Abstract:
Methods are provided for forming silicon dioxide (SiO2) on a silicon carbide (SiC) substrate. The method comprises: providing a SiC substrate; supplying an atmosphere including oxygen; performing a high-density (HD) plasma-based process; and, forming a SiO2 layer overlying the SiC substrate. Typically, performing the HD plasma-based process includes connecting a top electrode to an inductively coupled HD plasma source. In one aspect, SiO2 is grown on the SiC substrate. Then, an HD plasma oxidation process is performed that creates a reactive oxygen species and breaks the Si—C bonds in the SiC substrate, to form free Si and C atoms in the SiC substrate. The free Si atoms in the SiC substrate are bonded to the HD plasma-generated reactive oxygen species, and the SiO2 layer is grown.
Abstract:
A system and method for implementing single hop space segment terminal to terminal connections. The system includes a satellite-based radio frequency (RF) communication link for conveying multiple communication channels over the space segment via one or more spot beams. A terrestrial supervisory transceiver such as a gateway station is provided in communication with the satellite-based communication link. Mobile hand-held terminals (HHTs), herein first and second access terminals, may be located within one or more of the spot beams to communicate with one another via a single hop connection through a satellite of the system. A switch is provided for communication switching with the satellite of the system for the multiple communication channels to couple the first access terminal and the second access terminal over the space segment via one or more of the spot beams. The terrestrial supervisory transceiver or gateway is provided in communication with the satellite switch via the satellite-based communication link for implementing the single hop space segment terminal to terminal connection.
Abstract:
A computing system that contains an apparatus comprising an instruction memory to store a plurality of lines of a plurality of instructions, and a branch memory to store a plurality of branch prediction entries, each branch prediction entry containing information for predicting whether a branch designated by a branch instruction stored in the instruction memory will be taken when the branch instruction is executed. Each branch prediction entry includes a branch target field for indicating a target address of a line containing a target instruction to be executed if the branch is taken, a destination field indicating where the target instruction is located within the line indicated by the branch target address, and a source field indicating where the branch instruction is located within the line corresponding to the target address. A counter stores an address value used for addressing the instruction memory, and an incrementing circuit increments the address value in the counter for sequentially addressing the lines in the instruction memory during normal sequential operation. A counter loading circuit loads the target address into the counter when the branch prediction entry predicts the branch designated by the branch instruction stored in the instruction memory will be taken when the branch instruction is executed, causing the line containing the target instruction to be fetched and entered into the pipeline immediately after the line containing the branch instruction. An invalidate circuit invalidates any instructions following the branch instruction in the line containing the branch instruction and prior to the target instruction in the line containing the target instruction.
Abstract:
A first processor receives a write request from an input/output (I/O) device connected to the first processor. The first processor determines whether the write request satisfies an allocating write criterion. Responsive to determining that the write request satisfies the allocating write criterion, the first processor writes data associated with the write request to a cache of the first processor.
Abstract:
An 8T memory bit cell receives a clock signal and read and write address signals. A read address latch/clock circuit receives the clock signal and the read address signals and initiates a read operation during a first clock cycle state. A write address flip-flop/clock circuit receives the clock signal and the write address signals and initiates a write operation during a second clock cycle state. An inverter receives and inverts the clock signal and applies the inverted clock signal to the write address flip-flop/clock circuit. The read address latch/clock circuit initiates a read word line precharge operation during the second clock cycle state and a write word line precharge operation during the first clock cycle state. The write address flip-flop/clock circuit may also include a loose self-timer to end a write cycle is a clock signal continues beyond a predetermined time.
Abstract:
A method is provided for fabricating a semiconductor nanoparticle embedded Si insulating film for short wavelength luminescence applications. The method provides a bottom electrode, and deposits a semiconductor nanoparticle embedded Si insulating film, including the element of N, O, or C, overlying the bottom electrode. After annealing, a semiconductor nanoparticle embedded Si insulating film has a peak photoluminescence (PL) at a wavelength in the range of 475 to 750 nanometers.
Abstract:
A digitally-addressable, pixelated, DNA fluid-assay, active-matrix micro-structure formed, utilizing low-temperature TFT and Si technology, on a substrate preferably made of glass or plastic, and including at least one pixel which is defined by (a) an addressable pixel site, (b) a sensor home structure disposed within that site for receiving and hosting a functionalized assay site possessing a DNA oligonucleotide probe, and (c) an addressable, pixel-site-specific, energy-field-producing functionalizer (preferably optical) operable to functionalize such a probe on the assay site. Each pixel may also include a pixel-integrated optical detector. Further disclosed are related methodology facets involving (1) the making of such a micro-structure (a) in a precursor form (without a functionalized probe), and thereafter (b) in a finalized/functionalized form (with such a probe), and (2) the ultimate use of a completed micro-structure in the performance of a DNA assay.
Abstract:
A method is provided for fabricating a semiconductor nanoparticle embedded Si insulating film for electroluminescence (EL) applications. The method provides a bottom electrode, and deposits a semiconductor nanoparticle embedded Si insulating film, including an element selected from a group consisting of N and C, overlying the bottom electrode. After annealing, a semiconductor nanoparticle embedded Si insulating film is formed having an extinction coefficient (k) in a range of 0.01-1.0, as measured at about 632 nanometers (nm), and a current density (J) of greater than 1 Ampere per square centimeter (A/cm2) at an applied electric field lower than 3 MV/cm. In another aspect, the annealed semiconductor nanoparticle embedded Si insulating film has an index of refraction (n) in a range of 1.8-3.0, as measured at 632 nm, with a current density of greater than 1 A/cm2 at an applied electric field lower than 3 MV/cm.
Abstract translation:提供了一种用于制造用于电致发光(EL)应用的半导体纳米颗粒嵌入的Si绝缘膜的方法。 该方法提供底部电极,并且沉积半导体纳米颗粒嵌入的Si绝缘膜,其包括选自N和C组成的组的元素,覆盖在底部电极上。 在退火之后,形成半导体纳米颗粒嵌入的Si绝缘膜,其消光系数(k)在0.01〜1.0的范围内,在大约632纳米(nm)测量,电流密度(J)大于1安培 在施加的电场低于3MV / cm下的平方厘米(A / cm 2)。 在另一方面,被退火的半导体纳米颗粒嵌入的Si绝缘膜的折射率(n)在632nm处测量的范围为1.8-3.0,在施加的电场下的电流密度大于1A / cm 2 低于3 MV / cm。
Abstract:
An erbium (Er)-doped silicon (Si) nanocrystalline embedded silicon oxide (SiOx) waveguide and associated fabrication method are presented. The method provides a bottom layer, and forms an Er-doped Si nanocrystalline embedded SiOx film waveguide overlying the bottom layer, having a minimum optical attenuation at about 1540 nanometers (nm). Then, a top layer is formed overlying the Er-doped SiOx film. The Er-doped SiOx film is formed by depositing a silicon rich silicon oxide (SRSO) film using a high density plasma chemical vapor deposition (HDPCVD) process and annealing the SRSO film. After implanting Er+ ions, the Er-doped SiOx film is annealed again. The Er-doped Si nanocrystalline SiOx film includes has a first refractive index (n) in the range of 1.46 to 2.30. The top and bottom layers have a second refractive index, less than the first refractive index.
Abstract:
A thin-film transistor (TFT) with a multilayer gate insulator is provided, along with a method for forming the same. The method comprises: forming a channel, first source/drain (S/D) region, and a second S/D region in a Silicon (Si) active layer; using a high-density plasma (HDP) source, growing a first layer of Silicon oxide (SiOx) from the Si active layer, to a first thickness, where x is less than, or equal to 2; depositing a second layer of SiOx having a second thickness, greater than the first thickness, overlying the first layer of SiOx; using the HDP source, additionally oxidizing the second layer of SiOx, wherein the first and second SiOx layers form a gate insulator; and, forming a gate electrode adjacent the gate insulator. In one aspect, the second Si oxide layer is deposited using a plasma-enhanced chemical vapor deposition (PECVD) process with tetraethylorthosilicate (TEOS) precursors.