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349 条记录 (耗时 0.03 秒)

    Methods of manufacturing photomask blank and photomask
    24.
    发明授权
    Methods of manufacturing photomask blank and photomask 有权
    制造光掩模坯料和光掩模的方法

    公开(公告)号：US07195846B2

    公开(公告)日：2007-03-27

    申请号：US10724734

    申请日：2003-12-02

    申请人： Hideo Kaneko ,  Yukio Inazuki ,  Tetsushi Tsukamoto ,  Masayuki Mogi ,  Katsuya Okumura

    发明人： Hideo Kaneko ,  Yukio Inazuki ,  Tetsushi Tsukamoto ,  Masayuki Mogi ,  Katsuya Okumura

    IPC分类号： G03F1/00 ,  G03C5/00

    CPC分类号： G03F1/82 ,  G03F1/26 ,  G03F1/32 ,  G03F1/68

    摘要： A photomask blank having a film of at least one layer formed on a substrate is manufactured by forming a film on a substrate and irradiating the film with light from a flash lamp. A photomask is manufactured from the thus manufactured photomask blank by forming a patterned resist on the film on the blank by photolithography, etching away those portions of the film which are not covered with the resist, and removing the resist. The photomask blank and photomask have minimized warpage and improved chemical resistance.

    摘要翻译： 通过在基板上形成膜并用来自闪光灯的光照射薄膜来制造具有形成在基板上的至少一层的膜的光掩模坯料。 通过光刻法在坯料上的膜上形成图案化的抗蚀剂，蚀刻掉未被抗蚀剂覆盖的膜的那些部分，并除去抗蚀剂，由这样制造的光掩模坯料制造光掩模。 光掩模坯料和光掩模具有最小的翘曲和改善的耐化学性。

    Polishing apparatus and method
    25.
    发明授权
    Polishing apparatus and method 有权
    抛光设备和方法

    公开(公告)号：US07108589B2

    公开(公告)日：2006-09-19

    申请号：US11187944

    申请日：2005-07-25

    申请人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

    发明人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

    IPC分类号： B24B7/00

    CPC分类号： B24B37/345 ,  B24B9/065 ,  B24B37/12 ,  H01L21/67046

    摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

    摘要翻译： 抛光装置和方法具有将形成在基板上的膜的表面抛光至平面镜面的功能，以及抛光沉积在基板的外周部分上的不需要的金属膜如铜膜的功能，以去除这种不必要的金属 电影。 抛光装置包括表面抛光机构，其包括具有抛光表面的抛光台和用于保持基板的顶环，并将基板压靠在抛光台的抛光表面上，从而抛光基板的表面，以及外周抛光 用于抛光衬底的外周部分的机构。

    Semiconductor device and method of manufacturing the same
    27.
    发明申请
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号：US20050087853A1

    公开(公告)日：2005-04-28

    申请号：US10855889

    申请日：2004-05-28

    申请人： Katsuya Okumura ,  Koji Maruyama ,  Kazuya Nagaseki ,  Akiteru Rai

    发明人： Katsuya Okumura ,  Koji Maruyama ,  Kazuya Nagaseki ,  Akiteru Rai

    IPC分类号： H01L23/52 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/12 ,  H01L23/48 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L23/02 ,  H05K7/02

    CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/00012

    摘要： The present invention relates to a semiconductor device in which an electrode of a device formed on a substrate such as a semiconductor wafer and an electrode of a wiring structure such as an interposer are connected to each other through a connecting electrode extending through the substrate, and a method of manufacturing the same. A semiconductor device according to the present invention comprises a first substrate including a front surface and a back surface, a first device having a first electrode being formed on the front surface; and a wiring structure formed with a second electrode, the wiring structure having a principal surface. The first electrode of the first device and the second electrode of the wiring structure are connected to each other by a connecting electrode extending through the first substrate from the front surface to the back surface thereof. Substantially all the back surface of the first substrate is bonded to the principal surface of the wiring structure. A dielectric film formed between the first substrate and the wiring structure may be an adhesive layer.

    摘要翻译： 本发明涉及一种半导体器件，其中形成在诸如半导体晶片的基板上的器件的电极和诸如中介层之类的布线结构的电极通过延伸穿过衬底的连接电极相互连接， 其制造方法。 根据本发明的半导体器件包括：第一衬底，包括前表面和后表面;第一器件，具有形成在前表面上的第一电极; 以及形成有第二电极的布线结构，所述布线结构具有主表面。 第一器件的第一电极和布线结构的第二电极通过从第一衬底的前表面延伸到后表面的连接电极彼此连接。 基本上所有的第一基板的所有后表面被结合到布线结构的主表面。 形成在第一基板和布线结构之间的电介质膜可以是粘合剂层。

    ELECTRONIC COMMERCE METHOD FOR SEMICONDUCTOR PRODUCTS, ELECTRONIC COMMERCE THEREOF, PRODUCTION SYSTEM, PRODUCTION METHOD, PRODUCTION EQUIPMENT DESIGN SYSTEM, PRODUCTION EQUIPMENT DESIGN METHOD, AND PRODUCTION EQUIPMENT MANUFACTURING METHOD
    28.
    发明授权
    ELECTRONIC COMMERCE METHOD FOR SEMICONDUCTOR PRODUCTS, ELECTRONIC COMMERCE THEREOF, PRODUCTION SYSTEM, PRODUCTION METHOD, PRODUCTION EQUIPMENT DESIGN SYSTEM, PRODUCTION EQUIPMENT DESIGN METHOD, AND PRODUCTION EQUIPMENT MANUFACTURING METHOD 失效
    电子商务方法半导体产品，电子商务，生产系统，生产方法，生产设备设计系统，生产设备设计方法和生产设备制造方法

    公开(公告)号：US06788985B2

    公开(公告)日：2004-09-07

    申请号：US09867465

    申请日：2001-05-31

    申请人： Kunihiro Mitsutake ,  Katsuya Okumura

    发明人： Kunihiro Mitsutake ,  Katsuya Okumura

    IPC分类号： G06F1900

    CPC分类号： G06Q30/06 ,  G06Q30/0601

    摘要： An electronic commerce for semiconductor products comprises a network, a client terminal, a connection server, a virtual production line, and a real production line. The real production line actually manufactures semiconductor products. The virtual production line provides a computer with substantially the same functions as the real production line and computes an optimal lot progress. The connection server connects the virtual production line to the client terminal via the network. When a condition is entered from the client terminal, the connection server transfers this condition to the virtual production line. Simulation is performed realtime for determining whether a product flows in the virtual production line under the transferred condition. The connection server transfers a simulation result to the client terminal. Based on the simulation result, a electronic commerce is conducted.

    摘要翻译： 半导体产品的电子商务包括网络，客户终端，连接服务器，虚拟生产线和实际生产线。 实际生产线实际上是生产半导体产品。 虚拟生产线为计算机提供与实际生产线基本相同的功能，并计算最佳批量进度。 连接服务器通过网络将虚拟生产线连接到客户终端。 当从客户终端输入条件时，连接服务器将该条件传送到虚拟生产线。 实时进行模拟，以确定产品是否在转移条件下在虚拟生产线中流动。 连接服务器将模拟结果传送到客户终端。 基于模拟结果，进行电子商务。

    Method for monitoring the shape of the processed surfaces of semiconductor devices and equipment for manufacturing the semiconductor devices
    29.
    发明授权
    Method for monitoring the shape of the processed surfaces of semiconductor devices and equipment for manufacturing the semiconductor devices 有权
    用于监测半导体器件的处理表面的形状和用于制造半导体器件的设备的方法

    公开(公告)号：US06723572B2

    公开(公告)日：2004-04-20

    申请号：US10139278

    申请日：2002-05-07

    申请人： Hiroyuki Yano ,  Katsuya Okumura

    发明人： Hiroyuki Yano ,  Katsuya Okumura

    IPC分类号： H01L2166

    CPC分类号： H01L22/26 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A to-be-polished surface of a semiconductor workpiece is polished to a target shape, using a CMP tool. The to-be-polished surface is a surface of a metal provided on an insulating film having trenches. A shape of a polished surface of the semiconductor workpiece is monitored to determine if a metal residue exists outside of the trenches on the polished surface while the semiconductor workpiece is set in the CMP tool, using a monitor. The monitor has a sensor that obtains a two-dimensional image of the to-be-polished surface. The CMP tool is controlled by feedback based on a result of monitoring to determine if the metal residue exists, using a controller.

    摘要翻译： 使用CMP工具将半导体工件的待抛光表面抛光至目标形状。 被抛光表面是设置在具有沟槽的绝缘膜上的金属表面。 监测半导体工件的抛光表面的形状，以确定当使用监视器将半导体工件设置在CMP工具中时，金属残留物是否存在于抛光表面上的沟槽外部。 显示器具有获得被抛光表面的二维图像的传感器。 CMP工具由基于监测结果的反馈控制，以使用控制器确定是否存在金属残留物。