公开(公告)号：US20150284603A1

公开(公告)日：2015-10-08

申请号：US14743619

申请日：2015-06-18

Applicant: FUJIFILM CORPORATION

Inventor： Yu IWAI ,  Kazuhiro FUJIMAKI ,  Ichiro KOYAMA ,  Atsushi NAKAMURA

IPC: C09J133/12 ,  H01L21/304 ,  C09J125/14 ,  C09J133/16 ,  C09J183/06 ,  H01L21/683 ,  H01L21/306

CPC classification number: C09J151/003 ,  C09J4/00 ,  C09J5/04 ,  C09J5/06 ,  C09J125/14 ,  C09J133/12 ,  C09J133/16 ,  C09J183/06 ,  H01L21/304 ,  H01L21/306 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: By a temporary adhesive for production of semiconductor device containing (A) a radical polymerizable monomer or oligomer containing a fluorine atom or a silicon atom, (B) a polymer compound, and (C) a radical polymerization initiator, a temporary adhesive for production of semiconductor device, which is excellent in coating property, which reduces a problem of generation of gas therefrom in the temporary support even under high temperature condition when the member to be processed (for example, a semiconductor wafer) is subjected to a mechanical or chemical processing, and further which can easily release the temporary support for the member processed without imparting damage to the member processed even after being subjected to a process at a high temperature, and an adhesive support and a production method of semiconductor device using the same are provided.

Abstract translation: 通过用于生产包含（A）含有氟原子或硅原子的自由基聚合性单体或低聚物的半导体器件的临时粘合剂，（B）高分子化合物和（C）自由基聚合引发剂，用于生产 半导体装置，其涂布性优异，即使在待处理构件（例如半导体晶片）进行机械或化学处理时，即使在高温条件下也能够在临时支撑体中产生气体的问题 并且进一步地，其可以容易地释放所加工的构件的临时支撑件，而不会对经处理的高温处理的构件造成损害，并且提供粘合剂支撑件和使用其的半导体装置的制造方法。

公开(公告)号：US20150184032A1

公开(公告)日：2015-07-02

申请号：US14641656

申请日：2015-03-09

Applicant: FUJIFILM Corporation

Inventor： Yu IWAI ,  Ichiro KOYAMA

IPC: C09J4/00 ,  H01L21/306 ,  C09J101/14 ,  C09J125/06 ,  C09J101/12 ,  H01L21/304 ,  H01L21/683

CPC classification number: C09J4/00 ,  C09J101/00 ,  C09J101/08 ,  C09J101/10 ,  C09J101/12 ,  C09J101/14 ,  C09J101/26 ,  C09J125/06 ,  C09J201/00 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/31133 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T428/28

Abstract: By a temporary adhesive for production of semiconductor device containing (A) a polymer compound having a thermal decomposition initiation temperature of 250° C. or more, and (B) a radical polymerizable monomer, and an adhesive support and a production method of semiconductor device using the same, a temporary adhesive for production of semiconductor device, which can temporarily support a member to be processed (for example, a semiconductor wafer) with a high adhesive force even under high temperature condition (for example, at 100° C.) when the member to be processed is subjected to a mechanical or chemical processing, which reduces a problem of generation of gas therefrom in the temporary support even under high temperature condition, and which can easily release the temporary support for the member processed without imparting damage to the member processed, and an adhesive support and a production method of semiconductor device using the same can be provided.

Abstract translation: 通过使用含有（A）热分解开始温度为250℃以上的高分子化合物和（B）自由基聚合性单体的半导体装置的临时粘合剂，以及粘合剂支持体和半导体装置的制造方法 使用它们，即使在高温条件下（例如，在100℃）下也可以以高粘合力临时支撑待处理的部件（例如，半导体晶片）的用于生产半导体器件的临时粘合剂。 当待加工的构件经受机械或化学处理时，即使在高温条件下也能在临时支撑体中减少气体产生的问题，并且能够容易地释放所加工的构件的临时支撑而不损害 可以提供加工构件，并且可以提供使用其的半导体装置的粘合剂支持体和制造方法。

公开(公告)号：US20140080054A1

公开(公告)日：2014-03-20

申请号：US14087275

申请日：2013-11-22

Applicant: FUJIFILM Corporation

Inventor： Yu IWAI ,  Hidekazu OOHASHI ,  Takanori MORI

IPC: G03F7/30 ,  G03F7/09

CPC classification number: G03F7/11 ,  B41C1/1016 ,  B41C2201/02 ,  B41C2201/04 ,  B41C2201/10 ,  B41C2201/14 ,  B41C2210/04 ,  B41C2210/08 ,  B41C2210/22 ,  B41C2210/24 ,  G03F7/3035

Abstract: A lithographic printing plate precursor which is excellent in both the on-press development property and the printing durability and which is excellent particularly in the on-press development property after preservation for a long period of time, wherein the lithographic printing plate precursor includes an intermediate layer containing a polymer compound including a repeating unit (a1) having a support-adsorbing group and a repeating unit (a2) having a polyoxyalkylene group having a repeating number of oxyalkylene units from 8 to 120 between a support and a polymerizable image-recording layer, and contains a compound having a molecular weight of 1,500 or less and having an oxyalkylene group in at least any of the intermediate layer and the polymerizable image-recording layer.

Abstract translation: 一种平版印刷版原版，其具有优异的印刷压力显影性和印刷耐久性，并且特别是长时间保存后的印刷机显影性优异，其中平版印刷版原版包括中间体 含有具有支撑体吸附基团的重复单元（a1）的聚合物化合物和在载体和可聚合图像记录层之间具有8〜120重复数氧化烯单元的聚氧化烯基的重复单元（a2） 并且在中间层和可聚合图像记录层中的至少任意一个中含有分子量为1,500以下且具有氧化烯基的化合物。

公开(公告)号：US20140011138A1

公开(公告)日：2014-01-09

申请号：US14024010

申请日：2013-09-11

Applicant: FUJIFILM Corporation

Inventor： Yu IWAI ,  Junya ABE ,  Yuriko ISHIGURO ,  Hidekazu OOHASHI

IPC: B41C1/10

CPC classification number: B41C1/10 ,  G03F7/09 ,  G03F7/11

Abstract: A lithographic printing plate precursor includes a support and one or more layers, one of the one or more layers is a photosensitive layer containing an initiator compound, a polymerizable compound and a binder polymer, and a layer being in contact with the support of the one or more layers contains a copolymer containing a repeating unit having a zwitterionic structure and a repeating unit having a structure capable of interacting with a surface of the support.

Abstract translation: 平版印刷版原版包括载体和一层或多层，一层或多层中的一层是含有引发剂化合物，可聚合化合物和粘合剂聚合物的感光层，以及与该载体的载体接触的层 或更多层包含含有具有两性离子结构的重复单元的共聚物和具有能够与载体表面相互作用的结构的重复单元。

公开(公告)号：US20190153210A1

公开(公告)日：2019-05-23

申请号：US16257543

申请日：2019-01-25

Applicant: FUJIFILM Corporation

Inventor： Yu IWAI ,  Mitsuru SAWANO

IPC: C08L29/14 ,  C08K5/3475 ,  C08K5/3492 ,  C08K5/19 ,  H01L21/02

Abstract: Provided are a resin composition which allows laser ablation processing, allows removal of a protective film itself after the processing, and is capable of forming a protective film having peeling resistance, and a protective film. The resin composition for forming a protective film contains polyvinyl acetal, a light absorbing agent, and a solvent.

公开(公告)号：US20170198176A1

公开(公告)日：2017-07-13

申请号：US15468288

申请日：2017-03-24

Applicant: FUJIFILM Corporation

Inventor： Yoshitaka KAMOCHI ,  Ichiro KOYAMA ,  Yu IWAI ,  Atsushi NAKAMURA ,  Mitsuru SAWANO

IPC: C09J11/06 ,  H01L21/683 ,  C09J153/02 ,  C09J7/00 ,  B32B25/04 ,  B32B7/12

CPC classification number: C09J11/06 ,  B32B3/08 ,  B32B7/04 ,  B32B7/06 ,  B32B7/12 ,  B32B9/043 ,  B32B15/06 ,  B32B25/04 ,  B32B25/08 ,  B32B25/12 ,  B32B25/14 ,  B32B25/16 ,  B32B25/18 ,  B32B25/20 ,  B32B27/06 ,  B32B27/08 ,  B32B27/20 ,  B32B27/26 ,  B32B27/28 ,  B32B27/285 ,  B32B27/286 ,  B32B27/304 ,  B32B27/306 ,  B32B27/325 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B27/42 ,  B32B2250/03 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/51 ,  B32B2307/58 ,  B32B2307/584 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2457/14 ,  C08J3/092 ,  C08J5/18 ,  C08J2309/06 ,  C08J2353/02 ,  C09J7/00 ,  C09J7/10 ,  C09J121/00 ,  C09J153/025 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2453/00 ,  H01L21/02 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386

Abstract: Provided are a composition which has good elastomer solubility, is thus capable of increasing a concentration of solid contents, and is capable of forming a film having excellent drying properties, surface morphology, and heat resistance, a process for producing a sheet, a sheet, a laminate, and a laminate with a device wafer.This composition includes an elastomer having a 5% thermal mass reduction temperature of 375° C. or higher when heated at an elevation rate of 20° C./min from 25° C., a solvent represented by the following General Formula (1) and having a boiling point of 160° C. or higher, and a solvent having a boiling point of lower than 120° C. In General Formula (1), R1 to R6 each independently represent a hydrogen atom or an aliphatic hydrocarbon group.

公开(公告)号：US20160240816A1

公开(公告)日：2016-08-18

申请号：US15139989

申请日：2016-04-27

Applicant: FUJIFILM Corporation

Inventor： Kazuyoshi MIZUTANI ,  Yu IWAI ,  Ichiro KOYAMA ,  Yoshitaka KAMOCHI

IPC: H01L51/52 ,  G03F7/11 ,  G03F7/004 ,  G03F7/039 ,  H01L51/42 ,  B32B27/08

CPC classification number: H01L51/5253 ,  B32B27/08 ,  B32B2307/4026 ,  B32B2307/54 ,  B32B2457/00 ,  B32B2457/14 ,  G03F7/0045 ,  G03F7/038 ,  G03F7/0382 ,  G03F7/039 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/11 ,  G03F7/325 ,  H01L51/4253 ,  H01L51/448 ,  Y02E10/549 ,  Y02P70/521

Abstract: Provided are a laminate which is capable of forming an excellent organic semiconductor pattern, a kit for manufacturing an organic semiconductor, which is used to manufacture such a laminate, and a resist composition for manufacturing an organic semiconductor, which is used for the kit for manufacturing an organic semiconductor.The laminate includes an organic semiconductor film, a protective film on the organic semiconductor film, and a resist film on the protective film, in which the resist film is formed of a photosensitive resin composition that contains a photoacid generator (A) which generates an organic acid of which a pKa of the generated acid is −1 or less and a resin (B) which reacts with an acid generated by the photoacid generator so that the rate of dissolution in a developer containing an organic solvent is decreased.

Abstract translation: 提供能够形成优异的有机半导体图案的层压体，用于制造这种层压体的用于制造有机半导体的套件以及用于制造用于制造的套件的有机半导体用抗蚀剂组合物 有机半导体。 层压体包括有机半导体膜，有机半导体膜上的保护膜和保护膜上的抗蚀剂膜，其中抗蚀剂膜由包含产生有机物的光致酸产生剂（A）的光敏树脂组合物形成， 产生酸的pKa为-1以下的酸和与光产酸剂生成的酸反应的树脂（B），使得含有有机溶剂的显影剂的溶解率降低。

公开(公告)号：US20160075922A1

公开(公告)日：2016-03-17

申请号：US14953697

申请日：2015-11-30

Applicant: FUJIFILM Corporation

Inventor： Yu IWAI ,  Kazuhiro FUJIMAKI ,  Ichiro KOYAMA ,  Atsushi NAKAMURA

IPC: C09J151/00 ,  H01L21/683

CPC classification number: C09J151/003 ,  C09J4/00 ,  C09J5/04 ,  C09J5/06 ,  C09J125/14 ,  C09J133/12 ,  C09J133/16 ,  C09J183/06 ,  H01L21/304 ,  H01L21/306 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: By a temporary adhesive for production of semiconductor device containing (A) a radical polymerizable monomer or oligomer containing a fluorine atom or a silicon atom, (B) a polymer compound, and (C) a radical polymerization initiator, a temporary adhesive for production of semiconductor device, which is excellent in coating property, which reduces a problem of generation of gas therefrom in the temporary support even under high temperature condition when the member to be processed (for example, a semiconductor wafer) is subjected to a mechanical or chemical processing, and further which can easily release the temporary support for the member processed without imparting damage to the member processed even after being subjected to a process at a high temperature, and an adhesive support and a production method of semiconductor device using the same are provided.

公开(公告)号：US20150221881A1

公开(公告)日：2015-08-06

申请号：US14689216

申请日：2015-04-17

Applicant: FUJIFILM CORPORATION

Inventor： Yu IWAI ,  Atsushi NAKAMURA ,  Yoshitaka KAMOCHI ,  Masafumi YOSHIDA

IPC: H01L51/00 ,  C09D101/00 ,  G03F7/20 ,  C09D105/00

CPC classification number: H01L51/0093 ,  C09D101/00 ,  C09D105/00 ,  G03F7/027 ,  G03F7/0388 ,  G03F7/0392 ,  G03F7/11 ,  G03F7/20 ,  G03F7/325 ,  H01L21/02118 ,  H01L21/3065 ,  H01L51/004 ,  H01L51/107 ,  H01L51/448 ,  H01L51/5253 ,  H01L51/56

Abstract: There is provided a resin composition for use in formation of a protective film to protect a substrate or a film formed on the substrate, from a developer containing an organic solvent to be used for development in pattern formation, and which contains two or more kinds of resins in which their main chain structures having a hydroxyl group are different, and contains water, a pattern forming method using the resin composition, and layered products comprising a substrate, an organic semiconductor film on the substrate, and a protective film comprising two or more kinds of resins in which their main chain structures having a hydroxyl group are different, on the organic semiconductor film.

Abstract translation: 提供一种用于形成保护膜的树脂组合物，用于保护基板或形成在基板上的膜与图案形成中用于显影的有机溶剂的显影剂，并且其包含两种或更多种 具有羟基的主链结构不同且含有水的树脂，使用该树脂组合物的图案形成方法，以及包含基板，基板上的有机半导体膜以及包含两个以上的保护膜的层叠体 在有机半导体膜上具有羟基的主链结构不同的树脂种类。

公开(公告)号：US20150184033A1

公开(公告)日：2015-07-02

申请号：US14660244

申请日：2015-03-17

Applicant: FUJIFILM Corporation

Inventor： Yu IWAI ,  Kazuhiro FUJIMAKI ,  Ichiro KOYAMA

IPC: C09J4/00 ,  C09J7/02 ,  H01L21/683 ,  H01L21/304 ,  H01L21/306

CPC classification number: C09J4/00 ,  C08F222/10 ,  C09J4/06 ,  C09J7/00 ,  C09J7/385 ,  C09J133/06 ,  C09J2203/326 ,  C09J2400/22 ,  C09J2433/00 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/31058 ,  H01L21/31133 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: The invention is directed to a temporary adhesive containing (A) a polymer compound having a radical polymerizable group in its side chain, (B) a radical polymerizable monomer, and (C) a heat radical polymerization initiator, and a production method of semiconductor device having a member processed including: adhering a first surface of a member to be processed to a substrate through an adhesive layer formed from the temporary adhesive; conducting a mechanical or chemical processing on a second surface which is different from the first surface of the member to be processed to obtain the member processed; and releasing the first surface of the member processed from the adhesive layer.

Abstract translation: 本发明涉及一种临时粘合剂，其包含（A）在侧链具有自由基聚合性基团的高分子化合物，（B）自由基聚合性单体和（C）热自由基聚合引发剂，以及半导体装置的制造方法 其特征在于，包括：通过由所述临时粘合剂形成的粘合剂层将待加工的构件的第一表面粘附到基底; 在不同于待加工构件的第一表面的第二表面上进行机械或化学处理以获得处理的构件; 并释放从粘合剂层加工的构件的第一表面。