公开(公告)号：US5591914A

公开(公告)日：1997-01-07

申请号：US480162

申请日：1995-06-07

Applicant: Richard M. White ,  Stuart Wenzel ,  Eric R. Minami

Inventor： Richard M. White ,  Stuart Wenzel ,  Eric R. Minami

IPC: G01D5/48 ,  G01H9/00 ,  G01S11/12 ,  G01S11/14 ,  G10K15/04 ,  H03B5/30 ,  G01B11/14

CPC classification number: G01D5/48 ,  G01H9/00 ,  G01S11/12 ,  G01S11/14 ,  G10K15/046 ,  A61B5/0066

Abstract: A position sensor for measuring the distance from a first position to a second position. The sensor may include an elastic wave generator, an acoustical path over which the elastic wave passes, and a transducer to which the wave passes. A measurement loop includes the acoustical path, and has electrical and optical elements. The electrical elements may compare the phases of the transducer signals from which the change in position between the first and second positions are determined. Alternatively, the measurement loop may comprise a feedback loop to produce oscillations and an output frequency. A frequency counter is included in the feedback loop to measure frequency.

Abstract translation: 一种用于测量从第一位置到第二位置的距离的位置传感器。 传感器可以包括弹性波发生器，弹性波穿过的声道和波通过的换能器。 测量回路包括声道，并具有电光元件。 电气元件可以比较确定第一和第二位置之间的位置变化的换能器信号的相位。 或者，测量回路可以包括产生振荡和输出频率的反馈回路。 反馈回路中包含频率计数器以测量频率。

公开(公告)号：US09604325B2

公开(公告)日：2017-03-28

申请号：US13303762

申请日：2011-11-23

Applicant: Stuart Wenzel ,  Chuangang Lin ,  Paul Wagner ,  Igal Ladabaum

Inventor： Stuart Wenzel ,  Chuangang Lin ,  Paul Wagner ,  Igal Ladabaum

IPC: H01M2/04 ,  B23P17/00 ,  H01M6/02 ,  H01M2/02 ,  H01M12/06 ,  H04R25/00

CPC classification number: H04R25/602 ,  B23P17/00 ,  H01M2/0217 ,  H01M2/026 ,  H01M2/0285 ,  H01M2/0408 ,  H01M2/0421 ,  H01M6/02 ,  H01M6/045 ,  H01M12/06 ,  H01M2220/30 ,  H01M2300/0014 ,  H04R25/604 ,  H04R25/652 ,  H04R25/654 ,  H04R25/656 ,  H04R25/658 ,  H04R2225/023 ,  H04R2225/49 ,  Y10T29/49108 ,  Y10T29/49799

Abstract: Hearing devices configured to fit within the bony portion of the ear canal and batteries that may be used with same.

公开(公告)号：US08808906B2

公开(公告)日：2014-08-19

申请号：US13303684

申请日：2011-11-23

Applicant: Stuart Wenzel ,  Chuangang Lin ,  Paul Wagner ,  Igal Ladabaum

Inventor： Stuart Wenzel ,  Chuangang Lin ,  Paul Wagner ,  Igal Ladabaum

IPC: H01M2/02 ,  H01M6/06 ,  H01M2/36 ,  H01M12/06

CPC classification number: H01M12/06 ,  H01M2/0413 ,  H01M2/361 ,  H01M2002/0205 ,  H04R25/456 ,  H04R25/554 ,  H04R25/602 ,  H04R25/606 ,  H04R25/608 ,  H04R25/652 ,  H04R25/654 ,  H04R25/656 ,  H04R25/658 ,  H04R2225/023 ,  H04R2225/31 ,  H04R2225/61 ,  H04R2225/67 ,  H04R2460/03 ,  H04R2460/17 ,  Y02E60/128

Abstract: Hearing devices configured to fit within the bony portion of the ear canal and batteries that may be used with same.

Abstract translation: 听力装置被配置成装配在耳道的骨部分和可以与其一起使用的电池。

公开(公告)号：US20130129127A1

公开(公告)日：2013-05-23

申请号：US13303406

申请日：2011-11-23

Applicant: Paul Wagner ,  Stuart Wenzel ,  Michael Au ,  Igal Ladabaum

Inventor： Paul Wagner ,  Stuart Wenzel ,  Michael Au ,  Igal Ladabaum

IPC: H04R25/00

CPC classification number: H04R25/65 ,  H04R25/602 ,  H04R25/604 ,  H04R25/654 ,  H04R25/658 ,  H04R2225/023 ,  H04R2225/31 ,  H04R2460/03

Abstract: Hearing devices configured to fit within the bony portion of the ear canal and batteries that may be used with same.

公开(公告)号：US20130125387A1

公开(公告)日：2013-05-23

申请号：US13303762

申请日：2011-11-23

Applicant: Stuart Wenzel ,  Chuangang Lin ,  Paul Wagner ,  Igal Ladabaum

Inventor： Stuart Wenzel ,  Chuangang Lin ,  Paul Wagner ,  Igal Ladabaum

IPC: H01M6/02 ,  B23P17/00

CPC classification number: H04R25/602 ,  B23P17/00 ,  H01M2/0217 ,  H01M2/026 ,  H01M2/0285 ,  H01M2/0408 ,  H01M2/0421 ,  H01M6/02 ,  H01M6/045 ,  H01M12/06 ,  H01M2220/30 ,  H01M2300/0014 ,  H04R25/604 ,  H04R25/652 ,  H04R25/654 ,  H04R25/656 ,  H04R25/658 ,  H04R2225/023 ,  H04R2225/49 ,  Y10T29/49108 ,  Y10T29/49799

Abstract: Hearing devices configured to fit within the bony portion of the ear canal and batteries that may be used with same.

公开(公告)号：US20080103550A1

公开(公告)日：2008-05-01

申请号：US11876147

申请日：2007-10-22

Applicant: Stuart Wenzel ,  Mariam Maghribi ,  Mark Huang

Inventor： Stuart Wenzel ,  Mariam Maghribi ,  Mark Huang

IPC: A61N1/02

CPC classification number: A61N1/205 ,  A61N1/326

Abstract: In one example, the present invention is directed to a wound-healing patch including a flexible substrate, at least one wound electrode and at least one return electrode. In the invention, the wound electrode(s) is positioned on a portion of the flexible substrate designed to be placed over wounded tissue and the return electrode is positioned on a portion of the substrate remote from the wound-healing electrode and designed to be placed over healthy tissue.

Abstract translation: 在一个实例中，本发明涉及包括柔性基底，至少一个缠绕电极和至少一个返回电极的伤口愈合贴片。 在本发明中，卷绕电极位于设计成放置在受伤组织上的柔性基板的一部分上，并且返回电极位于远离伤口愈合电极的基板的一部分上并被设计成放置 超过健康组织。

公开(公告)号：US20070269997A1

公开(公告)日：2007-11-22

申请号：US11779183

申请日：2007-07-17

Applicant: Benjamin Eldridge ,  Stuart Wenzel

Inventor： Benjamin Eldridge ,  Stuart Wenzel

IPC: H01R12/10 ,  G01R31/26

CPC classification number: G01R1/06716 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/06744 ,  G01R1/06761 ,  G01R1/07342 ,  G01R3/00 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30107 ,  H01R12/52 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2442 ,  H01R2201/20 ,  H05K3/4092 ,  H05K7/1069 ,  H01L2924/00

Abstract: An electronic component is disclosed, having a plurality of microelectronic spring contacts mounted to a planar face of the component. Each of the microelectronic spring contacts has a contoured beam, which may be formed of an integral layer of resilient material deposited over a contoured sacrificial substrate, and comprises a base mounted to the planar face of the component, a beam connected to the base at a first end of the beam, and a tip positioned at a free end of the beam opposite to the base. The beam has an unsupported span between its free end and its base. The microelectronic spring contacts are advantageously formed by depositing a resilient material over a molded, sacrificial substrate. The spring contacts may be provided with various innovative contoured shapes. In various embodiments of the invention, the electronic component comprises a semiconductor die, a semiconductor wafer, a LGA socket, an interposer, or a test head assembly.

Abstract translation: 公开了一种电子部件，其具有安装到部件的平面上的多个微电子弹簧触头。 微电子弹簧触点中的每一个都具有波纹形梁，其可以由沉积在轮廓牺牲基板上的弹性材料的整体层形成，并且包括安装到部件的平面上的基座， 梁的第一端和位于梁的与基座相对的自由端的尖端。 梁在其自由端和底座之间具有不受支撑的跨距。 微电子弹簧触头有利地通过在模制的牺牲衬底上沉积弹性材料形成。 弹簧触点可以具有各种创新的轮廓形状。 在本发明的各种实施例中，电子部件包括半导体管芯，半导体晶片，LGA插座，插入件或测试头组件。

公开(公告)号：US20070054513A1

公开(公告)日：2007-03-08

申请号：US11554485

申请日：2006-10-30

Applicant: Gaetan Mathieu ,  Benjamin Eldridge ,  Stuart Wenzel

Inventor： Gaetan Mathieu ,  Benjamin Eldridge ,  Stuart Wenzel

IPC: H01R12/00

CPC classification number: H01L24/13 ,  G01R1/06761 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0308 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is deformed. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume) resulting in the deformation of the interconnection element.

Abstract translation: 一种制造和使用互连元件的方法，所述互连元件包括适于耦合到基底的第一元件材料和第二元件材料，所述第二元件材料包括具有可变形特性的材料，使得在变形时互连的形状变形。 一个实例是具有可变形特性的材料，使得第一和/或第二元件材料的体积可以经历从一个体积到不同体积（例如较小体积）的热转换，导致互连元件的变形 。

公开(公告)号：US20060024989A1

公开(公告)日：2006-02-02

申请号：US11237091

申请日：2005-09-27

Applicant: Scott Lindsey ,  Charles Miller ,  David Royster ,  Stuart Wenzel

Inventor： Scott Lindsey ,  Charles Miller ,  David Royster ,  Stuart Wenzel

IPC: H01R12/00

CPC classification number: G01R1/06733 ,  G01R1/06711 ,  G01R1/06744 ,  G01R31/2884 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2224/16 ,  H01L2924/00014 ,  H01R4/4863 ,  H01R12/57 ,  H01R13/035 ,  H01R13/2421 ,  H01R13/33 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/10265 ,  H05K2203/308 ,  H01L2224/0401

Abstract: A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device in a coil pattern over the compliant pad to its end area, forming a helix. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. In an alternative embodiment, the pad is removed to leave a freestanding helical contact.

公开(公告)号：US5450752A

公开(公告)日：1995-09-19

申请号：US902713

申请日：1992-06-23

Applicant: Richard M. White ,  Stuart Wenzel

Inventor： Richard M. White ,  Stuart Wenzel

IPC: G01D5/48 ,  G01H9/00 ,  G01S11/12 ,  G01S11/14 ,  G10K15/04 ,  H03B5/30 ,  G01B11/14

CPC classification number: G01D5/48 ,  G01H9/00 ,  G01S11/12 ,  G01S11/14 ,  G10K15/046 ,  A61B5/0066

Abstract: A position sensor for measuring the distance from a first position to a second position. The sensor may include an elastic wave generator, an acoustical path over which the elastic wave passes, and a transducer to which the wave passes. A measurement loop includes the acoustical path, and has electrical and optical elements. The electrical elements may compare the phases of the transducer signals from which the change in position between the first and second positions are determined. Alternatively, the measurement loop may comprise a feedback loop to produce oscillations and an output frequency. A frequency counter is included in the feedback loop to measure frequency.

Abstract translation: 一种用于测量从第一位置到第二位置的距离的位置传感器。 传感器可以包括弹性波发生器，弹性波穿过的声道和波通过的换能器。 测量回路包括声道，并具有电光元件。 电气元件可以比较确定第一和第二位置之间的位置变化的换能器信号的相位。 或者，测量回路可以包括产生振荡和输出频率的反馈回路。 反馈回路中包含频率计数器以测量频率。