公开(公告)号：US20230330788A1

公开(公告)日：2023-10-19

申请号：US18205590

申请日：2023-06-05

Applicant: Alpha Assembly Solutions Inc.

Inventor： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Anil Kumar ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravi Bhatkal ,  Bawa Singh

IPC: B23K35/02 ,  B23K1/012 ,  B23K1/005 ,  B23K35/26 ,  B23K1/08 ,  B23K1/00 ,  H05K3/34 ,  C22C13/02 ,  B23K1/20 ,  B23K1/002 ,  B23K1/19 ,  C22C13/00

CPC classification number: B23K35/262 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0056 ,  B23K1/012 ,  B23K1/085 ,  B23K1/19 ,  B23K1/203 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3457 ,  H05K3/3463 ,  B23K2103/12 ,  Y10T403/479

Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt.% of silver, 2.5 to 4 wt.% of bismuth, 0.3 to 0.8 wt.% of copper, 0.03 to 1 wt.% nickel, 0.005 to 1 wt.% germanium, and a balance of tin, together with any unavoidable impurities.

公开(公告)号：US11699632B2

公开(公告)日：2023-07-11

申请号：US17153706

申请日：2021-01-20

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Oscar Khaselev ,  Michael T. Marczi ,  Bawa Singh

IPC: H05K13/04 ,  H01L23/373 ,  H01L23/00

CPC classification number: H01L23/373 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H05K13/0465 ,  H01L2224/2936 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/32225 ,  H01L2224/8384 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2924/0102 ,  H01L2924/0103 ,  H01L2924/014 ,  H01L2924/0104 ,  H01L2924/0105 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0132 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/203 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T428/24893 ,  H01L2224/29101 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/0132 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29111 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2224/83192 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/203 ,  H01L2924/0002

Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.

公开(公告)号：US11411150B2

公开(公告)日：2022-08-09

申请号：US16257441

申请日：2019-01-25

Applicant: Alpha Assembly Solutions Inc.

Inventor： Morgana de Avila Ribas ,  Pritha Choudhury ,  Siuli Sarkar ,  Ranjit Pandher ,  Nicholas G Herrick ,  Amit Patel ,  Ravindra M Bhatkal ,  Bawa Singh

IPC: B23K35/26 ,  C22C13/02 ,  H01L33/62 ,  H01L23/00 ,  B23K1/00 ,  B23K1/002 ,  B23K1/005 ,  B23K1/08 ,  H01L33/64

Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.

公开(公告)号：US20210205935A1

公开(公告)日：2021-07-08

申请号：US17149503

申请日：2021-01-14

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik Ghoshal ,  Remya Chandran ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Ranjit Pandher ,  Bawa Singh

IPC: B23K35/30 ,  B22F1/00 ,  B22F1/02 ,  B22F9/24 ,  C09C1/62 ,  B23K35/02 ,  B23K35/36

Abstract: A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.

公开(公告)号：US10710336B2

公开(公告)日：2020-07-14

申请号：US14915067

申请日：2014-08-29

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Oscar Khaselev ,  Bin Mo ,  Monnir Boureghda ,  Michael T. Marczi ,  Bawa Singh

IPC: B22F7/04 ,  B32B15/01 ,  B22F5/00 ,  C22C32/00 ,  C22C49/00 ,  H01L23/00

Abstract: Materials for die attachment such as silver sintering films may include reinforcing, modifying particles for enhanced performance. Methods for die attachment may involve the of such materials.

公开(公告)号：US10462908B2

公开(公告)日：2019-10-29

申请号：US15439555

申请日：2017-02-22

Applicant: Alpha Assembly Solutions Inc.

Inventor： Oscar Khaselev ,  Nitin Desai ,  Michael T. Marczi ,  Bawa Singh

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/18 ,  H05K3/20 ,  H05K3/22 ,  H05K3/28 ,  H05K3/46 ,  H01L21/02 ,  H01L21/44 ,  H01L21/48 ,  H01L23/48 ,  B05D3/02 ,  H05K3/24

Abstract: Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.

公开(公告)号：US10065274B2

公开(公告)日：2018-09-04

申请号：US14909888

申请日：2014-08-29

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Ranjit Pandher ,  Bawa Singh ,  Rahul Raut ,  Sanyogita Arora ,  Ravindra Bhatkal ,  Bin Mo

IPC: B23K35/36 ,  B23K35/26 ,  B23K35/362 ,  B23K35/02 ,  B23K1/012 ,  B23K1/08 ,  B23K1/19 ,  C22C13/00

Abstract: A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.

公开(公告)号：US09751159B2

公开(公告)日：2017-09-05

申请号：US15390861

申请日：2016-12-27

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Sanyogita Arora ,  Siuli Sarkar ,  Anna Lifton ,  Rahul Raut ,  Bawa Singh

IPC: B23K35/362 ,  B23K35/36 ,  B23K35/02 ,  C08L93/04 ,  C08K11/00 ,  H05K3/34 ,  B23K101/42

CPC classification number: B23K35/362 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  B23K2101/42 ,  C08K11/00 ,  C08L93/04 ,  C08L2205/025 ,  H05K3/3489

Abstract: Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.

公开(公告)号：US20170197281A1

公开(公告)日：2017-07-13

申请号：US15326180

申请日：2015-07-15

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravindra Bhatkal ,  Bawa Singh

IPC: B23K35/26 ,  H01L23/00 ,  B23K1/08 ,  B23K1/00 ,  C22C13/00

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0056 ,  B23K1/085 ,  B23K35/00 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K2101/40 ,  B23K2101/42 ,  C22C13/00 ,  C22C13/02 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29117 ,  H01L2224/29123 ,  H01L2224/29124 ,  H01L2224/29138 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29149 ,  H01L2224/29155 ,  H01L2224/29157 ,  H01L2224/2916 ,  H01L2224/29163 ,  H01L2224/29166 ,  H01L2224/29169 ,  H01L2224/29171 ,  H01L2224/29172 ,  H01L2224/2918 ,  H01L2224/83815 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01032 ,  H01L2924/01034 ,  H01L2924/01052 ,  H01L2924/01058

Abstract: A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.

公开(公告)号：US20170164484A1

公开(公告)日：2017-06-08

申请号：US15439555

申请日：2017-02-22

Applicant: Alpha Assembly Solutions Inc.

Inventor： Oscar Khaselev ,  Nitin Desai ,  Michael T. Marczi ,  Bawa Singh

IPC: H05K3/12 ,  H05K3/00 ,  H05K3/22 ,  H05K1/09

CPC classification number: H05K3/125 ,  H05K1/09 ,  H05K3/0011 ,  H05K3/1258 ,  H05K3/22 ,  H05K3/245 ,  H05K2201/0203 ,  H05K2201/0224 ,  H05K2201/09909 ,  H05K2203/013 ,  H05K2203/0568 ,  H05K2203/0769 ,  H05K2203/1131 ,  H05K2203/1476 ,  Y10T29/49155

Abstract: Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.