公开(公告)号：US20090326636A1

公开(公告)日：2009-12-31

申请号：US12374345

申请日：2007-07-06

申请人： Yasushi Hashimoto ,  Masaaki Matsutani ,  Masatoshi Fukuda

发明人： Yasushi Hashimoto ,  Masaaki Matsutani ,  Masatoshi Fukuda

IPC分类号： A61F2/06

CPC分类号： A61F2/90 ,  A61F2/89 ,  A61F2/95 ,  A61F2002/9505

摘要： It is an object of the present invention to prevent a wire part including a stabilizer hook, a strut or the pulling-back member from separating from a connection part even when a force in a tensile direction is applied to a stent.A stent 1 having a connection part in which wire parts including a stent main wire 2, a strut 4 and a stabilizer hook 5 are connected to each other through a junction pipe 7, wherein a locking part which is locked to the junction pipe 7 is formed on the wire part which is inserted into the junction pipe 7.

摘要翻译： 本发明的目的在于，即使在向支架施加拉伸方向的力时，也可以防止包括稳定钩，支柱或拉回构件的线部分与连接部分离。 具有连接部的支架1，其中包括支架主线2，支柱4和稳定钩5的线部分通过连接管7彼此连接，其中锁定到连接管7的锁定部分 形成在插入连接管7的导线部上。

公开(公告)号：US20060243774A1

公开(公告)日：2006-11-02

申请号：US11410653

申请日：2006-04-25

申请人： Kanji Matsutani ,  Toshiharu Kamei ,  Masatoshi Fukuda

发明人： Kanji Matsutani ,  Toshiharu Kamei ,  Masatoshi Fukuda

IPC分类号： B25C5/04

CPC分类号： A61B17/0684 ,  A61B2017/00845 ,  B25C5/0257

摘要： The present invention relates to a medical stapler for suturing body tissue by forming a medical staple supported by an anvil by bringing a ram close to the anvil, comprising a housing, a lever, an anvil and a ram, and the ram is composed of metal material and the drive portion formed on part of the lever and the ram guide portion provided in the housing are composed of synthetic resin and a gap between a leg formed on the ram and the anvil opposing the leg is set to a dimension allowing the medical staple to be formed into an excellent shape with a light load.

摘要翻译： 本发明涉及一种用于缝合身体组织的医用缝合器，其特征在于，通过使靠近所述砧座的柱塞靠近所述砧座来形成由所述砧座支撑的医用缝合线，所述医用缝合器包括壳体，杆，砧座和冲头，所述冲头由金属 材料，并且形成在杆的一部分上的驱动部分和设置在壳体中的柱塞引导部分由合成树脂构成，并且形成在冲头上的腿部和与腿部相对的砧座之间的间隙被设定为允许医用钉 被形成为具有轻负载的优异形状。

公开(公告)号：US20050051810A1

公开(公告)日：2005-03-10

申请号：US10968890

申请日：2004-10-21

申请人： Hiroshi Funakura ,  Eiichi Hosomi ,  Yasuhiro Koshio ,  Tetsuya Nagaoka ,  Junya Nagano ,  Mitsuru Oida ,  Masatoshi Fukuda ,  Atsushi Kurosu ,  Kaoru Kawai ,  Osamu Yamagata

发明人： Hiroshi Funakura ,  Eiichi Hosomi ,  Yasuhiro Koshio ,  Tetsuya Nagaoka ,  Junya Nagano ,  Mitsuru Oida ,  Masatoshi Fukuda ,  Atsushi Kurosu ,  Kaoru Kawai ,  Osamu Yamagata

IPC分类号： H01L23/29 ,  H01L21/56 ,  H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/498 ,  H01L29/768

CPC分类号： H01L23/49894 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package has (a) a package base, (b) package terminals formed on the package base and used to connect the semiconductor package to another device, (c) a wiring layer formed on the package base and electrically connected to the package terminals, (d) a semiconductor chip mounted on the package base and electrically connected to the wiring layer, (e) a low-elasticity resin layer formed between a resin mold and the wiring layer and between the package base and the resin mold, and (f) the resin mold sealing the package base, the wiring layer, the semiconductor chip, and the low-elasticity resin layer.

摘要翻译： 半导体封装具有（a）封装基座，（b）形成在封装基座上并用于将半导体封装连接到另一器件的封装端子，（c）形成在封装基座上并电连接到封装端子的布线层 ，（d）安装在封装基板上并电连接到布线层的半导体芯片，（e）在树脂模具和布线层之间以及封装基底和树脂模具之间形成的低弹性树脂层，和 f）树脂模具密封封装基座，布线层，半导体芯片和低弹性树脂层。

公开(公告)号：US06322581B1

公开(公告)日：2001-11-27

申请号：US09644745

申请日：2000-08-24

申请人： Masatoshi Fukuda ,  Masaaki Matsutani

发明人： Masatoshi Fukuda ,  Masaaki Matsutani

IPC分类号： A61B1706

CPC分类号： A61B17/06066 ,  A61B17/06004

摘要： The present invention relates to a suturing needle for medical use comprising a needle tip portion for piercing a body tissue, a distal end portion for coupling a suture and a body portion formed between the needle tip portion and the distal end portion The body portion is constituted of a pair of flat surfaces opposing to each other and a pair of grooves opposing to each other in a direction intersecting with the opposing direction of the flat surfaces.

摘要翻译： 本发明涉及一种医疗用缝合针，包括用于穿刺身体组织的针尖部分，用于连接缝合线的前端部分和形成在针尖部分和远端部分之间的主体部分。主体部分构成 一对彼此相对的平坦表面和在与平坦表面的相对方向相交的方向上彼此相对的一对槽。

公开(公告)号：US5327762A

公开(公告)日：1994-07-12

申请号：US970656

申请日：1992-11-02

申请人： Takashi Nagamine ,  Jun Furukawa ,  Masayoshi Matsuda ,  Misao Makinohara ,  Hiroatsu Asari ,  Masatoshi Fukuda ,  Ryoichi Yamase

发明人： Takashi Nagamine ,  Jun Furukawa ,  Masayoshi Matsuda ,  Misao Makinohara ,  Hiroatsu Asari ,  Masatoshi Fukuda ,  Ryoichi Yamase

IPC分类号： B21B27/02 ,  B21B31/18 ,  F16C1/14 ,  F16C1/22

CPC分类号： F16C1/14 ,  B21B27/028 ,  B21B31/18 ,  F16C1/22 ,  F16C1/223 ,  Y10T403/32426 ,  Y10T74/2045 ,  Y10T74/20462 ,  Y10T74/20654 ,  Y10T74/2066 ,  Y10T74/2151

摘要： The present invention provides a rolling roller for rolling steel sections and that can have the roller width changed while not having a drive mechanism for changing the roller width provided to the rolling roller itself, thereby having a simple structure that facilitates exchange, and also provides a rolling mill suitable for use with such a rolling roller. The rolling roller has rolling wheels on a roller shaft and a sleeve and that engage the sleeve with respect to the roller shaft. In addition, the sleeve and the roller shaft are tightened and engaged at a place other than the inner side of the roller wheel and oil injection to the place of tightening and engagement is performed via hydraulic fluid supply paths formed inside the roller shaft.

摘要翻译： 本发明提供一种用于轧制钢部分的滚动辊，并且可以在不具有用于改变设置到滚动辊本身的辊宽度的驱动机构的同时改变辊宽度，从而具有便于更换的简单结构，并且还提供 适用于这种轧辊的轧机。 滚动辊在辊轴和套筒上具有滚轮，并且相对于辊轴接合套筒。 此外，套筒和辊轴被紧固并接合在辊轮内侧以外的位置，并且通过形成在辊轴内部的液压流体供给路径进行注油到紧固和接合的位置。

公开(公告)号：US5181645A

公开(公告)日：1993-01-26

申请号：US824152

申请日：1992-01-22

申请人： Kanji Matsutani ,  Masatoshi Fukuda ,  Katsutoshi Sato

发明人： Kanji Matsutani ,  Masatoshi Fukuda ,  Katsutoshi Sato

IPC分类号： A61B17/068

CPC分类号： A61B17/0684

摘要： In a medical stapler, an anvil is disposed in the vicinity of an opening in a casing, and is disposed in a path of movement of a ram. A foremost staple placed on the anvil is shaped through the cooperation of the advancing ram with the anvil in such a manner that a pair of legs of this foremost staple are moved toward each other. The anvil has a shaping surface disposed in opposed relation to the ram. This shaping surface is inclined relative to the path of movement of the ram in such a manner as to approach the ram progressively toward the distal end of the shaping surface.

公开(公告)号：USD318529S

公开(公告)日：1991-07-23

申请号：US310718

申请日：1989-02-15

申请人： Kanji Matsutani ,  Masatoshi Fukuda

设计人： Kanji Matsutani ,  Masatoshi Fukuda

公开(公告)号：US09362196B2

公开(公告)日：2016-06-07

申请号：US13181737

申请日：2011-07-13

申请人： Keiju Yamada ,  Takashi Yamazaki ,  Masatoshi Fukuda ,  Yasuhiro Koshio

发明人： Keiju Yamada ,  Takashi Yamazaki ,  Masatoshi Fukuda ,  Yasuhiro Koshio

IPC分类号： H01L23/02 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L23/00

CPC分类号： H01L23/552 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： According to an embodiment, a semiconductor package includes a semiconductor chip mounted on an interposer board, a encapsulant sealing the semiconductor chip, and a conductive shielding layer covering the encapsulant and at least part of a side surface of the interposer board. The interposer board has plural vias through an insulating substrate. A part of the plural vias has a cutting plane exposing to the side surface of the interposer board and cut in a thickness direction of the interposer board. The cutting plane of the via is electrically connected to the conductive shielding layer.

摘要翻译： 根据实施例，半导体封装包括安装在插入板上的半导体芯片，密封半导体芯片的密封剂以及覆盖密封剂的导电屏蔽层和插入板的侧表面的至少一部分。 插入板具有通过绝缘基板的多个通路。 多个通孔的一部分具有暴露于插入板的侧表面并在插入板的厚度方向上切割的切割平面。 通孔的切割平面电连接到导电屏蔽层。

公开(公告)号：US08710654B2

公开(公告)日：2014-04-29

申请号：US13477387

申请日：2012-05-22

申请人： Satoshi Tsukiyama ,  Masatoshi Fukuda ,  Hiroshi Watabe ,  Keita Mizoguchi ,  Naoyuki Komuta

发明人： Satoshi Tsukiyama ,  Masatoshi Fukuda ,  Hiroshi Watabe ,  Keita Mizoguchi ,  Naoyuki Komuta

IPC分类号： H01L23/48 ,  H01L29/40

CPC分类号： H01L24/81 ,  H01L21/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/13025 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/14151 ,  H01L2224/14155 ,  H01L2224/14156 ,  H01L2224/14177 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/81139 ,  H01L2224/8114 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/81203 ,  H01L2224/83104 ,  H01L2224/83815 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01083 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/00

摘要： In one embodiment, a semiconductor device includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first and second semiconductor chips are electrically connected via first bump connection parts. Stopper projections and bonding projections are provided at least one of the first and second semiconductor chips. The stopper projections are in contact with the other of the first and second semiconductor chips in an unbonded state. The bonding projections are bonded to the first and second semiconductor chips.

摘要翻译： 在一个实施例中，半导体器件包括堆叠在第一半导体芯片上的第一半导体芯片和第二半导体芯片。 第一和第二半导体芯片通过第一凸块连接部电连接。 止动器突起和接合突起设置在第一和第二半导体芯片中的至少一个上。 止动突起与未粘合状态的第一和第二半导体芯片中的另一个接触。 接合突起接合到第一和第二半导体芯片。

公开(公告)号：US08710653B2

公开(公告)日：2014-04-29

申请号：US13397098

申请日：2012-02-15

申请人： Masatoshi Fukuda ,  Hiroshi Watabe

发明人： Masatoshi Fukuda ,  Hiroshi Watabe

IPC分类号： H01L23/498 ,  H01L21/50

CPC分类号： H01L21/563 ,  H01L23/3135 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1412 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/81444 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device, includes: a wiring substrate, a stacked body mounted on the wiring substrate, an underfill layer filled into gaps between respective semiconductor chips of the stacked body; and a molding body made up of a molding resin covered and formed at outside of the stacked body and so on. The underfill layer is made up of a cured product of a resin material containing an amine-based curing agent, and the cured product has a Tg of 65° C. or more and 100° C. or less.

摘要翻译： 一种半导体器件，包括：布线基板，安装在布线基板上的层叠体，填充在层叠体的各半导体芯片之间的间隙中的底部填充层; 以及由在层叠体的外部被覆盖并形成的成型树脂等构成的成型体。 底部填充层由含有胺类固化剂的树脂材料的固化物构成，固化物的Tg为65℃以上且100℃以下。