公开(公告)号：US07446295B2

公开(公告)日：2008-11-04

申请号：US11532911

申请日：2006-09-19

Applicant: Jian-Cheng Chen ,  Ming-Hsiang Cheng ,  Chia-Jung Lee

Inventor： Jian-Cheng Chen ,  Ming-Hsiang Cheng ,  Chia-Jung Lee

IPC: H01L27/00

CPC classification number: H01L27/14618 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00014

Abstract: An image sensor module including a substrate, an image signal processor, a supporting board, an image sensor chip and a cover is provided. A concavity is located on a surface of the substrate. The image signal processor is disposed in the concavity e, and is electrically connected to the substrate. The supporting board is disposed on the surface of the substrate and covers the concavity. The image sensor chip is disposed on the supporting board and electrically connected to the substrate. The cover is disposed on the substrate, and covers the image sensor chip.

Abstract translation: 提供了包括基板，图像信号处理器，支撑板，图像传感器芯片和盖的图像传感器模块。 凹部位于基板的表面上。 图像信号处理器设置在凹部e中，并且电连接到基板。 支撑板设置在基板的表面上并覆盖凹部。 图像传感器芯片设置在支撑板上并电连接到基板。 盖子设置在基板上并覆盖图像传感器芯片。

公开(公告)号：US20080048097A1

公开(公告)日：2008-02-28

申请号：US11532911

申请日：2006-09-19

Applicant: Jian-Cheng Chen ,  Ming-Hsiang Cheng ,  Chia-Jung Lee

Inventor： Jian-Cheng Chen ,  Ming-Hsiang Cheng ,  Chia-Jung Lee

IPC: H01L27/00

CPC classification number: H01L27/14618 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00014

Abstract: An image sensor module including a substrate, an image signal processor, a supporting board, an image sensor chip and a cover is provided. A concave is located on a surface of the substrate. The image signal processor is disposed in the concave, and is electrically connected to the substrate. The supporting board is disposed on the surface of the substrate and covers the concave. The image sensor chip is disposed on the supporting board and electrically connected to the substrate. The cover is disposed on the substrate, and covers the image sensor chip.

Abstract translation: 提供了包括基板，图像信号处理器，支撑板，图像传感器芯片和盖的图像传感器模块。 凹部位于基板的表面上。 图像信号处理器设置在凹部中，并且电连接到基板。 支撑板设置在基板的表面上并覆盖凹部。 图像传感器芯片设置在支撑板上并电连接到基板。 盖子设置在基板上并覆盖图像传感器芯片。

公开(公告)号：US07333263B2

公开(公告)日：2008-02-19

申请号：US11039822

申请日：2005-01-24

Applicant: Sheng-Lung Huang ,  Chia-Yao Lo ,  Kwang-Yao Huang ,  Jian-Cheng Chen ,  Chiang-Yuan Chuang ,  Chien-Chih Lai ,  Yen-Sheng Lin ,  Ping-Hui Sophia Yeh

Inventor： Sheng-Lung Huang ,  Chia-Yao Lo ,  Kwang-Yao Huang ,  Jian-Cheng Chen ,  Chiang-Yuan Chuang ,  Chien-Chih Lai ,  Yen-Sheng Lin ,  Ping-Hui Sophia Yeh

IPC: H01S3/00

CPC classification number: H01S3/06754 ,  C03C13/008 ,  C03C13/045 ,  H01S3/06716 ,  H01S3/1623 ,  H01S3/1643

Abstract: An optical amplifier includes an optical fiber having a core doped with transition metal ions, and at least one glass cladding enclosing the core. By using the fiber, the optical amplifier of the invention has a gain bandwidth of more than 300 nm including 1300-1600 nm band in low-loss optical communication.

Abstract translation: 光放大器包括具有掺杂有过渡金属离子的芯的光纤和包围芯的至少一个玻璃包层。 通过使用光纤，本发明的光放大器在低损耗光通信中具有大于300nm的增益带宽，包括1300-1600nm波段。

公开(公告)号：US07184266B1

公开(公告)日：2007-02-27

申请号：US11197372

申请日：2005-08-05

Applicant: Jian-Cheng Chen ,  Chun-Chang Shih

Inventor： Jian-Cheng Chen ,  Chun-Chang Shih

IPC: G06F1/16 ,  F16H59/00

CPC classification number: G06F1/18 ,  B60R11/0235 ,  B60R2011/0082 ,  B60R2011/0085 ,  B60R2011/0092 ,  F16H1/16 ,  F16H35/10 ,  G11B17/051 ,  G11B33/027 ,  G11B33/10 ,  Y10T74/19251

Abstract: An automatic monitor sliding system comprises a machine case, a slidable structure, a monitor mounting plate, and a monitor structure. The slidable structure is mounted inside a reception chamber of the machine case. The monitor mounting plate is mounted in front of the machine case. The monitor structure is mounted in front of the monitor mounting plate. As a result, the slidable structure slides the monitor structure forward to slant the monitor structure downward for facilitating the user to insert and retrieve the audio-visual disk. Consequently, the automatic monitor sliding system provides the functions of protecting machine, preventing dust, water permeation, and mistouch input, and providing high sliding radian.

Abstract translation: 一种自动监视器滑动系统，包括机壳，可滑动结构，监视器安装板和监视器结构。 可滑动结构安装在机壳的接收室内。 显示器安装板安装在机箱的前面。 显示器结构安装在显示器安装板的前面。 结果，可滑动结构向前滑动监视器结构以向下倾斜监视器结构，以便于用户插入和取回视听盘。 因此，自动监视器滑动系统提供保护机器的功能，防止灰尘，水渗透和误触输入，并提供高滑动弧度。

公开(公告)号：US20060164717A1

公开(公告)日：2006-07-27

申请号：US11039822

申请日：2005-01-24

Applicant: Sheng-Lung Huang ,  Chia-Yao Lo ,  Kwang-Yao Huang ,  Jian-Cheng Chen ,  Chiang-Yuan Chuang ,  Chien-Chih Lai ,  Yen-Sheng Lin ,  Ping-hui Yeh

Inventor： Sheng-Lung Huang ,  Chia-Yao Lo ,  Kwang-Yao Huang ,  Jian-Cheng Chen ,  Chiang-Yuan Chuang ,  Chien-Chih Lai ,  Yen-Sheng Lin ,  Ping-hui Yeh

IPC: H01S3/00

CPC classification number: H01S3/06754 ,  C03C13/008 ,  C03C13/045 ,  H01S3/06716 ,  H01S3/1623 ,  H01S3/1643

Abstract: An optical amplifier includes an optical fiber having a core doped with transition metal ions, and at least one glass cladding enclosing the core. By using the fiber, the optical amplifier of the invention has a gain bandwidth of more than 300 nm including 1300-1600 nm band in low-loss optical communication.

Abstract translation: 光放大器包括具有掺杂有过渡金属离子的芯的光纤和包围芯的至少一个玻璃包层。 通过使用光纤，本发明的光放大器在低损耗光通信中具有大于300nm的增益带宽，包括1300-1600nm波段。

公开(公告)号：US06201299B1

公开(公告)日：2001-03-13

申请号：US09339035

申请日：1999-06-23

Applicant: Su Tao ,  Chih-Ming Chung ,  Jian-Cheng Chen ,  Chun-Chi Lee

Inventor： Su Tao ,  Chih-Ming Chung ,  Jian-Cheng Chen ,  Chun-Chi Lee

IPC: H01L23053

CPC classification number: H01L24/97 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A substrate structure mainly comprises a plurality of substrate units and a plurality of dispensing holes thereon. A main hole is provided on the surface of the substrate unit, the two ends of which are adjacent to the dispensing hole for dispensing liquified encapsulant material to form a semiconductor package. The semiconductor package mainly comprises a chip, a substrate and an encapsulant. The chip is adhesively attached to the substrate, and the encapsulant covers around the are along one side of the chip. Then the encapsulant flows from the upper surface of the substrate to the lower surface to cover wire areas by means of the liquified encapsulant material flowing through the dispensing hole from the upper surface of the substrate to the lower surface.

Abstract translation: 基板结构主要包括多个基板单元和多个分配孔。 主孔设置在基板单元的表面上，其两端与用于分配液化的密封剂材料的分配孔相邻以形成半导体封装。 半导体封装主要包括芯片，衬底和密封剂。 芯片粘附到基板上，围绕芯片的密封剂覆盖在芯片的一侧。 然后，密封剂从基板的上表面流到下表面，通过从基板的上表面流到分配孔的液化的密封剂材料覆盖电线区域到下表面。

公开(公告)号：US08537315B2

公开(公告)日：2013-09-17

申请号：US13084799

申请日：2011-04-12

Applicant: Jian-Cheng Chen ,  Chih-Yung Hsieh ,  Bo-Chin Tsuei

Inventor： Jian-Cheng Chen ,  Chih-Yung Hsieh ,  Bo-Chin Tsuei

IPC: G02F1/1337 ,  G02F1/1343

CPC classification number: G02F1/133707 ,  G02F1/133753 ,  G02F1/134309

Abstract: A liquid crystal display (LCD) structure is provided. A first alignment layer and a first electrode layer are disposed on a liquid crystal layer. A second electrode layer and a second alignment layer disposed under the liquid crystal layer. The first alignment layer and the second alignment layer respectively have a plurality of alignment areas with different aligning directions. At least one of the first electrode layer and the second electrode layer includes a substrate material and a plurality of openings, and at least includes a plurality of electrode areas. The boundaries of the electrode areas correspond to the boundaries of the alignment areas. The directions of the openings in the electrode areas are between the aligning directions of the corresponding alignment areas of the first alignment layer and the second alignment layer.

Abstract translation: 提供了液晶显示（LCD）结构。 第一取向层和第一电极层设置在液晶层上。 设置在液晶层下方的第二电极层和第二取向层。 第一取向层和第二取向膜分别具有不同的取向方向的多个取向区域。 第一电极层和第二电极层中的至少一个包括基板材料和多个开口，并且至少包括多个电极区域。 电极区域的边界对应于对准区域的边界。 电极区域中的开口方向位于第一取向层和第二取向层的对应取向区域的​​对准方向之间。

公开(公告)号：US20120295187A1

公开(公告)日：2012-11-22

申请号：US13111980

申请日：2011-05-20

Applicant: Chen-Hua Tsai ,  Jian-Cheng Chen ,  Chin-Yueh Tsai ,  Yao-Jen Fan ,  Heng-Kun Chen ,  Hsiang Yang

Inventor： Chen-Hua Tsai ,  Jian-Cheng Chen ,  Chin-Yueh Tsai ,  Yao-Jen Fan ,  Heng-Kun Chen ,  Hsiang Yang

IPC: G03F1/00 ,  G06F17/50

CPC classification number: G03F1/70 ,  G06F17/5072 ,  G06F2217/12 ,  H01L21/0334 ,  H01L23/48 ,  H01L23/481 ,  H01L23/528 ,  H01L2924/0002 ,  Y02P90/265 ,  H01L2924/00

Abstract: A method for generating dummy patterns includes providing a layout region having a layout pattern with a first density, inserting a plurality of first dummy patterns with a second density corresponding to the first density in the layout pattern, dividing the layout region into a plurality of sub-regions with a third density, adjusting a size of the first dummy pattern according to a difference between the second density and the third density, and outputting the layout pattern and the first dummy patterns on a photomask.

Abstract translation: 一种用于产生虚拟图案的方法包括提供具有第一密度的布局图案的布局区域，在布局图案中插入具有与第一密度对应的第二密度的多个第一伪图案，将布局区域分成多个子图 具有第三密度的区域，根据第二密度和第三密度之间的差来调整第一伪图案的尺寸，并将布局图案和第一伪图案输出到光掩模上。

公开(公告)号：US20120025356A1

公开(公告)日：2012-02-02

申请号：US13114915

申请日：2011-05-24

Applicant: Kuo-Hsien Liao ,  Chi-Hong Chan ,  Jian-Cheng Chen ,  Chian-Her Ueng ,  Yu-Hsiang Sun

Inventor： Kuo-Hsien Liao ,  Chi-Hong Chan ,  Jian-Cheng Chen ,  Chian-Her Ueng ,  Yu-Hsiang Sun

IPC: H01L23/552 ,  H01L21/78

CPC classification number: H01L24/97 ,  H01L23/3121 ,  H01L23/49805 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The semiconductor device package includes a conformal shield layer applied to the exterior surface of the encapsulant. and an internal fence or separation structure embedded in the encapsulant. The fence separates the package into various compartments. with each compartment containing at least one die. The fence thus suppresses EMI between adjacent packages. The package further includes a ground path connected to the internal fence and conformal shield.

Abstract translation: 半导体器件封装包括施加到密封剂的外表面的保形屏蔽层。 以及嵌入密封剂中的内部围栏或分离结构。 围栏将包装分成各个隔间。 每个隔间包含至少一个模具。 因此，围栏可以抑制相邻包装之间的EMI。 该封装还包括连接到内部栅栏和保形屏蔽的接地路径。

公开(公告)号：US08053906B2

公开(公告)日：2011-11-08

申请号：US12501285

申请日：2009-07-10

Applicant: Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Ho Ming Tong ,  Jian Cheng Chen ,  Wei Chi Yih ,  Chang Ying Hung ,  Cheng Tsung Hsu ,  Chih Cheng Hung

Inventor： Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Ho Ming Tong ,  Jian Cheng Chen ,  Wei Chi Yih ,  Chang Ying Hung ,  Cheng Tsung Hsu ,  Chih Cheng Hung

IPC: H01L23/48

CPC classification number: H01L24/85 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85047 ,  H01L2224/85201 ,  H01L2224/85365 ,  H01L2224/85947 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48824 ,  H01L2924/00012

Abstract: A copper bonding wire includes a line portion and a non-spherical block portion. The non-spherical block portion is physically connected to the line portion, and the cross-sectional area of the non-spherical block portion is bigger than that of the line portion.

Abstract translation: 铜接合线包括线部分和非球形块部分。 非球形块部分物理连接到线路部分，非球形块部分的横截面面积大于线路部分的横截面面积。