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    Laser projection device and laser projection system
    21.
    发明授权
    Laser projection device and laser projection system 有权

    公开(公告)号：US11109000B2

    公开(公告)日：2021-08-31

    申请号：US16487246

    申请日：2017-03-07

    Applicant: GOERTEK INC.

    Inventor： Zhe Wang ,  Xiaoyang Zhang ,  Quanbo Zou

    IPC: H04N9/31

    Abstract: The present disclosure provides a laser projection device and a laser projection system. The laser projection device includes a light source scanner and a MEMS scanning mirror, the light source scanner including micro laser diodes; and the micro laser diodes are used to provide laser beams needed for image projection, and the laser beams are projected to the MEMS scanning mirror, and then reflected by the MEMS scanning mirror to a predetermined area to form a projection image. By providing the micro laser diodes in the laser projection device and initiatively emitting laser by exciting the micro laser diodes, the present disclosure does not need an external laser source and facilitates the reduction of the size of the laser projection device, as compared with the prior art.

    Micro Laser Diode Display Device and Electronics Apparatus
    22.
    发明申请
    Micro Laser Diode Display Device and Electronics Apparatus 审中-公开

    公开(公告)号：US20200006924A1

    公开(公告)日：2020-01-02

    申请号：US16465376

    申请日：2016-12-05

    Applicant: Goertek, Inc.

    Inventor： Quanbo Zou ,  Zhe Wang

    IPC: H01S5/42 ,  H01S5/183 ,  H01S5/042 ,  H01S5/187

    Abstract: A micro laser diode display device and an electronics apparatus are disclosed. The micro laser diode display device comprises: a substrate (213)/receiving substrate (513). wherein first type electrodes (214, 514) are arranged on the substrate (213)/receiving substrate (513); a micro laser diode (200r, 200g, 200b, 400r, 400g, 400b, 500r, 500g, 500b) array of at least one color bonded on the substrate (213)/receiving substrate (513), wherein a first side of micro laser diodes (200r, 200g, 200b, 400r, 400g, 400b, 500r, 500g, 500b) in the micro laser diode array is connected to the first type electrodes (214, 514); and second type electrodes (211, 311, 511) connected to a second side of the micro laser diodes (200r, 200g, 200b, 400r, 400g, 400b, 500r, 500g, 500b).

    Piezoelectric speaker and method for forming the same
    23.
    发明授权
    Piezoelectric speaker and method for forming the same 有权

    公开(公告)号：US10284986B2

    公开(公告)日：2019-05-07

    申请号：US15569078

    申请日：2015-04-29

    Applicant: GOERTEK INC.

    Inventor： Quanbo Zou ,  Zhe Wang

    IPC: H04R31/00 ,  H04R17/00 ,  H04R17/10 ,  H04R7/06

    Abstract: A piezoelectric speaker and a method for forming the piezoelectric speaker are provided. The method includes: providing a piezoelectric actuator which includes a piezoelectric layer, a bottom electrode and a top electrode, wherein the bottom electrode and the top electrode are on two opposite surfaces of the piezoelectric layer; providing a speaker frame which includes a base and a bump structure on the base; forming a solder layer on a top surface of the bump structure; and combining the bottom electrode of the piezoelectric actuator with the speaker frame through the solder layer.

    Transferring method, manufacturing method, device and electronic apparatus of micro-LED
    24.
    发明授权
    Transferring method, manufacturing method, device and electronic apparatus of micro-LED 有权

    公开(公告)号：US10163869B2

    公开(公告)日：2018-12-25

    申请号：US15562411

    申请日：2015-10-20

    Applicant: GOERTEK, INC.

    Inventor： Quanbo Zou ,  Zhe Wang

    IPC: H01L21/00 ,  H01L21/30 ,  H01L21/46 ,  H01L21/78 ,  H01L21/301 ,  H01L25/075 ,  H01L33/00 ,  H01L21/673 ,  H01L21/677 ,  B81C3/00

    Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronics apparatus of micro-LED. The method for transferring micro-LED at wafer level comprises: temporarily bonding micro-LEDs on a laser-transparent original substrate onto a carrier substrate via a first bonding layer; irradiating the original substrate with laser, to lift-off selected micro-LEDs; performing a partial release on the first bonding layer, to transfer the selected micro-LEDs to the carrier substrate; temporarily bonding the micro-LEDs on the carrier substrate onto a transfer head substrate via a second bonding layer; performing a full release on the first bonding layer, to transfer the micro-LEDs to the transfer head substrate; bonding the micro-LEDs on the transfer head substrate onto a receiving substrate; and removing the transfer head substrate by releasing the second bonding layer, to transfer the micro-LEDs to the receiving substrate.

    TRANSFERRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPARATUS OF MICRO-LED
    27.
    发明申请
    TRANSFERRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPARATUS OF MICRO-LED 审中-公开

    公开(公告)号：US20180053751A1

    公开(公告)日：2018-02-22

    申请号：US15562411

    申请日：2015-10-20

    Applicant: GOERTEK, INC.

    Inventor： Quanbo Zou ,  Zhe Wang

    IPC: H01L25/075 ,  H01L33/00 ,  H01L21/673 ,  H01L21/677

    CPC classification number: H01L25/0753 ,  B81C3/001 ,  H01L21/673 ,  H01L21/67781 ,  H01L33/0079 ,  H01L2224/95

    Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronics apparatus of micro-LED. The method for transferring micro-LED at wafer level comprises: temporarily bonding micro-LEDs on a laser-transparent original substrate onto a carrier substrate via a first bonding layer; irradiating the original substrate with laser, to lift-off selected micro-LEDs; performing a partial release on the first bonding layer, to transfer the selected micro-LEDs to the carrier substrate; temporarily bonding the micro-LEDs on the carrier substrate onto a transfer head substrate via a second bonding layer; performing a full release on the first bonding layer, to transfer the micro-LEDs to the transfer head substrate; bonding the micro-LEDs on the transfer head substrate onto a receiving substrate; and removing the transfer head substrate by releasing the second bonding layer, to transfer the micro-LEDs to the receiving substrate.

    SILICON MICROPHONE WITH SUSPENDED DIAPHRAGM AND SYSTEM WITH THE SAME
    30.
    发明申请
    SILICON MICROPHONE WITH SUSPENDED DIAPHRAGM AND SYSTEM WITH THE SAME 审中-公开
    硅胶麦克风带有悬挂的胶片和系统

    公开(公告)号：US20170055085A1

    公开(公告)日：2017-02-23

    申请号：US15307301

    申请日：2014-06-27

    Applicant: GOERTEK INC.

    Inventor： Zhe Wang

    IPC: H04R19/04 ,  H04R19/00 ,  B81B3/00

    CPC classification number: H04R19/04 ,  B81B3/001 ,  B81B3/0051 ,  B81B3/0072 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  B81B2207/015 ,  B81C2203/0714 ,  H04R19/005 ,  H04R2201/003

    Abstract: A silicon microphone with a suspended diaphragm and a system with the same are provided, the microphone comprises: a silicon substrate provided with a back hole therein; a compliant diaphragm disposed above the back hole of the silicon substrate and separated from the silicon substrate; a perforated backplate disposed above the diaphragm with an air gap sandwiched in between; and a precisely defined support mechanism, disposed between the diaphragm and the backplate with one end thereof fixed to the edge of the diaphragm and the other end thereof fixed to the backplate, wherein the diaphragm and the backplate are used to form electrode plates of a variable condenser. The microphone with a suspended diaphragm can improve the repeatability and reproducibility in performance and can reduce the diaphragm stress induced by the substrate.

    Abstract translation: 提供具有悬挂隔膜的硅麦克风及其系统，所述麦克风包括：在其中设置有后孔的硅基板; 柔性膜，其设置在所述硅衬底的所述背孔的上方并与所述硅衬底分离; 设置在隔膜上方的穿孔背板，夹在其间的气隙; 以及精确限定的支撑机构，其设置在隔膜和背板之间，其一端固定在隔膜的边缘，另一端固定在背板上，其中隔膜和背板用于形成可变的电极板 冷凝器 具有悬挂隔膜的麦克风可以提高性能的重复性和再现性，并可以减少由基板引起的隔膜应力。

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