公开(公告)号：US07205501B2

公开(公告)日：2007-04-17

申请号：US10927185

申请日：2004-08-27

申请人： Kunio Arai ,  Kazuhisa Ishii ,  Hiroaki Ashizawa

发明人： Kunio Arai ,  Kazuhisa Ishii ,  Hiroaki Ashizawa

IPC分类号： B23K26/38

CPC分类号： H05K3/0038 ,  B23K26/04 ,  B23K26/0622 ,  B23K26/384 ,  B23K2101/42 ,  B23K2103/12

摘要： A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.

摘要翻译： 激光加工方法和激光加工装置，其孔位精度和孔质量优异。 作为短脉冲输出的输出光束通过脉冲整形单元成形，从而形成＃1分支光束。 将＃1分支光束供给到要加工的部分，以便加工该部分。 在这种情况下，可以控制＃1分支光束与输出光束同步。 当要被加工的零件由金属材料和有机材料和无机材料中的至少一种制成时，金属材料被加工成具有不小于100ns的脉冲宽度的激光束，并且至少一个 的有机材料和无机材料用激光束加工成具有短于100ns的脉冲宽度。

公开(公告)号：US20050155958A1

公开(公告)日：2005-07-21

申请号：US10927185

申请日：2004-08-27

申请人： Kunio Arai ,  Kazuhisa Ishii ,  Hiroaki Ashizawa

发明人： Kunio Arai ,  Kazuhisa Ishii ,  Hiroaki Ashizawa

IPC分类号： B23K26/04 ,  B23K26/06 ,  B23K26/073 ,  B23K101/40 ,  B23K101/42 ,  H05K3/00 ,  B23K26/40

CPC分类号： H05K3/0038 ,  B23K26/04 ,  B23K26/0622 ,  B23K26/384 ,  B23K2101/42 ,  B23K2103/12

摘要： A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.

摘要翻译： 激光加工方法和激光加工装置，其孔位精度和孔质量优异。 作为短脉冲输出的输出光束通过脉冲整形单元成形，从而形成＃1分支光束。 将＃1分支光束供给到要加工的部分，以便加工该部分。 在这种情况下，可以控制＃1分支光束与输出光束同步。 当要被加工的零件由金属材料和有机材料和无机材料中的至少一种制成时，金属材料被加工成具有不小于100ns的脉冲宽度的激光束，并且至少一个 的有机材料和无机材料用激光束加工成具有短于100ns的脉冲宽度。

公开(公告)号：US6043453A

公开(公告)日：2000-03-28

申请号：US41005

申请日：1998-03-12

申请人： Kunio Arai

发明人： Kunio Arai

IPC分类号： B23K26/02 ,  B23K26/06 ,  B23K26/067 ,  B23K26/073 ,  B23K26/28 ,  H01L21/48 ,  B23K26/00

CPC分类号： B23K26/0738 ,  B23K26/037 ,  B23K26/066 ,  B23K26/067 ,  B23K26/28 ,  H01L21/4803 ,  H01L21/4864 ,  H05K2203/0228 ,  H05K2203/056

摘要： The apparatus is for spot-facing for exposing an inner-layer conductor embedded in an insulator of a printed circuit board. The spot-facing removes the entire insulator by a mechanical cutter, except a remaining part thereof, to a position just above the inner-layer conductor. The remaining part of the insulator is smaller in thickness than the insulator removed by the mechanical cutter. Then, the remaining part of the insulator is removed by scanning the part with a laser beam to expose the inner-layer conductor. The laser beam is in a slender (elongated) shape almost perpendicular to the scanning direction of the laser beam and has an almost uniform energy density along the slender shape. Cutter processing is sufficient to be done before the inner-layer conductor, and there is no fear of damaging the inner-layer conductor. Moreover, it is easy to control thermal influence on the portion of the circuit board to be processed by the laser beam, because the energy density of the laser beam is almost uniform. Therefore, the product yield according to the processing is improved.

摘要翻译： 该装置用于曝光嵌入在印刷电路板的绝缘体中的内层导体的面对。 点对面通过机械切割器将除了其余部分之外的整个绝缘体移除到刚好在内层导体上方的位置。 绝缘体的剩余部分的厚度小于由机械切割器去除的绝缘体。 然后，通过用激光束扫描该部分来去除绝缘体的剩余部分以暴露内层导体。 激光束呈细长（细长）的形状，几乎垂直于激光束的扫描方向，沿着细长形状具有几乎均匀的能量密度。 切割机处理足以在内层导体之前进行，并且不用担心损坏内层导体。 此外，由于激光束的能量密度几乎均匀，因此易于控制由激光束处理的电路板的部分的热影响。 因此，根据加工的产品产量提高。

公开(公告)号：US07335296B2

公开(公告)日：2008-02-26

申请号：US10486907

申请日：2002-10-09

申请人： Kunio Arai ,  Hiroshi Inomata ,  Richard Lee Smith, Jr.

发明人： Kunio Arai ,  Hiroshi Inomata ,  Richard Lee Smith, Jr.

IPC分类号： B01D17/12

CPC分类号： B01J3/008 ,  B01J3/006 ,  B01J19/004 ,  B01J2219/00038 ,  B01J2219/00162 ,  B01J2219/00171 ,  Y02P20/544

摘要： A system for processing supercritical and subcritical fluid capable of bringing the inside of at least one processing container (1) formed in a flow passage into a supercritical or subcritical high pressure field, wherein thermal operation is applied to process fluid to apply thermal expansion to the fluid to produce a pressure difference between the processing container (1) and the outside, whereby a specified temperature and the high pressure field suitable for the processing of the supercritical or subcritical fluid can be provided in the processing container (1).

摘要翻译： 一种用于处理超临界和亚临界流体的系统，其能够使形成在流动通道中的至少一个处理容器（1）的内部进入超临界或亚临界高压场，其中施加热操作以处理流体以将热膨胀施加到 流体以在处理容器（1）和外部之间产生压力差，从而可以在处理容器（1）中提供适合于处理超临界或亚临界流体的特定温度和高压场。

公开(公告)号：US20070075059A1

公开(公告)日：2007-04-05

申请号：US11525154

申请日：2006-09-22

申请人： Kunio Arai

发明人： Kunio Arai

IPC分类号： B23K26/38 ,  B23K26/06

CPC分类号： B23K26/067 ,  B23K26/389

摘要： There is provided a laser machining method and a laser machining apparatus whose machining accuracy and quality excel without lowering machining efficiency. One hole is machined by a split beam that is a first pulsed laser beam and another split beam that is a second pulsed laser beam whose irradiation position is determined based on irradiation position of the first laser beam. In this case, the machining quality may be improved by machining the circular hole by equalizing circling directions and angular velocity of the split beams. A beam splitter splits a laser beam outputted out of one laser oscillator into the split beams and AOMs can time-share them.

摘要翻译： 提供了一种激光加工方法和激光加工装置，其加工精度和质量优异，而不降低加工效率。 一个孔由作为第一脉冲激光束的分束和另一个分割光束加工，该分束是第二脉冲激光束，其照射位置是基于第一激光束的照射位置确定的。 在这种情况下，通过使分割光束的旋转方向和角速度相等来加工圆形孔，可以提高加工质量。 分束器将从一个激光振荡器输出的激光束分成分束，并且AOM可以分时分配。

公开(公告)号：US07182861B2

公开(公告)日：2007-02-27

申请号：US10197274

申请日：2002-07-16

申请人： Kunitoshi Sugiyama ,  Yoshihiko Itoh ,  Hideyuki Santoh ,  Kunio Arai ,  Tadafumi Ajiri

发明人： Kunitoshi Sugiyama ,  Yoshihiko Itoh ,  Hideyuki Santoh ,  Kunio Arai ,  Tadafumi Ajiri

IPC分类号： B08B7/04 ,  B01J19/00 ,  B01J19/02

CPC分类号： B08B7/0021 ,  G03G9/113 ,  G03G9/1131

摘要： A method for use in two-components electrostatic image developers is disclosed, in which secure separation of a carrier coating resinous materials from a core magnetic material is achieved without affecting the properties of the core materials through process steps benign to the environment in super- or sub-critical water compositions under the conditions of a temperature of 300° C. or more and a pressure of 20 MPa. The core magnetic material is subsequently recycled for forming carrier. This method may also be useful for processing waste including magnetic materials with silicone resin coating.

摘要翻译： 公开了一种用于双组分静电图像显影剂的方法，其中，通过在超级或超纯度静电图像显影剂的环境中良好的处理步骤，可以在不影响芯材料的性能的情况下实现载体涂覆树脂材料与芯磁性材料的固定分离 亚临界水组合物在温度为300℃以上，压力为20MPa的条件下进行。 核心磁性材料随后被再循环用于形成载体。 该方法也可用于处理包括具有硅树脂涂层的磁性材料的废物。

公开(公告)号：US20050244621A1

公开(公告)日：2005-11-03

申请号：US11117505

申请日：2005-04-29

申请人： Kunio Arai ,  Haruo Akahoshi

发明人： Kunio Arai ,  Haruo Akahoshi

IPC分类号： B32B3/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/06 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K3/4679 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/06 ,  H05K3/062 ,  H05K3/421 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0112 ,  H05K2201/09845 ,  H05K2201/09918 ,  H05K2203/0315 ,  H05K2203/0346 ,  H05K2203/0554 ,  Y10T428/24917

摘要： The invention is to provide a printed circuit board in which advance of packaging density of the printed circuit board and reduction in production cost can be attained while processing quality can be made uniform, a method for processing the printed circuit board and a method for producing the printed circuit board. There is provided a printed circuit board including an alternate laminate of electric conductor layers and electrically insulating layers, wherein a coating layer capable of absorbing laser light but insoluble in an etching solution dissolving the electric conductor layers is provided on a front surface of a first one of the electric conductor layers. In this case, the coating layer may be provided on a front surface of a rear one of the electric conductor layers. Each of the electric conductor layers may contain Cu as a main component while the coating layer may contain CuO as a main component. The coating layer may have a thickness not thinner than 0.6 μm.

摘要翻译： 本发明提供一种印刷电路板，其中能够使加工质量均匀的印刷电路板的封装密度的提高和生产成本的降低，印刷电路板的处理方法和制造方法 印刷电路板。 提供了一种印刷电路板，其包括导电层和电绝缘层的交替叠层，其中在第一个的前表面上设置有能够吸收激光但不溶于溶解导电层的蚀刻溶液的涂层 的导电层。 在这种情况下，涂层可以设置在后导体层的前表面上。 每个导电体层可以包含Cu作为主要成分，而涂层可以包含CuO作为主要成分。 涂层可以具有不小于0.6μm的厚度。

公开(公告)号：US06531677B2

公开(公告)日：2003-03-11

申请号：US09970909

申请日：2001-10-05

申请人： Kunio Arai ,  Kazuhisa Ishii ,  Yasuhiko Kita

发明人： Kunio Arai ,  Kazuhisa Ishii ,  Yasuhiko Kita

IPC分类号： B23K2638

CPC分类号： B23K26/0613 ,  B23K26/0604 ,  B23K26/067 ,  B23K26/389 ,  H05K1/0366 ,  H05K3/0035 ,  H05K3/0038 ,  H05K2203/108

摘要： An improved method and apparatus for drilling blind via holes to connect between upper conductive layers and lower conductive layers of printed wiring boards with laser lights. The resin layer contacting the targeted conductive layer is drilled to remain the residual layer with laser lights, and the residual layer is removed with a UV laser beam whose energy density is lower than the decomposition energy threshold of the conductive layer and higher than that of the resin layer. The apparatus for this drilling has at least two laser paths. The spatial energy distributions are made top-hat-shaped with beam homogenizer units in the paths, and the diameters and the energy densities are adjusted independently.

摘要翻译： 一种用于钻孔盲孔的改进方法和装置，以连接具有激光的印刷线路板的上导电层和下导电层。 钻孔与目标导电层接触的树脂层用激光保持残留层，残余层用能量密度低于导电层分解能阈值的紫外激光束去除，高于 树脂层。 用于该钻孔的装置具有至少两个激光路径。 空间能量分布由路径中的光束均化器单元制成顶帽形，直径和能量密度独立调整。

公开(公告)号：US20080230512A1

公开(公告)日：2008-09-25

申请号：US12110466

申请日：2008-04-28

申请人： Kunio Arai ,  Haruo Akahoshi

发明人： Kunio Arai ,  Haruo Akahoshi

IPC分类号： H01B13/00

CPC分类号： H05K3/4679 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/06 ,  H05K3/062 ,  H05K3/421 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0112 ,  H05K2201/09845 ,  H05K2201/09918 ,  H05K2203/0315 ,  H05K2203/0346 ,  H05K2203/0554 ,  Y10T428/24917

摘要： The invention is to provide a printed circuit board in which advance of packaging density of the printed circuit board and reduction in production cost can be attained while processing quality can be made uniform, a method for processing the printed circuit board and a method for producing the printed circuit board.There is provided a printed circuit board including an alternate laminate of electric conductor layers and electrically insulating layers, wherein a coating layer capable of absorbing laser light but insoluble in an etching solution dissolving the electric conductor layers is provided on a front surface of a first one of the electric conductor layers. In this case, the coating layer may be provided on a front surface of a rear one of the electric conductor layers. Each of the electric conductor layers may contain Cu as a main component while the coating layer may contain CuO as a main component. The coating layer may have a thickness not thinner than 0.6 μm.

摘要翻译： 本发明提供一种印刷电路板，其中能够使加工质量均匀的印刷电路板的封装密度的提高和生产成本的降低，印刷电路板的处理方法和制造方法 印刷电路板。 提供了一种印刷电路板，其包括导电层和电绝缘层的交替叠层，其中在第一个的前表面上设置有能够吸收激光但不溶于溶解导电层的蚀刻溶液的涂层 的导电层。 在这种情况下，涂层可以设置在后导体层的前表面上。 每个导电体层可以包含Cu作为主要成分，而涂层可以包含CuO作为主要成分。 涂层可以具有不小于0.6μm的厚度。

公开(公告)号：US20080053974A1

公开(公告)日：2008-03-06

申请号：US11843274

申请日：2007-08-22

申请人： Kunio Arai ,  Yasuhiko Kita ,  Yasushi Ito

发明人： Kunio Arai ,  Yasuhiko Kita ,  Yasushi Ito

IPC分类号： B23K26/06

CPC分类号： B23K26/0648 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/082 ,  B23K26/382 ,  B23K2101/42 ,  B23K2103/50

摘要： A laser machining method and a laser machining apparatus by which holes excelling in form accuracy can be machined efficiently are to be provided. A first cylindrical lens and/or a second cylindrical lens to correct any deformation of reflective face of a first mirror and/or a second mirror is arranged on an optical axis of a laser beam, and converging positions of the laser beam for an X-component and for a Y-component are coincident with a point on the optical axis.

摘要翻译： 可以提供激光加工方法和激光加工装置，通过该激光加工方法可以有效地加工成形精度优异的孔。 用于校正第一反射镜和/或第二反射镜的反射面的任何变形的第一柱面透镜和/或第二柱面透镜布置在激光束的光轴上，并且用于X射线的激光束的会聚位置， 分量和Y分量与光轴上的点重合。