公开(公告)号：US20160115277A1

公开(公告)日：2016-04-28

申请号：US14565420

申请日：2014-12-10

Applicant: TAIFLEX Scientific Co., Ltd.

Inventor： Yi-Kai Fang ,  Tsung-Tai Hung ,  Chiao-Pei Chen ,  Chiu-Feng Chen ,  Ching-Hung Huang

IPC: C08G73/10 ,  H05K1/03

CPC classification number: H05K1/0313 ,  C08G73/1028 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1078 ,  C09D179/08 ,  H05K1/028 ,  H05K1/0346 ,  H05K1/09 ,  H05K2201/0154 ,  H05K2201/068

Abstract: A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar′ is A is and 0

Abstract translation: 提供由下式1表示的聚酰亚胺聚合物。 在式1中，Ar为Ar'为A且0

公开(公告)号：US09285680B2

公开(公告)日：2016-03-15

申请号：US14332904

申请日：2014-07-16

Applicant: TAIFLEX SCIENTIFIC CO., LTD.

Inventor： Shih-Chang Lin ,  Hsiu-Ming Chang ,  Tzu-Ching Hung

IPC: G03F7/027 ,  G03F7/038 ,  C08F283/04 ,  C08L79/08 ,  C08L77/06 ,  C09J179/08

CPC classification number: G03F7/0387 ,  C08F283/04 ,  C08F299/024 ,  C08G73/1014 ,  C08G73/1028 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/1082 ,  C08G73/14 ,  C08L77/06 ,  C08L79/08 ,  C09D179/08 ,  C09J179/08 ,  C09J2479/08 ,  G03F7/029 ,  G03F7/038 ,  G03F7/0388 ,  C08L63/00 ,  C08K5/353

Abstract: A photosensitive polyimide composition; the composition comprises a base agent and a curing agent comprising a photoinitiator. By applying an aliphatic diamine monomer, which has a long carbon chain, and a grafting monomer, which has a main carbon chain having a double bond and an epoxy group at two ends respectively, to a method of making the base agent, a mixture of the base agent and the curing agent can be screen printed to form a photosensitive polyimide film on a copper foil. Also, the photosensitive polyimide film can be exposed under low exposure energy, and can be developed to a solder-resistant polyimide thin film by a weak alkaline developer after exposed. In addition, the solder-resistant polyimide thin film has low dielectric constant, low dielectric loss, good flame resistance, good solder resistance, and good pencil hardness. Accordingly, the photosensitive polyimide composition is applicable to high density flexible printed circuit boards.

Abstract translation: 光敏聚酰亚胺组合物; 组合物包含基剂和包含光引发剂的固化剂。 通过将具有长碳链的脂族二胺单体和分别具有两端的主链碳原子和双环氧基的接枝单体分别与制备该基剂的方法相同， 可以将基础剂和固化剂丝网印刷以在铜箔上形成感光性聚酰亚胺膜。 此外，感光性聚酰亚胺膜可以以低曝光能量曝光，并且可以在暴露后通过弱碱性显影剂显影成耐焊料聚酰亚胺薄膜。 此外，耐焊料聚酰亚胺薄膜具有低介电常数，低介电损耗，良好的阻燃性，良好的阻焊性和良好的铅笔硬度。 因此，光敏聚酰亚胺组合物可应用于高密度柔性印刷电路板。

公开(公告)号：US20160067932A1

公开(公告)日：2016-03-10

申请号：US14514399

申请日：2014-10-15

Applicant: TAIFLEX Scientific Co., Ltd.

Inventor： Chia-Che Chuang ,  Yu-Chih Kao ,  Chen-Kuo Lu ,  Kuan-Yu Li ,  Tzu-Ching Hung ,  Chiu-Feng Chen

IPC: B29D11/00 ,  H04N5/225 ,  G02B13/00

CPC classification number: B29D11/00634 ,  B29K2033/04 ,  B29K2509/02 ,  G02B13/008 ,  H04N5/2254

Abstract: An infrared absorption film includes a polymer resin substrate, a polymer dispersant and an infrared absorption material. The infrared absorption material has a plurality of tungsten oxide and/or composite tungsten oxide nanoparticles dispersed in the polymer resin substrate by the polymer dispersant, wherein a weight ratio of the polymer dispersant to the infrared absorption material is between 0.3 and 0.6.

Abstract translation: 红外吸收膜包括聚合物树脂基材，聚合物分散剂和红外线吸收材料。 红外吸收材料通过聚合物分散剂具有分散在聚合物树脂基材中的多个氧化钨和/或复合钨氧化物纳米粒子，其中聚合物分散剂与红外吸收材料的重量比为0.3-0.6。

公开(公告)号：US20150194553A1

公开(公告)日：2015-07-09

申请号：US14150101

申请日：2014-01-08

Applicant: TAIFLEX SCIENTIFIC CO., LTD.

Inventor： FU-MIN WANG ,  I-LING TENG ,  TSUNG-TAI HUNG ,  YU-HSIEN LEE ,  TZU-CHING HUNG ,  CHEN-HSIN HUANG

IPC: H01L31/048

CPC classification number: H01L31/0481 ,  B32B17/10018 ,  B32B17/10642 ,  B32B17/10788 ,  B32B27/08 ,  B32B27/18 ,  B32B27/283 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/40 ,  B32B2264/10 ,  B32B2307/302 ,  B32B2367/00 ,  B32B2457/12 ,  H01L31/048 ,  H01L31/049 ,  H02S40/42 ,  Y02E10/50

Abstract: A thermally conductive encapsulate comprising a thermally conductive composite layer having a thermal conductivity of 0.5 W/m*K to 8 W/m*K and an adhesive resin layer having a thermal conductivity of 0.05 W/m*K to 0.4 W/m*K is provided. A percentage of a thickness of the adhesive resin layer relative to a total thickness of the thermally conductive encapsulate ranges from 0.1% to 10%, and the thermally conductive encapsulate has an overall thermal impedance less than 0.72° C.-in2/W. Accordingly, the thermally conductive encapsulate not only provides sealing, insulating and adhesive properties, but also effectively dissipates the heat to the environment without increasing the thickness or volume of the solar cell module and without modifying the original encapsulation process, and thereby enhancing the solar cell module's conversion efficiency and increasing its power output.

Abstract translation: 一种导热封装体，其特征在于，具有热传导率为0.5W / m·K〜8W / m·K的导热性复合层，导热率为0.05W / m·K〜0.4W / m * 提供K。 粘合树脂层的厚度相对于导热封装的总厚度的百分比为0.1％〜10％，导热性封装的总热阻抗小于0.72℃/ in2 / W。 因此，导热封装不仅提供了密封，绝缘和粘合性能，而且还有效地将热量散发到环境中，而不增加太阳能电池模块的厚度或体积，而不改变原来的封装工艺，从而增强太阳能电池 模块的转换效率并增加其功率输出。

公开(公告)号：US20180371170A1

公开(公告)日：2018-12-27

申请号：US15678131

申请日：2017-08-16

Applicant: TAIFLEX Scientific Co., Ltd.

Inventor： Ching-Hung Huang ,  Kuang-Ting Hsueh ,  Chiu-Feng Chen ,  Yi-Kai Fang ,  Chun-Cheng Wan

IPC: C08G73/10 ,  C08J5/18

Abstract: A polyimide polymer is provided. The polyimide polymer includes a repeating unit represented by formula 1. In formula 1, Ar is a tetravalent organic group derived from a tetracarboxylic dianhydride containing an aliphatic structure, and A includes and at least one divalent organic group derived from an aromatic group-containing diamine other than

公开(公告)号：US20170034910A1

公开(公告)日：2017-02-02

申请号：US15296055

申请日：2016-10-18

Applicant: TAIFLEX Scientific Co., Ltd.

Inventor： Yi-Kai Fang ,  Tsung-Tai Hung ,  Chiao-Pei Chen ,  Chiu-Feng Chen ,  Ching-Hung Huang

IPC: H05K1/03 ,  H05K1/02 ,  H05K1/09 ,  C08G73/10 ,  C09D179/08

CPC classification number: H05K1/0313 ,  C08G73/1028 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1078 ,  C09D179/08 ,  H05K1/028 ,  H05K1/0346 ,  H05K1/09 ,  H05K2201/0154 ,  H05K2201/068

Abstract: A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar′ is A is and 0

Abstract translation: 0

公开(公告)号：US20160286698A1

公开(公告)日：2016-09-29

申请号：US14714338

申请日：2015-05-17

Applicant: TAIFLEX Scientific Co., Ltd.

Inventor： Hsiu-Ming Chang ,  Po-Wen Lin ,  Ching-Wen Yu

IPC: H05K9/00 ,  H05K1/02 ,  B32B27/18 ,  B32B27/06 ,  B32B27/38

CPC classification number: H05K9/0083 ,  B32B5/30 ,  B32B7/06 ,  B32B7/12 ,  B32B25/02 ,  B32B27/08 ,  B32B27/14 ,  B32B27/20 ,  B32B27/26 ,  B32B27/38 ,  B32B2260/025 ,  B32B2260/046 ,  B32B2264/102 ,  B32B2264/105 ,  B32B2264/108 ,  B32B2307/206 ,  B32B2307/212 ,  B32B2307/306 ,  B32B2307/7242 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2457/08 ,  H05K1/0216 ,  H05K1/0373 ,  H05K2201/0215

Abstract: An electromagnetic shielding film includes an insulation layer, and an electromagnetic shielding layer arranged at one side of the insulation layer. The electromagnetic shielding layer includes a polymer substrate and an electromagnetic shielding material. The polymer substrate has epoxy structures. The electromagnetic shielding material has a plurality of aculeate electromagnetic shielding microparticles dispersed in the polymer substrate.

Abstract translation: 电磁屏蔽膜包括绝缘层和布置在绝缘层一侧的电磁屏蔽层。 电磁屏蔽层包括聚合物基板和电磁屏蔽材料。 聚合物基材具有环氧结构。 电磁屏蔽材料具有分散在聚合物基板中的多个适当的电磁屏蔽微粒。

公开(公告)号：US20160088728A1

公开(公告)日：2016-03-24

申请号：US14530833

申请日：2014-11-03

Applicant: TAIFLEX Scientific Co., Ltd.

Inventor： Fu-Min Wang ,  Tsung-Tai Hung ,  I-Ling Teng ,  Feng-Jung Tien ,  Yu-Hsien Lee ,  Tzu-Ching Hung

IPC: H05K1/03 ,  H05K1/02

CPC classification number: H05K3/386 ,  H05K1/0237 ,  H05K1/118

Abstract: An insulation film of a signal transmission line includes a substrate layer, and a bonding layer arranged on the substrate layer for directly covering metal conductors of the signal transmission line, wherein the bonding layer is made of a polyolefin copolymer resin or a polyolefin resin mixture.

Abstract translation: 信号传输线的绝缘膜包括基底层和布置在基底层上用于直接覆盖信号传输线的金属导体的接合层，其中粘合层由聚烯烃共聚树脂或聚烯烃树脂混合物制成。

公开(公告)号：US09279057B2

公开(公告)日：2016-03-08

申请号：US14270413

申请日：2014-05-06

Applicant: TAIFLEX SCIENTIFIC CO., LTD.

Inventor： Hsiu-Ming Chang ,  Shih-Chang Lin ,  Tzu-Ching Hung

IPC: C08L63/00 ,  C08L79/08 ,  C09D11/102

CPC classification number: C09D11/102 ,  C08L63/00 ,  C08L79/08 ,  C08L2205/05

Abstract: A method of making a thermally curable solder-resistant ink, which comprises the following steps: polymerizing an aliphatic diamine monomer having a long carbon chain, an aromatic dianhydride monomer, an aromatic diamine monomer having a carboxylic acid group, and an anhydride monomer having a carboxylic acid group in an aprotic solvent to obtain a polyamine acid; cyclizing the polyamine acid to obtain a polyimide; and mixing the polyimide and a curing agent to obtain the thermally curable solder-resistant ink. By the steps mentioned above, the thermally curable solder-resistant ink made from the method has a dielectric constant less than 3.00 and a dielectric loss less than 0.01 and thereby is applicable to high frequency electronic equipments. Also, the thermally curable solder-resistant ink has good electrical properties, folding endurance, solder resistance, warpage resistance, flame resistance, acid endurance, alkali endurance, good solvent resistance and low water absorption.

Abstract translation: 一种制造耐热可焊性耐油墨的方法，包括以下步骤：聚合具有长碳链的脂族二胺单体，芳族二酐单体，具有羧酸基团的芳族二胺单体和具有 羧酸基团，得到多胺酸; 环化多胺酸得到聚酰亚胺; 并将聚酰亚胺和固化剂混合以得到可热固化的耐焊油墨。 通过上述步骤，由该方法制成的可热固化的耐焊锡墨水具有小于3.00的介电常数和小于0.01的介电损耗，因此可应用于高频电子设备。 另外，可热固化的耐焊锡墨水具有良好的电气性能，耐折叠性，耐焊接性，耐翘曲性，阻燃性，耐酸性，耐碱性，耐溶剂性和低吸水性。

公开(公告)号：US20150346402A1

公开(公告)日：2015-12-03

申请号：US14452704

申请日：2014-08-06

Applicant: TAIFLEX SCIENTIFIC CO ., LTD.

Inventor： Yu-Chih Kao ,  Chi-Yung Chang ,  Kuan-Yu Li ,  Tzu-Ching Hung

IPC: G02B5/20 ,  G02B1/04 ,  D01D5/08 ,  G02B5/22

CPC classification number: G02B5/208 ,  D01D5/08 ,  D01D5/24 ,  D01D5/253 ,  D01D5/32 ,  D01F1/10 ,  D01F1/106 ,  D02G3/44 ,  D10B2401/00 ,  D10B2401/04 ,  D10B2401/22 ,  G02B1/04 ,  G02B5/206 ,  G02B5/22 ,  C08L67/00 ,  C08L77/02 ,  C08L23/06 ,  C08L23/12

Abstract: The near-infrared radiation absorbing masterbatch provided is prepared by melt-extruding a mixture comprising near-infrared radiation absorbing particles and a first polymer. The particles have a near-infrared absorption at a wavelength ranging from 0.7 μm to 2 μm and a far-infrared emissivity equal to or more than 0.85. The near-infrared light radiated by the particles has a wavelength ranging from 2 μm to 22 μm. Accordingly, the product made from the masterbatch, such as the near-infrared radiation absorbing fiber, plate, or film can not only absorb sunlight and store heat, but also radiate far-infrared light. Hence, the product has a thermal effect for keeping the human body warm and can serve as indoor and outdoor heat storing products at the same time.

Abstract translation: 提供的近红外辐射吸收母料通过熔融挤出包含近红外辐射吸收颗粒和第一聚合物的混合物来制备。 颗粒在0.7μm至2μm的波长和远红外发射率等于或大于0.85的情况下具有近红外吸收。 由颗粒辐射的近红外光具有2μm至22μm的波长。 因此，由母粒制成的产品，例如近红外辐射吸收纤维，板或膜不仅可以吸收阳光并储存热量，还可以辐射远红外光。 因此，该产品具有保持人体温暖的热效应，并且可以同时用作室内和室外储热产品。