摘要:
An electronic socket is described for providing either or both temporary and permanent attachments of electronic components to a substrate having interconnection circuits. The socket includes wells filled with a conductive fluid or paste for temporary attachment to the mesas of an electronic circuit. The wells are connected to selected traces of the substrate having interconnection circuits. The temporary connection may be used to produce known good die (KGD), including support of burn-in and high-speed functional test. The mesas can be filled with a material that is hardened after insertion of the mesas for permanent connection of the electronic circuit to the interconnect circuit.
摘要:
Direct writing method and apparatus and methods for imaging charged toner particles directly to a print receiving medium. The charged toner particles are imaged directly to a print receiving medium using one electronic writing head for each color. The writing heads employ voltage traveling waves to convey toner in the form of toner packets to toner transport channels. The size of the toner packets is controlled by using additive or subtractive methods to perform imaging.
摘要:
A computer module includes a substrate having a plurality of electronic components flip-chip mounted on the first and second sides of the substrate. After grinding and polishing operations, a polished planar surface extends across each side of the substrate, coincident with the back side of the electronic components. A metallization surrounds the mounted electronic components, providing a sealed enclosure that is partially immersible in water. A water-cooled server is also disclosed that includes a plurality of the computer modules disposed in a tank with cooling water circulating around the modules.
摘要:
A multi-channel timing device is described that can be completely controlled by a user's voice for hands free operation, and has a wireless communications link to a mobile device. Preferably the timing device comprises a processor, a memory, a display, a microphone, a speaker, a processor, a transceiver, and an audio chip. The memory contains instructions executable by the processor to facilitate the creation, control and reporting of multiple timing channels, for example six or more channels. The audio chip performs speech recognition, speech synthesis, and music synthesis. A rich set of event sequencing scenarios are executable by pairing the timing device with a mobile device, such as locating, retrieving and executing recipes that are preprogrammed in a suitable format in the mobile device. The mobile device can also serve as a surrogate to the user, and the pair of devices can implement an event sequencing system having local or remote control capabilities.
摘要:
An electronic display may be provided in a cartridge that can be conveniently mated with a host device. The cartridge may comprise a touch display screen, driver and receiver circuits, an area contact array, and a molding encasing the cartridge except for a display viewing area and exposed contact points of the contact array. The contact array may provide an efficient interconnection interface to a host device, and this interface may be releasable for the case of a replaceable cartridge or module. By accepting less than optimal lifetime performance of the display screen but providing it inexpensively and in a module form that is easy to replace, lowered overall consumer costs may be achieved. Inexpensive manufacturing methods may comprise a roll-to-roll fabrication method for fabricating the touch display screen on a flexible substrate as well as transfer or injection molding of the cartridge.
摘要:
This specification describes techniques for manufacturing an electronic system module. The module includes flexible multi-layer interconnection circuits with trace widths of 5 microns or less. A glass panel manufacturing facility, similar to those employed for making liquid crystal display, LCD, panels is used to fabricate the interconnection circuits. A polymer base layer is formed on a glass carrier with an intermediate release layer. Alternate layers of metal and dielectric are formed on the base layer, and patterned to create an array of multi-layer interconnection circuits on the glass panel. A thick layer of polymer is deposited on the interconnection circuit, and openings formed at input/output (I/O) pad locations. Solder paste is deposited in the openings to form wells filled with solder. After dicing the glass carrier to form separated interconnection circuits, IC chips are stud bumped and assembled using flip chip bonding, wherein the stud bumps on the components are inserted into corresponding wells on the interconnection circuits. The IC chips are tested and reworked to form tested circuit assemblies. Methods for connecting to testers and to other modules and electronic systems are described. Module packaging layers are provided for hermetic sealing and for electromagnetic shielding. A blade server embodiment is also described.
摘要:
A method for building scalable electronic subsystems is described. Stackable modules employ copper substrates with solder connections between modules, and a ball grid array interface is provided at the bottom of the stack. A cooling channel is optionally provided between each pair of modules. Each module is re-workable because all integrated circuit attachments within the module employ re-workable flip chip connectors. Also, defective modules can be removed from the stack by directing hot inert gas at externally accessible solder connections.
摘要:
A method is described for combining the diverse strengths of two materials in a tiled film construction. The first material provides a foundation of intersecting grid lines on a substrate and the second material is contained within the grid lines and has a valued property for a particular application. In a preferred embodiment, a tiled dielectric layer has improved low-k dielectric performance while avoiding film stress problems that can lead to delamination or cracking. CTE mismatch is overcome at the cost of an additional masking step. This tiling method and layered binary construction enable Cytop to be used as a high performance low-k dielectric on most substrates including semiconductor wafers and copper panels or foils.
摘要:
An electronic printing apparatus employs a digitally controlled toner conveyor and large scale integrated circuits (ICs) controlling write electrodes to print monocomponent toners on plain paper in a single pass. The ICs convert high level image information into toner controlling pulses. Pixel intensity is programmed by associating a counted number of packets of toner with each level of pixel depth.
摘要:
An electrostatic printing apparatus employs digitally controlled imaging conveyors to print monocomponent toners on plain paper in a single pass. Pixel intensity is programmed by associating a counted number of packets of toner with each level of pixel depth. Additional embodiments include toner pumping conveyors, toner trapping conveyors, a self-regulating toner source module, and fixed and moving head color printers.