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公开(公告)号：US09559142B2
公开(公告)日：2017-01-31
申请号：US14931695
申请日：2015-11-03
Applicant: LuxVue Technology Corporation
Inventor： Kapil V. Sakariya , Andreas Bibl , Hsin-Hua Hu
CPC classification number: H01L27/156 , G09G3/32 , H01L24/95 , H01L25/0753 , H01L27/124 , H01L33/20 , H01L33/42 , H01L33/62 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/00
Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area.
Abstract translation: 描述显示面板和形成显示面板的方法。 显示面板可以包括包括像素区域和非像素区域的薄膜晶体管基板。 像素区域包括堤开口的阵列和堤开口阵列内的一组底部电极。 接地线位于非像素区域中，并且阵列阵列在像素区域中的堤开口之间延伸并且电连接到非像素区域中的接地线。
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公开(公告)号：US09343448B2
公开(公告)日：2016-05-17
申请号：US14860185
申请日：2015-09-21
Applicant: LuxVue Technology Corporation
Inventor： Kapil V. Sakariya , Andreas Bibl , Hsin-Hua Hu
CPC classification number: H01L25/167 , H01L24/24 , H01L24/29 , H01L24/75 , H01L24/82 , H01L24/83 , H01L24/95 , H01L27/1214 , H01L33/06 , H01L33/38 , H01L33/42 , H01L33/54 , H01L33/62 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/73267 , H01L2224/75281 , H01L2224/75282 , H01L2224/75725 , H01L2224/7598 , H01L2224/83193 , H01L2224/8381 , H01L2224/83825 , H01L2224/92244 , H01L2924/01322 , H01L2924/10156 , H01L2924/12041 , H01L2924/12044 , H01L2924/00
Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. An array of micro LED devices are bonded to the corresponding array of bottom electrodes within the array of bank openings. An array of top electrode layers are formed electrically connecting the array of micro LED devices to a ground line in the non-pixel area.
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公开(公告)号：US20160056204A1
公开(公告)日：2016-02-25
申请号：US14931695
申请日：2015-11-03
Applicant: LuxVue Technology Corporation
Inventor： Kapil V. Sakariya , Andreas Bibl , Hsin-Hua Hu
CPC classification number: H01L27/156 , G09G3/32 , H01L24/95 , H01L25/0753 , H01L27/124 , H01L33/20 , H01L33/42 , H01L33/62 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/00
Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area.
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公开(公告)号：US09263627B2
公开(公告)日：2016-02-16
申请号：US14563763
申请日：2014-12-08
Applicant: LuxVue Technology Corporation
Inventor： John A. Higginson , Andreas Bibl , Hsin-Hua Hu
IPC: H01L21/00 , B23P19/00 , H01L33/00 , H01L33/44 , H01L23/31 , H01L33/06 , H01L33/42 , H01L33/62 , H01L21/56
CPC classification number: H01L25/167 , H01L21/56 , H01L23/3171 , H01L25/0753 , H01L25/50 , H01L27/1214 , H01L27/1248 , H01L27/1262 , H01L33/005 , H01L33/06 , H01L33/42 , H01L33/44 , H01L33/54 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2933/0025 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
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公开(公告)号：US09214494B2
公开(公告)日：2015-12-15
申请号：US14640979
申请日：2015-03-06
Applicant: LuxVue Technology Corporation
Inventor： Kapil V. Sakariya , Andreas Bibl , Hsin-Hua Hu
CPC classification number: H01L27/156 , G09G3/32 , H01L24/95 , H01L25/0753 , H01L27/124 , H01L33/20 , H01L33/42 , H01L33/62 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/00
Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area.
Abstract translation: 描述显示面板和形成显示面板的方法。 显示面板可以包括包括像素区域和非像素区域的薄膜晶体管基板。 像素区域包括堤开口的阵列和堤开口阵列内的一组底部电极。 接地线位于非像素区域中，并且阵列阵列在像素区域中的堤开口之间延伸并且电连接到非像素区域中的接地线。
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Patent Agency Ranking
公开(公告)号：US09159700B2
公开(公告)日：2015-10-13
申请号：US13842721
申请日：2013-03-15
Applicant: LuxVue Technology Corporation
Inventor： Kapil V. Sakariya , Andreas Bibl , Hsin-Hua Hu
CPC classification number: H01L25/167 , H01L24/24 , H01L24/29 , H01L24/75 , H01L24/82 , H01L24/83 , H01L24/95 , H01L27/1214 , H01L33/06 , H01L33/38 , H01L33/42 , H01L33/54 , H01L33/62 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/73267 , H01L2224/75281 , H01L2224/75282 , H01L2224/75725 , H01L2224/7598 , H01L2224/83193 , H01L2224/8381 , H01L2224/83825 , H01L2224/92244 , H01L2924/01322 , H01L2924/10156 , H01L2924/12041 , H01L2924/12044 , H01L2924/00
Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. An array of micro LED devices are bonded to the corresponding array of bottom electrodes within the array of bank openings. An array of top electrode layers are formed electrically connecting the array of micro LED devices to a ground line in the non-pixel area.
Abstract translation: 描述显示面板和形成显示面板的方法。 显示面板可以包括包括像素区域和非像素区域的薄膜晶体管基板。 像素区域包括堤开口的阵列和堤开口阵列内的一组底部电极。 一组微型LED器件结合到阵列阵列内的相应阵列的底部电极。 形成将微型LED器件的阵列电连接到非像素区域中的接地线的顶部电极层的阵列。
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公开(公告)号：US20150273700A1
公开(公告)日：2015-10-01
申请号：US14723231
申请日：2015-05-27
Applicant: LuxVue Technology Corporation
Inventor： Andreas Bibl , John A. Higginson , Hsin-Hua Hu
IPC: B25J15/00
CPC classification number: B41J2/385 , B25J15/0052 , B25J15/0085 , B41J2/39 , B81B2201/038 , B81C99/002 , H01L21/67144 , H01L21/6835 , H01L24/75 , H01L24/83 , H01L24/97 , H01L25/0753 , H01L33/0079 , H01L2221/68322 , H01L2221/68354 , H01L2221/68363 , H01L2221/68381 , H01L2224/29036 , H01L2224/29101 , H01L2224/2919 , H01L2224/7565 , H01L2224/7598 , H01L2224/83815 , H01L2224/83855 , H01L2224/97 , H01L2924/12041 , H01L2924/00 , H01L2224/83 , H01L2924/00014
Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.
Abstract translation: 公开了一种兼容的微器件传送头和头阵列。 在一个实施例中，微装置转移头包括可偏转到基底基板和弹簧部分之间的空间中的弹簧部分。
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公开(公告)号：US09035279B2
公开(公告)日：2015-05-19
申请号：US13937000
申请日：2013-07-08
Applicant: LuxVue Technology Corporation
Inventor： Hsin-Hua Hu , Kevin K. C. Chang , Andreas Bibl
CPC classification number: H01L33/62 , H01L24/75 , H01L24/83 , H01L24/95 , H01L25/0753 , H01L27/15 , H01L27/156 , H01L33/005 , H01L33/0079 , H01L33/0095 , H01L33/04 , H01L33/06 , H01L33/08 , H01L33/32 , H01L33/60 , H01L2224/83005 , H01L2924/12041 , H01L2924/12042 , H01L2933/0066 , H01L2924/00
Abstract: A method and structure for stabilizing an array of micro devices is disclosed. A stabilization layer includes an array of stabilization cavities and array of stabilization posts. Each stabilization cavity includes sidewalls surrounding a stabilization post. The array of micro devices is on the array of stabilization posts. Each micro device in the array of micro devices includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
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29.发明授权Micro device transfer head heater assembly and method of transferring a micro device 有权微型设备传送头加热器组件和传送微型设备的方法公开(公告)号：US08789573B2
公开(公告)日：2014-07-29
申请号：US13708686
申请日：2012-12-07
Applicant: LuxVue Technology Corporation
Inventor： Andreas Bibl , John A. Higginson , Hung-Fai Stephen Law , Hsin-Hua Hu
CPC classification number: H01L29/167 , B32B38/18 , H01L21/67144 , H01L24/75 , H01L24/83 , H01L24/95 , H01L24/97 , H01L25/0753 , H01L33/62 , H01L2224/75725 , H01L2224/7598 , H01L2224/83005 , H01L2224/97 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1421 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2933/0066 , Y10T156/1153 , Y10T156/17 , Y10T156/1705 , Y10T156/1707 , Y10T156/1744 , Y10T156/1749 , Y10T156/1776 , Y10T156/1911 , H01L2224/83 , H01L2924/00
Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
Abstract translation: 公开了一种传送微型装置和微型装置阵列的方法。 承载连接到接合层的微型器件的载体衬底被加热到低于接合层的液相线温度的温度，并且转移头被加热到高于接合层的液相线温度的温度。 当微型装置与转印头接触时，来自转印头的热量转移到粘结层中以至少部分地熔化粘结层。 施加到转印头的电压产生从载体衬底拾取微器件的夹持力。
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公开(公告)号：US20140159067A1
公开(公告)日：2014-06-12
申请号：US13842721
申请日：2013-03-15
Applicant: LUXVUE TECHNOLOGY CORPORATION
Inventor： Kapil V. Sakariya , Andreas Bibl , Hsin-Hua Hu
IPC: H01L27/12
CPC classification number: H01L25/167 , H01L24/24 , H01L24/29 , H01L24/75 , H01L24/82 , H01L24/83 , H01L24/95 , H01L27/1214 , H01L33/06 , H01L33/38 , H01L33/42 , H01L33/54 , H01L33/62 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/73267 , H01L2224/75281 , H01L2224/75282 , H01L2224/75725 , H01L2224/7598 , H01L2224/83193 , H01L2224/8381 , H01L2224/83825 , H01L2224/92244 , H01L2924/01322 , H01L2924/10156 , H01L2924/12041 , H01L2924/12044 , H01L2924/00
Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. An array of micro LED devices are bonded to the corresponding array of bottom electrodes within the array of bank openings. An array of top electrode layers are formed electrically connecting the array of micro LED devices to a ground line in the non-pixel area.
Abstract translation: 描述显示面板和形成显示面板的方法。 显示面板可以包括包括像素区域和非像素区域的薄膜晶体管基板。 像素区域包括堤开口的阵列和堤开口阵列内的一组底部电极。 一组微型LED器件结合到阵列阵列内的相应阵列的底部电极。 形成将微型LED器件的阵列电连接到非像素区域中的接地线的顶部电极层的阵列。
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