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    ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD
    23.
    发明申请
    ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD 有权
    电磁带结构和印刷电路板

    公开(公告)号：US20130141191A1

    公开(公告)日：2013-06-06

    申请号：US13756210

    申请日：2013-01-31

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Han KIM ,  Hyung-Sik CHOI ,  Sang-Hoon KIM ,  Joon-Sung KIM

    IPC: H01P5/04 ,  H05K1/11

    CPC classification number: H05K1/116 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2224/0401

    Abstract: An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency.

    Abstract translation: 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据实施例，电磁带隙结构与第一金属层，第一介电层，金属板，第二介电层和第二金属层堆叠，并且奇数个通孔可以通过金属串联连接 第一金属层和金属板之间的线。 该电磁带隙结构可以具有小尺寸和低带隙频率。

    MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT AND MOUNTING BOARD THEREOF
    24.
    发明申请
    MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT AND MOUNTING BOARD THEREOF 审中-公开

    公开(公告)号：US20200381180A1

    公开(公告)日：2020-12-03

    申请号：US16561457

    申请日：2019-09-05

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yun Tae LEE ,  Kyung Moon JUNG ,  Han KIM

    IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/228 ,  H01G2/06

    Abstract: A multilayer ceramic electronic component and a mounting board thereof include a reinforcing member that is disposed on upper and lower surfaces of a ceramic body of the multilayer ceramic electronic component and that is bonded to the first and the second external electrodes. The reinforcing member provides reduced occurrence of cracking and reduced stress applied to the component. The reinforcing member may have a coefficient of thermal expansion (CTE) that is within a range of 1 to 4 times a coefficient of thermal expansion of a dielectric layer of the ceramic body, and/or may have a modulus that is 0.5 or more times a modulus of the dielectric layer.

    SEMICONDUCTOR PACKAGE
    25.
    发明申请
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20200168591A1

    公开(公告)日：2020-05-28

    申请号：US16454907

    申请日：2019-06-27

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Chul Kyu KIM ,  Dae Hyun PARK ,  Jung Ho SHIM ,  Jae Hyun LIM ,  Mi Ja HAN ,  Sang Jong LEE ,  Han KIM

    IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L23/528

    Abstract: A semiconductor package includes a frame having a through-hole, and a first semiconductor chip disposed in the through-hole of the frame and having an active surface on which a connection pad is disposed, an inactive surface opposing the active surface, and a side surface connecting the active and inactive surfaces. A first encapsulant covers at least a portion of each of the inactive surface and the side surface of the first semiconductor chip. A connection structure has a first surface having disposed thereon the active surface of the first semiconductor chip, and includes a redistribution layer electrically connected to the connection pad of the first semiconductor chip. A first passive component is disposed on a second surface of the connection structure opposing the first surface, the first passive component being electrically connected to the redistribution layer and having a thickness greater than a thickness of the first semiconductor chip.

    INDUCTOR
    26.
    发明申请
    INDUCTOR 审中-公开

    公开(公告)号：US20190244740A1

    公开(公告)日：2019-08-08

    申请号：US16128997

    申请日：2018-09-12

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seung Jae SONG ,  Min Ki JUNG ,  Han KIM ,  Seung Hee HONG

    IPC: H01F17/00 ,  H01F27/28

    Abstract: An inductor includes a body including insulating layers stacked therein, in which coil patterns are respectively disposed on the insulating layers, and first and second external electrodes disposed on an external surface of the body, wherein the coil patterns are connected to each other by a plurality of coil connecting portions, and opposing ends thereof are connected to the first and second external electrodes through coil lead portions, respectively, to form a coil, the coil patterns include outer coil patterns disposed in an outer portion of the body and inner coil patterns disposed in an inner portion, a first coil connecting portion connects the outer coil patterns and a second coil connecting portion connects one coil pattern of the outer coil patterns and another coil pattern of the inner coil patterns, and the first and second coil connecting portions are disposed in a staggered manner.

    SEMICONDUCTOR PACKAGE
    27.
    发明申请
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20190206813A1

    公开(公告)日：2019-07-04

    申请号：US16108202

    申请日：2018-08-22

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hyung Joon KIM ,  Jung Ho SHIM ,  Jun Young WON ,  Han KIM

    IPC: H01L23/64 ,  H01L23/552 ,  H01L23/12 ,  H01L23/498 ,  H01L23/31 ,  H01L23/36

    Abstract: A semiconductor package includes a support member having first and second surfaces opposing each other, having first and second through-holes, spaced apart from each other, and having a wiring structure that connects the first and second surfaces to each other; a connection member disposed on the second surface of the support member and having redistribution layers connected to the wiring structure; a semiconductor chip disposed in the first through-hole and having connection pads connected to the redistribution layers; a second passive component disposed in the second through-hole and connected to the redistribution layers; a first encapsulant disposed on the first surface of the support member and encapsulating the first passive component; and a second encapsulant encapsulating the support member, the first encapsulant, and the semiconductor chip.

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