公开(公告)号：US20060182489A1

公开(公告)日：2006-08-17

申请号：US10569283

申请日：2004-07-21

申请人： Takeshi Kobayashi

发明人： Takeshi Kobayashi

IPC分类号： B43M11/02

CPC分类号： B43K7/10 ,  B43K5/1881 ,  B43K7/02

摘要： A writing implement, wherein elements forming a reverse flow prevention mechanism are formed in rather simple shapes and assembly process for the reverse flow prevention mechanism is rather simplified. The reverse flow prevention mechanism (19) comprises a valve chamber (54b), an inflow port (55) opened to the ink storage part (16) side of the valve chamber (54b), an outflow port (56) opened to the writing tip (17) side of the valve chamber (54b), a valve element (57) stored in the valve chamber (54b), a restricting body (58) stored in the valve chamber (54b) at a position on the outflow port (56) side of the valve element (57), and a valve seat (54c) formed around the inflow port (55). When the writing tip (17) is faced upward, the inflow port (55) is closed by the valve element (57), and when faced downward, the valve element (57) is allowed to touch the restricting body (58) and does not reach the outflow port (56).

摘要翻译： 一种书写工具，其中形成逆流防止机构的元件形成为相当简单的形状，并且用于逆流防止机构的组装过程相当简化。 逆流防止机构（19）包括阀室（54b），向阀室（54b）的墨水储存部（16）侧开口的流入口（55），向外侧开口的流出口 阀室（54b）的书写尖端（17）侧，存储在阀室（54b）中的阀元件），在阀室（54b）中存储的位置处的限制体（58） 在阀元件（57）的流出口（56）侧，以及形成在流入口（55）周围的阀座（54c）。 当书写尖端（17）面向上方时，流入口（55）由阀体（57）封闭，当面向下时，阀元件（57）被允许接触限制体（58），并且 不到达流出口（56）。

公开(公告)号：US20060075957A1

公开(公告)日：2006-04-13

申请号：US10530557

申请日：2003-09-29

申请人： Hiroshi Takeno ,  Masahiro Sakurada ,  Takeshi Kobayashi

发明人： Hiroshi Takeno ,  Masahiro Sakurada ,  Takeshi Kobayashi

IPC分类号： C30B23/00 ,  C30B25/00 ,  C30B28/14 ,  C30B28/12

CPC分类号： C30B33/02 ,  C30B29/06 ,  H01L21/3225

摘要： The present invention provides an annealed wafer which has a wafer surface layer serving as a device fabricating region and having an excellent oxide film dielectric breakdown characteristic, and a wafer bulk layer in which oxide precipitates are present at a high density at the stage before the wafer is loaded into the device fabrication processes to give an excellent IG capability, and a method for manufacturing the annealed wafer. The present invention is directed to an annealed wafer obtained by performing heat treatment on a silicon wafer manufactured from a silicon single crystal grown by the Czochralski method, wherein a good chip yield of an oxide film dielectric breakdown characteristic in a region having at least a depth of up to 5 μm from a wafer surface is 95% or more, and a density of oxide precipitates detectable in the wafer bulk and each having a size not smaller than a size showing a gettering capability is not less than 1×109/cm3.

摘要翻译： 本发明提供了一种退火晶片，其具有用作器件制造区域的晶片表面层并且具有优异的氧化膜介电击穿特性，以及晶片本体层，其中氧化物沉淀物以高密度存在于晶片前的阶段 被加载到器件制造工艺中以提供优异的IG能力，以及用于制造退火晶片的方法。 本发明涉及通过对由通过切克劳斯基法生长的硅单晶制造的硅晶片进行热处理而获得的退火晶片，其中在具有至少一深度的区域中的氧化膜介电击穿特性的良好的芯片产量 从晶片表面达到5μm的母体的密度为95％以上，并且在晶片体中可检测到的氧化物析出物的密度和每个具有不小于显示吸气能力的尺寸的尺寸不小于1×10 9 / SUP> / cm 3。

公开(公告)号：US20060066136A1

公开(公告)日：2006-03-30

申请号：US11236348

申请日：2005-09-27

申请人： Takeshi Kobayashi ,  Toshiyuki Suzuki ,  Masahiro Inoue ,  Kazushiro Inoue ,  Hiroaki Kase ,  Yuji Hayashi

发明人： Takeshi Kobayashi ,  Toshiyuki Suzuki ,  Masahiro Inoue ,  Kazushiro Inoue ,  Hiroaki Kase ,  Yuji Hayashi

IPC分类号： B60K37/00

CPC分类号： B62D25/2027 ,  B62D25/2009 ,  B62D25/2018

摘要： In a vehicle floor structure, a subsidiary frame is provided between a front frame and a seat frame and at a position higher than a lower frame, for supporting thereon a floor section. Step support frame is provided laterally outwardly of the lower frame, for supporting thereon a boarding step so that the floor section is located at a level higher than the boarding step. Vehicle body frame structure includes, for each of left and ride side sections of the vehicle, a straight vertical frame to which are mounted the respective ones ends of an upper arm, lower arm and cushion unit, and respective mounting sections for the upper arm, lower arm and cushion unit can be provided in linear alignment with one another in the straight vertical frame along the length thereof

摘要翻译： 在车辆地板结构中，辅助框架设置在前框架和座椅框架之间以及高于下框架的位置处，用于在其上支撑地板部分。 步进支撑框架横向向外设置在下框架上，用于在其上支撑登机步骤，使得地板部分位于比登机步骤高的水平。 车身框架结构包括：对于车辆的左侧和后部侧部分，分别安装有上臂，下臂和缓冲单元的相应端部的直立立体框架和用于上臂的相应安装部分， 下臂和缓冲单元可以沿着其长度在直立的垂直框架中彼此线性对准

公开(公告)号：US20050224918A1

公开(公告)日：2005-10-13

申请号：US11092892

申请日：2005-03-30

申请人： Takeshi Kobayashi ,  Hisao Sugoh

发明人： Takeshi Kobayashi ,  Hisao Sugoh

IPC分类号： H01L23/48 ,  C25D1/00 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L21/44

CPC分类号： H01L21/568 ,  C25D1/003 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/05644 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/83805 ,  H01L2224/85001 ,  H01L2224/85399 ,  H01L2224/85444 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/29099 ,  H01L2924/00012

摘要： There is provided a lead frame which comprises: a lead frame body comprising a sheet-shaped body made of metal; a groove portion for forming a lead which is formed by a predetermined depth in a lead forming region on a surface of the lead frame body; and a lead portion formed so that the lead portion can protrude from the groove portion onto the surface of the lead frame body, the lead portion being made of material different from material of the lead frame body. A thin type semiconductor device is provided in which the above lead frame is used and after a chip is mounted, the lead frame body is removed by means of etching.

摘要翻译： 提供了一种引线框架，其包括：引线框体，其包括由金属制成的片状主体; 用于形成在所述引线框体的表面上的引线形成区域中由预定深度形成的引线的槽部; 以及引线部分，其形成为使得引线部分可以从槽部分突出到引线框架主体的表面上，引线部分由与引线框架主体的材料不同的材料制成。 提供一种薄型半导体器件，其中使用上述引线框架，并且在安装芯片之后，通过蚀刻去除引线框架体。

公开(公告)号：US20050169694A1

公开(公告)日：2005-08-04

申请号：US10513039

申请日：2003-05-01

申请人： Shuji Ichikawa ,  Kazuhiko Furukawa ,  Takeshi Kobayashi

发明人： Shuji Ichikawa ,  Kazuhiko Furukawa ,  Takeshi Kobayashi

IPC分类号： B43K7/02 ,  B43K7/08 ,  C09D11/16 ,  C09D11/18 ,  B43K5/02

CPC分类号： C09D11/16 ,  B43K7/02 ,  B43K7/08 ,  C09D11/18

摘要： In order to provide an ink reservoir for a writing instrument which has satisfactory permeation resistance and moisture-absorption resistance against permeation of a solvent and absorption of moisture and which is excellent in a storing property of the ink with the passage of time, an ink reservoir for a writing instrument in which an ink for a writing instrument is stored is constituted of at least one selected from the group consisting of a cyclic olefin resin, a fluorine base resin and a high molecular weight olefin resin or the ink reservoir for a writing instrument described above is constituted of a laminated structure which is formed by extrusion molding of two or more kinds of thermoplastic resins.

摘要翻译： 为了提供一种用于书写工具的墨水储存器，其具有令人满意的渗透阻力和耐溶剂渗透性和吸湿性，并且油墨随着时间的储存性能优异的油墨储存器 用于书写工具用墨水的书写工具由选自环烯烃树脂，氟基树脂和高分子量烯烃树脂中的至少一种或用于书写工具的墨水容器 由通过两种以上的热塑性树脂的挤出成型形成的层叠结构构成。

公开(公告)号：US20050072683A1

公开(公告)日：2005-04-07

申请号：US10816168

申请日：2004-04-02

申请人： Tsutomu Nakada ,  Tsuyoshi Sahoda ,  Koji Mishima ,  Ryoichi Kimizuka ,  Takeshi Kobayashi

发明人： Tsutomu Nakada ,  Tsuyoshi Sahoda ,  Koji Mishima ,  Ryoichi Kimizuka ,  Takeshi Kobayashi

IPC分类号： C25D3/38 ,  C25D5/18 ,  H05K3/42

CPC分类号： C25D3/38 ,  C25D5/18 ,  H05K3/423

摘要： An acid copper plating solution comprises copper ions, an organic acid or an inorganic acid, chloride ions, a high molecular weight surfactant that controls the electrodeposition reaction, and a sulfur-containing saturated organic compound that promotes the electrocoating rate. The high molecular weight surfactant comprises two or more types of surfactants with different hydrophobicities. The plating solution is used for forming a plating film on a conductor layer.

摘要翻译： 酸性铜电镀液包含铜离子，有机酸或无机酸，氯离子，控制电沉积反应的高分子量表面活性剂，以及促进电泳率的含硫饱和有机化合物。 高分子量表面活性剂包含两种或多种具有不同疏水性的表面活性剂。 电镀液用于在导体层上形成镀膜。

公开(公告)号：US06709563B2

公开(公告)日：2004-03-23

申请号：US09893624

申请日：2001-06-29

申请人： Mizuki Nagai ,  Shuichi Okuyama ,  Ryoichi Kimizuka ,  Takeshi Kobayashi

发明人： Mizuki Nagai ,  Shuichi Okuyama ,  Ryoichi Kimizuka ,  Takeshi Kobayashi

IPC分类号： C25D502

CPC分类号： C25D3/38 ,  C25D5/10 ,  C25D7/123 ,  C25D17/001

摘要： There is provided a copper-plating liquid free from an alkali metal and a cyanide which, when used in plating of a substrate having an outer seed layer and fine recesses of a high aspect ratio, can reinforce the thin portion of the seed layer and can embed copper completely into the depth of the fine recesses. The plating liquid contains divalent copper ions and a completing agent, and an optional pH adjusting agent.

摘要翻译： 提供了不含碱金属和氰化物的镀铜液，当用于具有外籽晶层和高纵横比的微细凹槽的基片时，可以加强种子层的薄部分，并且可以 将铜完全嵌入精细凹槽的深度。电镀液含有二价铜离子和完成剂，以及任选的pH调节剂。

公开(公告)号：US06540894B2

公开(公告)日：2003-04-01

申请号：US09906084

申请日：2001-07-17

申请人： Takeshi Kobayashi ,  Yasukazu Iwamoto

发明人： Takeshi Kobayashi ,  Yasukazu Iwamoto

IPC分类号： G01N2726

CPC分类号： G01N27/333

摘要： A phosphate ion selective electrode, with which the detection limit is made small to enable measurement of phosphate ion concentrations of down to low concentration, and a method of manufacturing the abovementioned phosphate ion selective electrode, wherein a sensing membrane 1 of an ion selective electrode A is comprised of a solid membrane having a slightly soluble metal salt as the main component thereof.

公开(公告)号：US06220702B1

公开(公告)日：2001-04-24

申请号：US09471335

申请日：1999-12-23

申请人： Masahiro Nakamura ,  Takeshi Kobayashi ,  Masanori Kamijyo ,  Tadatoshi Honzawa ,  Michinari Tsukahara

发明人： Masahiro Nakamura ,  Takeshi Kobayashi ,  Masanori Kamijyo ,  Tadatoshi Honzawa ,  Michinari Tsukahara

IPC分类号： B41J2175

CPC分类号： B41J2/17503 ,  B41J2/17513

摘要： The ink bag is structured as follows: To the respective long side portions (1a, 1b, 2a, 2b) of a rectangular-shaped, thermally fusible first film forming the surface portions (1, 2) of the ink bag, there are attached, by thermal fusion, the long side portions of a rectangular-shaped, thermally fusible second film forming the side surface portions (3, 4) of the ink bag and having lower rigidity than the first film to thereby form a cylindrical body. The one-side short side portions (1c, 2c) of the surface portions of the ink bag are attached together by thermal fusion to form a bag body. An ink supply hole forming member (5) is attached by thermal fusion to the other-side short side portions of the surface portions of the ink bag. In the four corners of the ink bag, there are formed band-shaped connecting portions (6 to 9) each starting from one of the two mutually adjoining sides of the ink bag and reaching the other of the two sides.

摘要翻译： 油墨袋的结构如下：形成形成墨水袋的表面部分（1,2）的矩形的，热熔融的第一薄膜的各个长边部分（1a，1b，2a，2b）附着 通过热熔接，形成形成墨袋的侧表面部分（3,4）的矩形的热熔第二膜的长边部分，并且具有比第一膜低的刚性，从而形成圆柱体。 油墨袋的表面部分的一侧短边部分（1c，2c）通过热熔粘合在一起形成袋体。 供墨孔形成构件（5）通过热熔融附接到墨袋的表面部分的另一侧短边部分。 在墨水袋的四个角部，形成有从油墨袋的两个相邻侧之一开始并到达两侧的另一侧的带状连接部（6〜9）。

公开(公告)号：US6022126A

公开(公告)日：2000-02-08

申请号：US883100

申请日：1997-06-26

申请人： Kumajiro Sekine ,  Takeshi Kobayashi

发明人： Kumajiro Sekine ,  Takeshi Kobayashi

IPC分类号： G09B19/00 ,  G02B27/20 ,  F21L15/02 ,  F21V5/02

CPC分类号： G02B27/20

摘要： The laser pointer of this invention includes: a laser pointer main body for emitting a visible laser beam; and a deflection optical element disposed on the central axis of the laser beam and adapted to deflect the direction along which the emitted laser beam passes.

摘要翻译： 本发明的激光指示器包括：用于发射可见激光束的激光指示器主体; 以及偏转光学元件，其设置在激光束的中心轴上并且适于偏转所发射的激光束通过的方向。