  H01L2224/32058 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83007 ,  H01L2924/00014 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/16151 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments are directed to a package that includes an electric device having a recess. In one embodiment, the electric device is a sensor and the recess reduces signal drift of the sensor caused by thermal expansion of the package. In another embodiment, the recess is substantially filled with adhesive material, thus increasing adhesion between the electric device and a substrate of the package while at the same time allowing for lower adhesive fillets.

公开(公告)号：US09754756B2

公开(公告)日：2017-09-05

申请号：US15150895

申请日：2016-05-10

Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS PTE LTD

Inventor： Davide Giuseppe Patti ,  Myung Sung Kim

IPC: H01J1/02 ,  H01J19/02 ,  H01J9/18 ,  H01J21/20 ,  H01J21/04

CPC classification number: H01J19/02 ,  H01J9/025 ,  H01J9/18 ,  H01J21/04 ,  H01J21/105 ,  H01J21/20 ,  H01J2209/012 ,  H01J2209/02

Abstract: A vacuum integrated electronic device has an anode region of conductive material; an insulating region on top of the anode region; a cavity extending through the insulating region and having a sidewall; and a cathode region. The cathode region has a tip portion extending peripherally within the cavity, adjacent to the sidewall of the cavity. The cathode region is formed by tilted deposition, carried out at an angle of 30-60° with respect to a perpendicular to the surface of device.

公开(公告)号：US09697896B2

公开(公告)日：2017-07-04

申请号：US14623300

申请日：2015-02-16

Applicant: STMICROELECTRONICS S.r.l. ,  STMICROELECTRONICS PTE LTD

Inventor： Antonino Conte ,  Alberto Jose′ Di Martino ,  Kailash Khairnar

IPC: G11C13/00 ,  G11C8/04

CPC classification number: G11C13/0069 ,  G11C8/04 ,  G11C13/0004 ,  G11C13/0023 ,  G11C13/0026 ,  G11C13/0061 ,  G11C13/0097 ,  G11C2213/79

Abstract: A phase change non-volatile memory device has a memory array with a plurality of memory cells arranged in rows and columns, a column decoder and a row decoder designed to select columns, and, respectively, rows of the memory array during operations of programming of corresponding memory cells. A control logic, coupled to the column decoder and the row decoder, is designed to execute a sequential programming command, to control the column decoder and row decoder to select one column of the memory array and execute sequential programming operations on a desired block of memory cells belonging to contiguous selected rows of the selected column.

公开(公告)号：US09583666B2

公开(公告)日：2017-02-28

申请号：US14668309

申请日：2015-03-25

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H01L31/16 ,  H01L25/16 ,  H01L31/02 ,  H01L31/0232 ,  G01S17/02 ,  G01S7/481

CPC classification number: H01L31/16 ,  G01S7/4813 ,  G01S17/026 ,  H01L25/167 ,  H01L31/02002 ,  H01L31/02325 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92227 ,  H01L2224/97 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A proximity sensor includes a semiconductor die, a light emitting assembly, a redistribution layer, and an encapsulating layer. A surface of the semiconductor die includes a sensor area and contact pads. A lens is positioned over the sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads that face the redistribution layer. A side of the redistribution layer includes contact pads. Electrical connectors place each of the contact pads of the semiconductor die in electrical communication with a respective one of the contact pads of the redistribution layer. The encapsulating layer is positioned on the redistribution layer and at least partially encapsulates the semiconductor die, the lens over the sensor area of the semiconductor die, and the light emitting assembly.

Abstract translation: 接近传感器包括半导体管芯，发光组件，再分配层和封装层。 半导体管芯的表面包括传感器区域和接触焊盘。 透镜位于半导体管芯的传感器区域上方。 发光组件包括具有发光区域的发光器件，位于发光区域上方的透镜以及面向再分布层的接触焊盘。 再分布层的一侧包括接触垫。 电连接器使得半导体管芯的每个接触焊盘与再分配层的接触焊盘中的相应一个电连通。 封装层位于再分配层上，并且至少部分地封装半导体管芯，半导体管芯的传感器区域上的透镜以及发光组件。

公开(公告)号：US09529433B2

公开(公告)日：2016-12-27

申请号：US14586547

申请日：2014-12-30

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Ravi Shankar ,  Olivier Leneel

IPC: G06F3/01 ,  G09G5/18

CPC classification number: G06F3/014 ,  G09G5/18 ,  G09G2370/16

Abstract: A flexible smart glove detects fine hand and finger motions while permitting the wearer to make hand gestures with dexterity. The flexible smart glove has a thickness of less than about 100 μm and incorporates capacitive micro-sensors positioned at finger joint locations. The micro-sensors are thin film devices built on substrates made of a pliable material such as polyimide. Interdigitated serpentine capacitors monitor strain in the back of the hand, while parallel plate capacitors monitor contact pressure on the palm. Thus the smart glove responds electrically to various types of hand motions. Thin film resistors responsive to changes in body temperature are also formed on the flexible substrate. Motion and temperature data is transmitted from the glove to a microprocessor via a passive RFID tag or an active wireless transmitter. An ASIC is embedded in the smart glove to relay real time sensor data to a remote processor.

Abstract translation: 灵活的智能手套可以检测精细的手指和手指运动，同时允许佩戴者灵巧地进行手势。 柔性智能手套具有小于约100μm的厚度，并且包括位于手指接合位置处的电容式微传感器。 微传感器是由诸如聚酰亚胺等柔韧材料制成的基板上的薄膜装置。 交叉蛇形电容器用于监测手背的应变，而平行电容器则监测手掌上的接触压力。 因此，智能手套电动响应于各种类型的手动。 响应于体温变化的薄膜电阻也形成在柔性基板上。 运动和温度数据通过无源RFID标签或有源无线发射器从手套传送到微处理器。 ASIC嵌入智能手套中以将实时传感器数据中继到远程处理器。

公开(公告)号：US09337111B2

公开(公告)日：2016-05-10

申请号：US13853496

申请日：2013-03-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Yohanes Bintang

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/66 ,  H01L23/31

CPC classification number: H01L22/14 ,  H01L22/20 ,  H01L23/3128 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/15311 ,  H01L2224/48227 ,  H01L2924/00012

Abstract: A semiconductor package includes an RFID chip positioned between a first die and a second die attached to a support substrate. The RFID chip is free of electrical connections to the dice and the support substrate. The RFID chip is sized to correspond to an interposer board. Data pertaining to operating characteristics of the dice are stored to and read from the RFID chip during back-end processing to determine abnormalities and improve yield. Said data may be stored to a database corresponding to the RFID chip in the package. A method of making a semiconductor package having an RFID chip positioned between dice is provided. The package is traceable by customers via the data stored to the RFID chip and the database.

Abstract translation: 半导体封装包括位于第一管芯和附接到支撑衬底的第二管芯之间的RFID芯片。 RFID芯片没有与骰子和支撑基板的电连接。 RFID芯片的大小对应于插入板。 关于骰子的操作特性的数据在后端处理期间被存储到RFID芯片并从其读取，以确定异常并提高产量。 所述数据可以存储在与包装中的RFID芯片相对应的数据库中。 提供了一种制造具有位于晶片之间的RFID芯片的半导体封装的方法。 该包可以通过存储到RFID芯片和数据库的数据由客户追踪。