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    Ceramic insert control mechanism
    21.
    发明授权
    Ceramic insert control mechanism 有权
    陶瓷刀片控制机构

    公开(公告)号：US09232672B2

    公开(公告)日：2016-01-05

    申请号：US13738107

    申请日：2013-01-10

    Applicant: Apple Inc.

    Inventor： Kelvin Kwong ,  Benjamin J. Pope ,  Nicholas G. Merz

    IPC: H01H9/00 ,  H05K5/03 ,  G06F3/02 ,  H04M1/23 ,  G06F1/16 ,  H01H13/04 ,  H01H13/52

    CPC classification number: H05K5/03 ,  G06F1/1626 ,  G06F3/02 ,  G06F3/0202 ,  H01H13/04 ,  H01H13/52 ,  H01H2013/525 ,  H04M1/23

    Abstract: A control mechanism for an electronic device comprises a cover glass having an aperture defined therein. The aperture extends from an interior to an exterior of the device. A control member is positioned within the aperture, coupled to an actuator. The control member comprises a ceramic insert having a contact surface exposed to the exterior of the housing, operable to actuate the actuator in response to a force on the contact surface. A bearing member is molded about the insert. The bearing member has a hardness less than that of the ceramic insert, and less than that of the cover glass.

    Abstract translation: 电子设备的控制机构包括其中限定有孔的盖玻片。 孔从装置的内部延伸到外部。 控制构件定位在孔内，联接到致动器。 控制构件包括具有暴露于壳体外部的接触表面的陶瓷插入件，可操作以响应于接触表面上的力来致动致动器。 围绕插入件模制轴承构件。 轴承部件的硬度小于陶瓷刀片的硬度，小于盖玻片的硬度。

    Electromagnetic interference shielding techniques
    22.
    发明授权
    Electromagnetic interference shielding techniques 有权
    电磁干扰屏蔽技术

    公开(公告)号：US09155188B2

    公开(公告)日：2015-10-06

    申请号：US13631156

    申请日：2012-09-28

    Applicant: Apple Inc.

    Inventor： Nicholas G. Merz ,  Hong Wang ,  Michael M. Nikkhoo ,  Dennis R. Pyper ,  Christopher Matthew Werner

    IPC: H05K9/00 ,  H05K1/02 ,  H05K3/28

    CPC classification number: H05K1/0218 ,  H05K3/284 ,  H05K2201/0317 ,  H05K2201/09618 ,  H05K2201/09872 ,  H05K2201/09909 ,  H05K2201/10371 ,  H05K2201/2018 ,  Y10T29/4913 ,  Y10T29/49146

    Abstract: Methods and apparatuses are disclosed for fabricating a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced volume over conventional frame-and-shield approaches. Some embodiments include fabricating the PCB by mounting an integrated circuit to the PCB, outlining an area corresponding to the integrated circuit with a number of grounded vias, selectively applying an insulating layer over the PCB such that at least one of the grounded vias are exposed, and selectively applying a conductive layer over the PCB such that the conductive layer covers at least a portion of the integrated circuit and such that the conductive layer is coupled to the at least one of the grounded vias that are exposed.

    Abstract translation: 公开了用于制造具有电磁干扰（EMI）屏蔽的印刷电路板（PCB）的方法和装置，并且与传统的框架 - 屏蔽方法相比也具有减小的体积。 一些实施例包括通过将集成电路安装到PCB来制造PCB，通过多个接地通孔来概括对应于集成电路的区域，在PCB上选择性地施加绝缘层，使得接地通孔中的至少一个暴露， 以及选择性地在所述PCB上施加导电层，使得所述导电层覆盖所述集成电路的至少一部分，并且使得所述导电层耦合到暴露的所述接地通孔中的至少一个。

    CAPACITIVE DOME SWITCH
    24.
    发明申请
    CAPACITIVE DOME SWITCH 有权
    电容式开关

    公开(公告)号：US20130299331A1

    公开(公告)日：2013-11-14

    申请号：US13902953

    申请日：2013-05-27

    Applicant: Apple Inc.

    Inventor： Adam Mittleman ,  Nicholas G. Merz

    IPC: H03K17/975

    CPC classification number: H03K17/975 ,  H01H2215/006 ,  H01H2239/006 ,  H03K17/962 ,  H03K2217/96062 ,  H03K2217/960755 ,  Y10T29/49105 ,  Y10T307/74

    Abstract: This is directed to a dome switch that includes a capacitive sensor. A dome switch can include a dome operative to deform to provide tactile feedback to a user. To provide an electrical instruction to the device, the region underneath the dome can define a free space separating conductive regions forming a capacitor. For example, a tip of the dome, a button placed between the dome and a circuit board, or a user's finger can form a first conductor of a capacitor, and a support structure for the dome can include a terminal forming a second conductor completing the capacitor. When the dome deflects, the distance between the conductors can change and provide a measurable capacitance variation, which the device can detect. To protect the dome switch from damage due to contaminants, the terminal can be integrated within a volume of the circuit board such that it is not exposed to the environment of the dome switch. In one implementation, the terminal may not be exposed to air.

    Abstract translation: 这是针对包括电容式传感器的穹顶开关。 圆顶开关可以包括操作以变形以向用户提供触觉反馈的圆顶。 为了向装置提供电气指令，圆顶下方的区域可以限定形成电容器的导电区域的自由空间。 例如，圆顶的顶端，放置在圆顶和电路板之间的按钮或用户的手指可以形成电容器的第一导体，并且用于圆顶的支撑结构可以包括形成第二导体的端子， 电容器。 当圆顶偏转时，导体之间的距离可以改变并提供可测量的电容变化，该装置可以检测。 为了保护穹顶开关免受污染物的损坏，终端可以集成在电路板的一个体积内，使其不会暴露在穹顶开关的环境中。 在一个实施方案中，终端可能不暴露于空气中。

    INPUT CONTROLS USING PRESSURE SENSORS
    25.
    发明申请
    INPUT CONTROLS USING PRESSURE SENSORS 审中-公开

    公开(公告)号：US20190102028A1

    公开(公告)日：2019-04-04

    申请号：US16044223

    申请日：2018-07-24

    Applicant: Apple Inc.

    Inventor： Bryan D. Keen ,  Nicholas G. Merz

    IPC: G06F3/041 ,  G06F1/16 ,  H04R1/08

    Abstract: An input control for controlling various features of an electronic device is described. The input control can be positioned along an exterior surface of the electronic device and cover an opening leading into the electronic device. A pressure sensor can then be positioned within the electronic device and adjacent to the covered opening. The pressure sensor is able to measure a pressure of a volume of air positioned between the pressure sensor and the input control. When movement of the input control changes the pressure of the volume of air, the sensor readings from the pressure sensor can be used to register a user input. The input control can take many forms including rocker buttons, slider switches and input regions.

    Display cover retention features for a portable electronic device
    26.
    发明授权
    Display cover retention features for a portable electronic device 有权

    公开(公告)号：US10015297B2

    公开(公告)日：2018-07-03

    申请号：US15260222

    申请日：2016-09-08

    Applicant: Apple Inc.

    Inventor： Lee E. Hooton ,  Daniel W. Jarvis ,  Marwan Rammah ,  Ian A. Spraggs ,  Nicholas G. Merz

    IPC: B32B3/02 ,  H04M1/02 ,  G06F1/16

    CPC classification number: H04M1/0266 ,  G06F1/1613 ,  G06F1/1626 ,  G06F1/1637 ,  H04M1/0249

    Abstract: An electronic device having a cover glass secured with a frame is disclosed. The electronic device includes a masking layer positioned between the cover glass and the frame. The masking layer may include several ink layers. The pigment composition of one of the ink layers may be altered in order to improve an adhesive bond between the ink layer and the cover glass. The frame can be modified to enhance an adhesive bond between the masking layer and the frame. For example, the frame can be altered to include a porous region to increase the surface area of the frame such that the adhesive can bond to the additional surface area. The frame may also include an extension, or rib, that may increase the surface area of the frame that receives an adhesive. The frame may include an opening or a cavity that assists in assembly between an insert-molded feature.

    Assembled integral plastic elements on an anodized mobile device enclosure
    28.
    发明授权
    Assembled integral plastic elements on an anodized mobile device enclosure 有权
    在阳极氧化的移动设备外壳上组装一体的塑料元件

    公开(公告)号：US09518333B2

    公开(公告)日：2016-12-13

    申请号：US14503009

    申请日：2014-09-30

    Applicant: Apple Inc.

    Inventor： Stefan C. Mag ,  Derek C. Krass ,  Nicholas G. Merz ,  Daniel W. Jarvis ,  Matthew P. Rao ,  Vincent Yan ,  Michael Ngo ,  Richard Hung Minh Dinh ,  Thomas Johannessen

    IPC: C25D11/02 ,  B23K26/32 ,  B32B37/02 ,  C25D11/04 ,  C25D11/24 ,  C25D11/26 ,  C25D11/30 ,  C25D11/34 ,  B29C65/78

    CPC classification number: C25D11/022 ,  B23K26/322 ,  B23K2103/08 ,  B29C65/7847 ,  B32B37/02 ,  C25D11/02 ,  C25D11/04 ,  C25D11/243 ,  C25D11/26 ,  C25D11/30 ,  C25D11/34

    Abstract: Methods and systems for manufacturing composite parts that include anodizable portions and non-anodizable portions such that an interface between the anodizable portions and non-anodizable portions are free of visible defects are described. The non-anodizable portions can be made of anodizable metals such as aluminum or aluminum alloy. The non-anodizable portions are made of material that do not generally form an anodic film, such as plastic, ceramic or glass materials. In particular, the methods described relate to manufacturing methods that are compatible with anodizing processes and avoid defects related to anodizing processes. In particular embodiments, the methods involve avoiding trapping of anodizing chemicals within a gap between an anodizable portion and a non-anodizable portion, which prevents the anodizing chemicals from disrupting the uptake of dye in a post-anodizing dyeing process.

    Abstract translation: 描述了包括阳极化部分和非阳极氧化部分的复合部件的制造方法和系统，使得可阳极氧化部分和非阳极氧化部分之间的界面没有可见的缺陷。 非阳极氧化部分可以由诸如铝或铝合金的阳极化金属制成。 非阳极氧化部分由通常不形成阳极膜的材料制成，例如塑料，陶瓷或玻璃材料。 特别地，所描述的方法涉及与阳极氧化工艺兼容并避免与阳极氧化工艺相关的缺陷的制造方法。 在具体实施方案中，所述方法涉及避免在阳极氧化部分和非阳极化部分之间的间隙内捕获阳极化化学品，这防止阳极氧化化学品在后阳极氧化染色过程中破坏染料的吸收。

    Methods for shielding electronic components from moisture
    30.
    发明授权
    Methods for shielding electronic components from moisture 有权
    屏蔽电子元件免受潮湿的方法

    公开(公告)号：US09161434B2

    公开(公告)日：2015-10-13

    申请号：US14230639

    申请日：2014-03-31

    Applicant: Apple Inc.

    Inventor： Nicholas G. Merz ,  Scott A. Myers ,  Gregory N. Stephens ,  Joseph C. Poole

    IPC: H01L21/00 ,  H05K1/02 ,  C23C16/50 ,  H05K3/28 ,  C23C16/04

    CPC classification number: H05K1/0216 ,  C23C16/042 ,  C23C16/50 ,  H05K3/282 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2201/10189 ,  H05K2201/10371

    Abstract: Methods for applying a hydrophobic coating to various components within a computing device are disclosed. More specifically, a hydrophobic coating can be applied by a plasma assisted chemical vapor deposition (PACVD) process to a fully assembled circuit board. Frequently, a fully assembled circuit board can have various components such as electromagnetic interference (EMI) shields which cover water sensitive electronics. A method is disclosed for perforating portions of the EMI shields that overlay the water sensitive electronics. Methods of sealing board to board connectors are also disclosed. In one embodiment solder leads of the board to board connectors can be covered by a silicone seal.

    Abstract translation: 公开了将疏水涂层施加到计算装置内的各种部件的方法。 更具体地，疏水涂层可以通过等离子体辅助化学气相沉积（PACVD）方法施加到完全组装的电路板上。 通常，完全组装的电路板可以具有各种部件，例如覆盖水敏电子器件的电磁干扰（EMI）屏蔽。 公开了一种用于穿透覆盖水敏电子器件的EMI屏蔽部分的穿孔方法。 还公开了板对板连接器的密封方法。 在一个实施例中，板对板连接器的焊接引线可以被硅树脂密封覆盖。

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