公开(公告)号：US11721560B2

公开(公告)日：2023-08-08

申请号：US17402595

申请日：2021-08-15

Applicant: InnoLux Corporation

Inventor： Chia-Chieh Fan ,  Chin-Lung Ting ,  Cheng-Chi Wang ,  Ming-Tsang Wu

IPC: H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L25/00 ,  H01L21/683 ,  H01L23/31 ,  H01L25/10

CPC classification number: H01L21/568 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L24/97 ,  H01L25/50 ,  H01L23/3128 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/12105 ,  H01L2224/95001 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/18162 ,  H01L2924/3511

Abstract: A manufacturing method of semiconductor device includes providing a substrate, forming a sacrificial layer on the substrate, forming a resin layer on the sacrificial layer, disposing first chips on the sacrificial layer, and forming a first dielectric layer having trenches and surrounding the first chips, wherein an upper surface of the first dielectric layer and an upper surface of the resin layer are at a same plane.

公开(公告)号：US11307454B2

公开(公告)日：2022-04-19

申请号：US17010186

申请日：2020-09-02

Applicant: InnoLux Corporation

Inventor： Shan-Shan Hsu ,  Ming-Tsang Wu ,  Chia-Chieh Fan

IPC: G02F1/13357 ,  H05K1/18 ,  G02F1/1335

Abstract: An electronic device is provided. The electronic device includes a backlight module, a display panel, an adhesive layer, and a flexible circuit board. The display panel is disposed on the backlight module. The adhesive layer is disposed between the backlight module and the display panel. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the display panel. The flexible circuit board overlaps the opening.

公开(公告)号：US11127604B2

公开(公告)日：2021-09-21

申请号：US16211194

申请日：2018-12-05

Applicant: InnoLux Corporation

Inventor： Chia-Chieh Fan ,  Chin-Lung Ting ,  Cheng-Chi Wang ,  Ming-Tsang Wu

IPC: H01L21/56 ,  H01L21/48 ,  H01L25/00 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10

Abstract: A manufacturing method of semiconductor device includes providing a substrate, forming a sacrificial layer on the substrate, disposing first chips on the sacrificial layer, forming a first dielectric layer surrounding the first chips, forming trenches in the first dielectric layer, and forming a second dielectric layer in the trenches, wherein an upper surface of the first dielectric layer and an upper surface of the second dielectric layer are at a same plane.

公开(公告)号：US20210259103A1

公开(公告)日：2021-08-19

申请号：US17155097

申请日：2021-01-22

Applicant: Innolux Corporation

Inventor： Jia Sin Li ,  Tong-Jung Wang ,  Chia-Chieh Fan ,  Shan Shan Hsu ,  Chih Han Ma

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/00

Abstract: An electronic device and a method for manufacturing a flexible circuit board are provided. The electronic device includes the flexible circuit board. The flexible circuit board includes a first flexible substrate, a first seed layer, a first conductive layer, and a second seed layer. The first seed layer is disposed on the first flexible substrate. The first conductive layer is disposed on the first seed layer. The second seed layer is disposed on the first conductive layer. The first seed layer is in contact with the first conductive layer.

公开(公告)号：US11075155B2

公开(公告)日：2021-07-27

申请号：US16655201

申请日：2019-10-16

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Cheng-Chi Wang ,  Kuan-Jen Wang

IPC: H01L21/66 ,  H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L21/78 ,  H01L21/56 ,  H01L23/31

Abstract: A package structure includes a redistribution layer having a first surface, a second surface disposed opposite to the first surface, and at least one sidewall connected to the first surface and the second surface, at least one bonding electrode disposed on the first surface of the redistribution layer, and a mounting layer disposed on the second surface of the redistribution layer. The mounting layer includes a plurality of conductive pads that are spaced apart from each other. At least one of the conductive pads is exposed by the sidewall of the redistribution layer.

公开(公告)号：US20180190579A1

公开(公告)日：2018-07-05

申请号：US15854728

申请日：2017-12-26

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Cheng-Chi Wang ,  Kuan-Jen Wang

IPC: H01L23/498 ,  H01L21/66 ,  H01L23/00 ,  H01L21/48 ,  H01L21/683 ,  H01L21/78 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/78 ,  H01L22/14 ,  H01L22/32 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16502 ,  H01L2224/80411 ,  H01L2224/80444 ,  H01L2224/80455 ,  H01L2224/81005 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81455 ,  H01L2224/81805 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/37001 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/013

Abstract: A package structure includes a redistribution layer, at least one bonding electrode, and a mounting layer. The redistribution layer has a first surface, a second surface disposed opposite to the first surface, and at least one sidewall connected to the first surface and the second surface. The bonding electrode is disposed on the first surface of the redistribution layer. The mounting layer is disposed on the second surface of the redistribution layer. The mounting layer includes a plurality of conductive pads spaced apart from each other, wherein at least one of the conductive pads is exposed by the sidewall of the redistribution layer.