公开(公告)号：US08125786B2

公开(公告)日：2012-02-28

申请号：US12160301

申请日：2007-01-26

申请人： Hidenobu Nishikawa ,  Daido Komyoji ,  Hiroyuki Yamada ,  Yutaka Nakamura ,  Shuichi Takeda ,  Yasuharu Kikuchi

发明人： Hidenobu Nishikawa ,  Daido Komyoji ,  Hiroyuki Yamada ,  Yutaka Nakamura ,  Shuichi Takeda ,  Yasuharu Kikuchi

IPC分类号： H05K1/14

CPC分类号： G06K19/077 ,  G06K19/07732 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/19105 ,  H05K1/0275 ,  H05K3/284 ,  H05K2201/10151 ,  H05K2201/10159 ,  H01L2924/00

摘要： Memory card includes a circuit board, a component mounted on a main face of the circuit board, casing covering at least the main face of the circuit board and the component, and bittering agent retained in a roughened area provided on casing or an exposed part of the circuit board.

摘要翻译： 存储卡包括电路板，安装在电路板的主面上的部件，至少覆盖电路板的主面和部件的壳体，以及保持在设置在壳体上的粗糙区域中的苦味剂或暴露部分 电路板。

公开(公告)号：US20100084762A1

公开(公告)日：2010-04-08

申请号：US12279915

申请日：2007-04-18

申请人： Hidenobu Nishikawa ,  Daido Komyoji ,  Atsunobu Iwamoto ,  Hiroyuki Yamada ,  Shuichi Takeda ,  Shigeru Kondou

发明人： Hidenobu Nishikawa ,  Daido Komyoji ,  Atsunobu Iwamoto ,  Hiroyuki Yamada ,  Shuichi Takeda ,  Shigeru Kondou

IPC分类号： H01L23/52 ,  G06K19/077

CPC分类号： H05K1/0271 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/19105 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/00

摘要： Memory card (1) includes at least semiconductor chip (3), circuit board (2) with semiconductor chip (3) mounted on main surface (21), having at least rigidity reducing portion (23) formed in main surface (21) or in a linear region of surface (22) opposite to the main surface, and cover portion (71) for covering semiconductor chip (3) on main surface (21) of circuit board (2), wherein circuit board (2) has a plurality of convex regions (201) which flex in a convex shape toward main surface (21) due to rigidity reducing portion (23).

摘要翻译： 存储卡（1）至少包括半导体芯片（3），具有安装在主表面（21）上的半导体芯片（3）的电路板（2），至少具有形成在主表面（21）中的刚性减小部分（23）或 在与所述主表面相对的表面（22）的直线区域中，以及用于覆盖电路板（2）的主表面（21）上的半导体芯片（3）的盖部分（71），其中电路板（2）具有多个 由刚性减小部分（23）向主表面（21）弯曲成凸形的凸区域（201）。

公开(公告)号：US20100025847A1

公开(公告)日：2010-02-04

申请号：US12521020

申请日：2007-12-25

申请人： Yoshihiro Tomura ,  Daido Komyoji

发明人： Yoshihiro Tomura ,  Daido Komyoji

IPC分类号： H01L23/488 ,  H01L21/603

CPC分类号： H01L21/563 ,  H01L23/13 ,  H01L23/3185 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/27334 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/75316 ,  H01L2224/81191 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A recess portion is formed on a board surface at a position facing a peripheral end portion of a semiconductor device so as to place a sealing-bonding use resin partially inside the recess portion. Thereby, increases of a placement area for a fillet portion (foot spreading portion) of the sealing-bonding use resin are suppressed while its inclination angle is increased. Thus, stress loads that occur to peripheral portions of the semiconductor device due to thermal expansion differences and thermal contraction differences among individual members caused by heating process and cooling process in mounting operation are relaxed, by which internal breakdown of the semiconductor device mounted structure is avoided.

摘要翻译： 在与半导体器件的周边端部相对的位置的基板表面上形成凹部，以将密封用树脂部分地设置在凹部内。 由此，能够抑制密封用树脂的圆角部（脚部扩展部）的放置面积的增加，同时其倾斜角度增大。 因此，放宽了由于加热处理引起的各个部件之间的热膨胀差异和热收缩差异导致的半导体器件的周边部分的应力负荷，避免了半导体器件安装结构的内部故障 。

公开(公告)号：US07646095B2

公开(公告)日：2010-01-12

申请号：US10946372

申请日：2004-09-21

申请人： Kazushi Higashi ,  Kouichi Yoshida ,  Shinji Ishitani ,  Daido Komyoji

发明人： Kazushi Higashi ,  Kouichi Yoshida ,  Shinji Ishitani ,  Daido Komyoji

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/40

CPC分类号： H01L23/4985 ,  H01L21/563 ,  H01L24/28 ,  H01L24/81 ,  H01L29/0657 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81203 ,  H01L2224/81208 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/3512

摘要： In a semiconductor device of the present invention, in order that the contact of electrodes formed on a film substrate with edge parts of a semiconductor element at the time such as when the semiconductor element is mounted thereon may be reliably prevented, in the semiconductor element mounted on at least one surface of the film substrate having the electrodes, an insulating protection part is formed at a desired position of the surface opposed to the electrodes, and the distance between the semiconductor element and the film substrate is set at not less than 10 μm.

摘要翻译： 在本发明的半导体器件中，为了能够可靠地防止在半导体元件安装时在膜基板上形成的半导体元件的边缘部分与半导体元件的边缘部分的接触， 在具有电极的膜基板的至少一个表面上，在与电极相对的表面的期望位置处形成绝缘保护部，并且将半导体元件和膜基板之间的距离设定为不小于10um 。

公开(公告)号：US20090009976A1

公开(公告)日：2009-01-08

申请号：US12160301

申请日：2007-01-26

申请人： Hidenobu Nishikawa ,  Daido Komyoji ,  Hiroyuki Yamada ,  Yutaka Nakamura ,  Shuichi Takeda ,  Yasuharu Kikuchi

发明人： Hidenobu Nishikawa ,  Daido Komyoji ,  Hiroyuki Yamada ,  Yutaka Nakamura ,  Shuichi Takeda ,  Yasuharu Kikuchi

IPC分类号： H05K1/14

CPC分类号： G06K19/077 ,  G06K19/07732 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/19105 ,  H05K1/0275 ,  H05K3/284 ,  H05K2201/10151 ,  H05K2201/10159 ,  H01L2924/00

摘要： Memory card includes a circuit board, a component mounted on a main face of the circuit board, casing covering at least the main face of the circuit board and the component, and bittering agent retained in a roughened area provided on casing or an exposed part of the circuit board.

摘要翻译： 存储卡包括电路板，安装在电路板的主面上的部件，至少覆盖电路板的主面和部件的壳体，以及保持在设置在壳体上的粗糙区域中的苦味剂或暴露部分 电路板。

公开(公告)号：US08110933B2

公开(公告)日：2012-02-07

申请号：US12521020

申请日：2007-12-25

申请人： Yoshihiro Tomura ,  Daido Komyoji

发明人： Yoshihiro Tomura ,  Daido Komyoji

IPC分类号： H01L21/00 ,  H01L29/40 ,  H01L23/29

CPC分类号： H01L21/563 ,  H01L23/13 ,  H01L23/3185 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/27334 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/75316 ,  H01L2224/81191 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A recess portion is formed on a board surface at a position facing a peripheral end portion of a semiconductor device so as to place a sealing-bonding resin partially inside the recess portion. Thereby, increases of a placement area for a fillet portion (foot spreading portion) of the sealing-bonding resin are suppressed while its inclination angle is increased. Thus, stress loads that occur to peripheral portions of the semiconductor device due to thermal expansion differences and thermal contraction differences among individual members caused by heating and cooling processes during a mounting operation are relaxed, by which internal breakdown of the semiconductor device mounted structure is avoided.

摘要翻译： 在与半导体器件的周边端部相对的位置的基板表面上形成凹部，以将密封粘合树脂部分地设置在凹部内。 由此，能够抑制密封用树脂的圆角部（脚部扩展部）的放置面积的增大，同时增大其倾斜角。 因此，放宽了由于在安装操作期间由加热和冷却过程引起的各个部件之间的热膨胀差异和热收缩差异而导致的半导体器件的周边部分产生的应力负载，由此避免了半导体器件安装结构的内部故障 。

公开(公告)号：US07884443B2

公开(公告)日：2011-02-08

申请号：US11993781

申请日：2006-08-09

申请人： Kenichi Yamamoto ,  Daisuke Suetsugu ,  Daido Komyoji

发明人： Kenichi Yamamoto ,  Daisuke Suetsugu ,  Daido Komyoji

IPC分类号： H01L29/92

CPC分类号： H01L23/50 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5223 ,  H01L23/642 ,  H01L23/645 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/0554 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48472 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A capacitor-equipped semiconductor device includes a semiconductor chip having a plurality of electrode terminals; a sheet-like substrate at least having a film capacitor; and a mounting substrate. The mounting substrate is provided on one side thereof with chip connection terminals and ground terminals. The chip connection terminals are disposed to correspond to the electrode terminals of the semiconductor chip. The ground terminals are disposed to correspond to the one electrode terminals of the film capacitor of the sheet-like substrate. The mounting substrate is provided on the other side thereof with external connection terminals connected to the chip connection terminals and the ground terminals and used to mount the mounting substrate on an external substrate.

摘要翻译： 具有电容器的半导体器件包括具有多个电极端子的半导体芯片; 至少具有薄膜电容器的片状基板; 和安装基板。 安装基板的一侧设置有芯片连接端子和接地端子。 芯片连接端子被设置成对应于半导体芯片的电极端子。 接地端子设置成对应于片状基板的薄膜电容器的一个电极端子。 安装基板的另一侧设置有连接到芯片连接端子和接地端子的外部连接端子，并用于将安装基板安装在外部基板上。

公开(公告)号：US07835160B2

公开(公告)日：2010-11-16

申请号：US11996999

申请日：2006-09-27

申请人： Kenichi Yamamoto ,  Daisuke Suetsugu ,  Daido Komyoji ,  Takashi Imanaka ,  Hirotaka Hisamura

发明人： Kenichi Yamamoto ,  Daisuke Suetsugu ,  Daido Komyoji ,  Takashi Imanaka ,  Hirotaka Hisamura

IPC分类号： H05K1/11

CPC分类号： H01R12/716 ,  H03H7/01 ,  H05K1/0233 ,  H05K1/141 ,  H05K1/162 ,  H05K1/167 ,  H05K3/368 ,  H05K2201/1006 ,  H05K2201/10189 ,  Y10T29/49124

摘要： First sheet-like substrate is arranged at a region surrounded by first terminals of male connector and first circuit substrate, and second sheet-like substrate is arranged at a region surrounded by second terminals of female connector and second circuit substrate, and male connector and female connector are fitted together so that a first passive element of first sheet-like substrate and a second passive element of second sheet-like substrate configure a filter circuit.

摘要翻译： 第一片状基板布置在由阳连接器和第一电路基板的第一端子包围的区域中，第二片状基板布置在由阴连接器和第二电路基板的第二端子包围的区域中，并且阳连接器和阴件 连接器装配在一起，使得第一片状基板的第一无源元件和第二片状基板的第二无源元件构成滤波器电路。

公开(公告)号：US20100149777A1

公开(公告)日：2010-06-17

申请号：US11996999

申请日：2006-09-27

申请人： Kenichi Yamamoto ,  Daisuke Suetsugu ,  Daido Komyoji ,  Takashi Imanaka ,  Hirotaka Hisamura

发明人： Kenichi Yamamoto ,  Daisuke Suetsugu ,  Daido Komyoji ,  Takashi Imanaka ,  Hirotaka Hisamura

IPC分类号： H01R12/16 ,  H05K3/00

CPC分类号： H01R12/716 ,  H03H7/01 ,  H05K1/0233 ,  H05K1/141 ,  H05K1/162 ,  H05K1/167 ,  H05K3/368 ,  H05K2201/1006 ,  H05K2201/10189 ,  Y10T29/49124

摘要： First sheet-like substrate is arranged at a region surrounded by first terminals of male connector and first circuit substrate, and second sheet-like substrate is arranged at a region surrounded by second terminals of female connector and second circuit substrate, and male connector and female connector are fitted together so that a first passive element of first sheet-like substrate and a second passive element of second sheet-like substrate configure a filter circuit.

摘要翻译： 第一片状基板布置在由阳连接器和第一电路基板的第一端子包围的区域中，第二片状基板布置在由阴连接器和第二电路基板的第二端子包围的区域中，并且阳连接器和阴件 连接器装配在一起，使得第一片状基板的第一无源元件和第二片状基板的第二无源元件构成滤波器电路。

公开(公告)号：US20070068657A1

公开(公告)日：2007-03-29

申请号：US11526031

申请日：2006-09-25

申请人： Kenichi Yamamoto ,  Teruo Maruyama ,  Akio Mitsuhashi ,  Daisuke Suetsugu ,  Daido Komyoji

发明人： Kenichi Yamamoto ,  Teruo Maruyama ,  Akio Mitsuhashi ,  Daisuke Suetsugu ,  Daido Komyoji

IPC分类号： H05K7/20

CPC分类号： H05K7/20336 ,  F28D15/0233 ,  F28D15/046 ,  H01L23/427 ,  H01L2224/16225

摘要： A sheet-shaped heat pipe including working fluid, a partition plate having a vapor flow path which is formed by a concave portion provided in a spacer and through which vapor of the working fluid passes and a fluid flow path provided on an inner surface of the concave portion through which the working fluid passes, a container with an opening portion, which includes the working fluid and the partition plate inside thereof, and a sealed portion for hermetically sealing the opening portion of the container. Since container has a laminated structure of at least a metal film and a resin film, it realizes a sheet-shaped heat pipe with high flexibility and little deterioration of a sealing performance.

摘要翻译： 一种包括工作流体的片状热管，具有蒸气流路的隔板，该蒸气流路由设置在间隔件中的凹部形成，工作流体的蒸气通过该分隔板和设置在该内壁的内表面的流体流路 工作流体通过的凹部，具有开口部的容器，其内部包括工作流体和分隔板，以及用于气密地密封容器的开口部的密封部。 由于容器具有至少金属膜和树脂膜的层压结构，所以实现了具有高柔性的片状热管，密封性能的劣化很小。