公开(公告)号：US20120319286A1

公开(公告)日：2012-12-20

申请号：US13163643

申请日：2011-06-17

申请人： DeokKyung Yang ,  In Sang Yoon ,  SangJin Lee

发明人： DeokKyung Yang ,  In Sang Yoon ,  SangJin Lee

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L21/565 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49811 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/18161

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a connection post on the substrate, the connection post having a post top and a post side; mounting an integrated circuit die on the substrate, the integrated circuit die having a top die surface; molding an encapsulation on the integrated circuit die and the connection post; and forming a connector recess in the encapsulation by removing the encapsulation around the connection post exposing a portion of the post side.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 在所述基板上形成连接柱，所述连接柱具有柱顶和柱侧; 在基板上安装集成电路管芯，集成电路管芯具有顶部管芯表面; 在集成电路管芯和连接柱上成型封装; 以及通过去除暴露一部分柱侧的连接柱周围的封装而在封装中形成连接器凹部。

公开(公告)号：US08299595B2

公开(公告)日：2012-10-30

申请号：US12727229

申请日：2010-03-18

申请人： In Sang Yoon ,  SeongMin Lee ,  SangJin Lee

发明人： In Sang Yoon ,  SeongMin Lee ,  SangJin Lee

IPC分类号： H01L23/40

CPC分类号： H01L24/73 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/4334 ,  H01L23/49811 ,  H01L23/552 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/732 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/16152 ,  H01L2924/167 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit package system includes: forming a base package including: fabricating a base package substrate having a component side and a system side, coupling a first integrated circuit die to the component side, and coupling stacking interconnects to the component side to surround the first integrated circuit die; forming a stacked integrated circuit package including: fabricating a stacked package substrate having a chip side, coupling a lower stacked integrated circuit die to the chip side, and attaching on a coupling side, of the stacked package substrate, the stacking interconnects; stacking the stacked integrated circuit package on the base package including the stacking interconnects of the stacked integrated circuit package on the stacking interconnects of the base package; and forming a stacked solder column by reflowing the stacked interconnects.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成基底封装，其包括：制造具有元件侧和系统侧的基底封装基板，将第一集成电路管芯耦合到元件侧，以及将堆叠互连件连接到元件 侧围绕第一集成电路管芯; 形成堆叠集成电路封装，包括：制造具有芯片侧的堆叠封装衬底，将下堆叠集成电路管芯耦合到芯片侧，并且在堆叠封装衬底的耦合侧上附接堆叠互连; 将所述堆叠集成电路封装堆叠在所述基底封装上，其中所述堆叠集成电路封装包括所述堆叠集成电路封装的所述堆叠互连， 以及通过回流堆叠的互连件形成堆叠的焊料柱。

公开(公告)号：US08124459B2

公开(公告)日：2012-02-28

申请号：US11306806

申请日：2006-01-11

申请人： In Sang Yoon ,  Han Shin Youn ,  Jae Soo Lee

发明人： In Sang Yoon ,  Han Shin Youn ,  Jae Soo Lee

IPC分类号： H01L21/50

CPC分类号： H01L23/3114 ,  H01L21/4832 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49541 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2221/68377 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16237 ,  H01L2224/81141 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/05599

摘要： A bump chip carrier semiconductor package system is provided including providing a lead frame, forming circuit sockets in the lead frame, mounting a semiconductor die on the lead frame, wherein the semiconductor die have electrical interconnects that connects to the circuit sockets, and encapsulating a molding compound to cover the semiconductor die and the electrical interconnects.

摘要翻译： 提供了一种凸块芯片载体半导体封装系统，包括提供引线框架，在引线框架中形成电路插座，将半导体管芯安装在引线框架上，其中半导体管芯具有连接到电路插座的电互连，并封装成型 复合以覆盖半导体管芯和电互连。

公开(公告)号：US20090085199A1

公开(公告)日：2009-04-02

申请号：US11865064

申请日：2007-09-30

申请人： In Sang Yoon ,  Sungmin Song

发明人： In Sang Yoon ,  Sungmin Song

IPC分类号： H01L23/34

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: providing a substrate; attaching an integrated circuit over the substrate; attaching an integrated circuit subassembly system having a perforated interposer over the substrate with the perforated interposer having a slot; and forming a package encapsulation over the integrated circuit subassembly system, the perforated interposer, the integrated circuit, and the substrate with the slot filled with the package encapsulation.

摘要翻译： 集成电路封装系统包括：提供衬底; 在衬底上附加集成电路; 将具有穿孔插入器的集成电路子组件系统附接到具有槽的穿孔插入件上; 以及在所述集成电路子组件系统，所述穿孔插入器，集成电路和衬底之间形成封装封装，所述插槽填充有封装封装。

公开(公告)号：US20070235216A1

公开(公告)日：2007-10-11

申请号：US11278418

申请日：2006-04-01

申请人： JoHyun Bae ,  In Sang Yoon

发明人： JoHyun Bae ,  In Sang Yoon

IPC分类号： H05K1/16

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4911 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A multichip integrated circuit package system is provided attaching a first integrated circuit die on a substrate top surface, mounting a second integrated circuit die over the first integrated circuit die, connecting an external interconnect on a substrate bottom surface, and forming a first encapsulation having a recess to expose a portion of the substrate bottom surface and the external interconnect.

摘要翻译： 提供了一种多芯片集成电路封装系统，其将第一集成电路管芯安装在衬底顶表面上，将第二集成电路管芯安装在第一集成电路管芯上，连接衬底底表面上的外部互连件，以及形成第一封装， 凹陷以暴露衬底底表面和外部互连的一部分。

公开(公告)号：US09385066B1

公开(公告)日：2016-07-05

申请号：US14282598

申请日：2014-05-20

申请人： In Sang Yoon ,  DeokKyung Yang ,  Sungmin Song

发明人： In Sang Yoon ,  DeokKyung Yang ,  Sungmin Song

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L23/538

CPC分类号： H01L23/481 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5385 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A method of manufacture of an integrated packaging system includes: providing a substrate; mounting an integrated circuit on the substrate; mounting an interposer substrate having an interposer pad on the integrated circuit; covering an encapsulant over the integrated circuit and the interposer substrate; forming a hole through the encapsulant aligned over the interposer pad; and placing a conductive connector on and in direct contact with the interposer pad.

摘要翻译： 一种集成包装系统的制造方法包括：提供基板; 在基板上安装集成电路; 在所述集成电路上安装具有插入器焊盘的插入器基板; 覆盖集成电路和插入器衬底上的密封剂; 通过所述密封剂形成穿过所述插入器衬垫的孔; 并且将导电连接器放置在与插入器垫直接接触的位置。

公开(公告)号：US09349666B1

公开(公告)日：2016-05-24

申请号：US14231526

申请日：2014-03-31

申请人： JoHyun Bae ,  In Sang Yoon ,  DaeSik Choi

发明人： JoHyun Bae ,  In Sang Yoon ,  DaeSik Choi

IPC分类号： H01L23/00 ,  H01L25/00 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065

CPC分类号： H01L23/3114 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit packaging system includes: providing a base substrate; applying a molded under-fill on the base substrate; forming a substrate contact extender through the molded under-fill and in direct contact with the base substrate; mounting a stack device over the molded under-fill; attaching a coupling connector from the substrate contact extender to the stack device; and forming a base encapsulation on the stack device, the substrate contact extender, and encapsulating the coupling connector.

摘要翻译： 一种集成电路封装系统，包括：提供基底; 将模制的填充物施加在基底基底上; 通过模制的下填充形成基底接触延伸器并与基底基板直接接触; 将堆叠装置安装在模制的填充物上; 将耦合连接器从所述基板接触延伸器附接到所述堆叠装置; 以及在所述堆叠装置上形成基底封装，所述衬底接触扩展器和封装所述耦合连接器。

公开(公告)号：US09202715B2

公开(公告)日：2015-12-01

申请号：US13298267

申请日：2011-11-16

申请人： YoungChul Kim ,  KyungHoon Lee ,  Seong Won Park ,  Ki Youn Jang ,  JaeHyun Lee ,  DeokKyung Yang ,  In Sang Yoon ,  SungEun Park

发明人： YoungChul Kim ,  KyungHoon Lee ,  Seong Won Park ,  Ki Youn Jang ,  JaeHyun Lee ,  DeokKyung Yang ,  In Sang Yoon ,  SungEun Park

IPC分类号： H01L23/31 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00 ,  H01L25/10

CPC分类号： H01L21/565 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching a connection post to the substrate, the connection post having a post top and a post side; mounting an integrated circuit die on the substrate, the integrated circuit die having a top die surface; and forming a package body on the substrate, the connection post, and the integrated circuit die.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 将连接柱附接到所述基板，所述连接柱具有柱顶和柱侧; 在基板上安装集成电路管芯，集成电路管芯具有顶部管芯表面; 以及在所述基板，所述连接柱和所述集成电路管芯上形成封装体。

公开(公告)号：US08698297B2

公开(公告)日：2014-04-15

申请号：US13243699

申请日：2011-09-23

申请人： JoHyun Bae ,  In Sang Yoon ,  DaeSik Choi

发明人： JoHyun Bae ,  In Sang Yoon ,  DaeSik Choi

IPC分类号： H01L23/02 ,  H01L23/08 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3114 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; applying a molded under-fill on the base substrate; forming a substrate contact extender through the molded under-fill and in direct contact with the base substrate; mounting a stack device over the molded under-fill; attaching a coupling connector from the substrate contact extender to the stack device; and forming a base encapsulation on the stack device, the substrate contact extender, and encapsulating the coupling connector.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供基底; 将模制的填充物施加在基底基底上; 通过模制的下填充形成基底接触延伸器并与基底基板直接接触; 将堆叠装置安装在模制的填充物上; 将耦合连接器从所述基板接触延伸器附接到所述堆叠装置; 以及在所述堆叠装置上形成基底封装，所述衬底接触扩展器和封装所述耦合连接器。

公开(公告)号：US08129832B2

公开(公告)日：2012-03-06

申请号：US11927646

申请日：2007-10-29

申请人： Flynn Carson ,  In Sang Yoon ,  SeongMin Lee ,  JoHyun Bae

发明人： Flynn Carson ,  In Sang Yoon ,  SeongMin Lee ,  JoHyun Bae

IPC分类号： H01L23/48

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L24/28 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/078 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A mountable integrated circuit package system includes: providing a carrier; mounting a first integrated circuit device over the carrier; mounting a substrate over the first integrated circuit device with the substrate having a conductor-free recess; connecting a first electrical interconnect under the conductor-free recess electrically connecting the carrier and the first integrated circuit device; and forming a package encapsulation over the carrier, the first integrated circuit device, the first electrical interconnect, the conductor-free recess, and partially exposing the substrate.

摘要翻译： 一种可安装的集成电路封装系统，包括：提供载体; 在载体上安装第一集成电路装置; 将衬底安装在第一集成电路器件上，衬底具有无导体凹槽; 在所述无导体凹部下方连接电连接所述载体和所述第一集成电路器件的第一电互连; 以及在所述载体，所述第一集成电路器件，所述第一电互连，所述无导体凹部以及部分地暴露所述衬底之后形成封装封装。