公开(公告)号：US08637251B2

公开(公告)日：2014-01-28

申请号：US13231179

申请日：2011-09-13

申请人： Tomoteru Abe ,  Yuji Segawa ,  Junji Kajihara ,  Tomohiko Nakamura ,  Masaki Sato

发明人： Tomoteru Abe ,  Yuji Segawa ,  Junji Kajihara ,  Tomohiko Nakamura ,  Masaki Sato

IPC分类号： C12Q1/68 ,  C12P19/34

CPC分类号： B01L3/5027 ,  B01L7/52 ,  B01L2200/0694 ,  B01L2300/0816 ,  B01L2300/0867 ,  B01L2300/087 ,  B01L2300/0883

摘要： A nucleic acid quantification method that uses a microchip for nucleic acid amplification reaction, the microchip including an inlet through which a liquid is introduced from outside, a plurality of reaction regions provided as reaction sites of a nucleic acid amplification reaction, and a channel through which the liquid introduced through the inlet is supplied into each of the reaction regions, wherein the likelihood of the nucleic acid amplification reaction varies between the reaction regions, includes: flowing a detection target nucleic acid chain-containing solution through the channel and introducing the solution into each of the reaction regions to perform a nucleic acid amplification reaction; and detecting an amplification product in each of the reaction regions to specify the reaction regions in which the nucleic acid amplification reaction occurred.

摘要翻译： 一种使用微芯片进行核酸扩增反应的核酸定量方法，所述微芯片包括从外部引入液体的入口，作为核酸扩增反应的反应位点提供的多个反应区域， 通过入口引入的液体被供应到每个反应区域中，其中核酸扩增反应在反应区域之间变化的可能性包括：使含有检测目标的含有核酸链的溶液流过该通道并将溶液引入 每个反应区进行核酸扩增反应; 并检测每个反应区域中的扩增产物，以指定发生核酸扩增反应的反应区域。

公开(公告)号：US20120039774A1

公开(公告)日：2012-02-16

申请号：US13264291

申请日：2010-04-19

申请人： Tasuku Yotoriyama ,  Naohisa Sakamoto ,  Yuji Segawa ,  Satomi Tanaka

发明人： Tasuku Yotoriyama ,  Naohisa Sakamoto ,  Yuji Segawa ,  Satomi Tanaka

IPC分类号： B01J14/00

CPC分类号： B01L3/502715 ,  B01L3/502723 ,  B01L2200/027 ,  B01L2200/0605 ,  B01L2200/0673 ,  B01L2200/142 ,  B01L2300/0816 ,  B01L2300/0864 ,  B01L2400/0487 ,  B01L2400/049

摘要： A sample solution introduction kit and a sample solution injector capable of introducing sample solution while reducing the rate of occurrence of an air bubble and having a simplified structure are proposed.A sample solution introduction kit includes a plate-like member and a sample solution injector. The plate-like member has a plurality of spaces formed therein and serving as reaction field and a communication space that communicates with the plurality of spaces therein and that has a portion defining an opening formed in a surface of the plate-like member, and the sample solution injector includes a container containing the sample solution, a tube that communicates with the bottom of the container and that is insertable into the opening, a stopper removably fitted into an opening formed at a top end of the tube, and liquid held in the container, and the liquid is insoluble in the sample solution and is lighter than the sample solution.

摘要翻译： 提出了一种能够引入样品溶液同时降低气泡发生率并具有简化结构的样品溶液引入试剂盒和样品溶液注射器。 样品溶液引入试剂盒包括板状构件和样品溶液注入器。 板状构件具有形成在其中并用作反应场的多个空间和与其中的多个空间连通的连通空间，并且具有限定形成在板状构件的表面中的开口的部分， 样品溶液喷射器包括容纳样品溶液的容器，与容器的底部连通并且可插入到开口中的管，可拆卸地装配到形成在管的顶端的开口中的塞子，以及保持在 容器，液体不溶于样品溶液，比样品溶液轻。

公开(公告)号：US20100213056A1

公开(公告)日：2010-08-26

申请号：US11916206

申请日：2006-05-12

申请人： Yuji Segawa ,  Yoichi Katsumoto

发明人： Yuji Segawa ,  Yoichi Katsumoto

IPC分类号： G01N27/26 ,  G01N27/447

CPC分类号： G01N33/5438 ,  B01L3/5027 ,  G01N27/4473

摘要： There are provided an interaction detecting portion including an interaction region in the whole of which an electrodynamic effect is obtained, and which has a simpler structure, and the like. There is provided an interaction detecting portion 1 including at least: a reaction region 2 which provides a field for an interaction between materials, and an electrode E1 (or a group of electrodes), having the same potential, which is provided so as to face the reaction region 2. In addition, there are provided a sensor chip, such as a DNA chip or a protein chip, including the interaction detecting portion 1, and an interaction detector using the detection portion 1.

摘要翻译： 提供了一种相互作用检测部分，其包括整体中获得电动势效应并具有更简单结构的相互作用区域等。 提供了一种相互作用检测部分1，其至少包括：提供用于材料之间的相互作用的场的反应区域2和具有相同电位的电极E1（或一组电极），其被设置为面对 反应区域2.此外，还提供了包括相互作用检测部分1的诸如DNA芯片或蛋白质芯片的传感器芯片以及使用检测部分1的相互作用检测器。

公开(公告)号：US20050112645A1

公开(公告)日：2005-05-26

申请号：US10955280

申请日：2004-09-30

申请人： Yuji Segawa ,  Takayoshi Mamine ,  Oliver Harnack

发明人： Yuji Segawa ,  Takayoshi Mamine ,  Oliver Harnack

IPC分类号： G01N33/53 ,  B03C5/02 ,  C12M1/00 ,  C12M1/34 ,  C12N15/09 ,  G01N27/00 ,  G01N27/327 ,  G01N27/416 ,  G01N27/447 ,  G01N33/543 ,  G01N37/00 ,  C12Q1/68

CPC分类号： B03C5/026

摘要： A detecting unit for detecting interaction between substances includes a pair of first opposed electrodes disposed opposite to each other so as to sandwich a reaction area providing a field for the interaction between the substances, and both or one of electrodes forming second opposed electrodes disposed opposite to each other in a direction of an axis crossing an opposing axis of the first opposed electrodes.

摘要翻译： 用于检测物质之间的相互作用的检测单元包括一对彼此相对设置的第一相对电极，以便夹持提供用于物质之间的相互作用的场的反应区域，以及形成相对设置的第二相对电极的两个或一个电极 彼此沿着与第一相对电极的相对轴线交叉的轴的方向。

公开(公告)号：US06855634B2

公开(公告)日：2005-02-15

申请号：US09963966

申请日：2001-09-26

申请人： Shuzo Sato ,  Yuji Segawa ,  Akira Yoshio ,  Takeshi Nogami

发明人： Shuzo Sato ,  Yuji Segawa ,  Akira Yoshio ,  Takeshi Nogami

IPC分类号： B23H5/08 ,  B24B37/04 ,  H01L21/304 ,  H01L21/321 ,  H01L21/768 ,  H01L21/302

CPC分类号： H01L21/3212 ,  B24B37/042 ,  H01L21/76807

摘要： A polishing method able to easily flatten unevenness formed on the surface of a film to be polished and able to efficiently polish the film flat while suppressing damage to an interlayer insulating film below the film, comprising, when polishing an object having a film such as an interconnection layer formed burying interconnection grooves formed in an insulating film of a substrate, supplying a polishing solution over the surface to be polished at least substantially parallel to the surface to preferentially remove by polishing the projecting portions of the film and flatten the surface by the shear stress of the processing solution or arranging a cathode member facing the surface and supplying an electrolytic solution containing a chelating agent between the surface and cathode member while supplying voltage between the film and the cathode member to preferentially remove by polishing the projecting portions of the film and flatten the surface by the shear stress of the electrolytic solution, and a polishing apparatus using the same.

摘要翻译： 一种抛光方法，其能够容易地使形成在待研磨的膜的表面上的凹凸变平，并且能够有效地抛光该薄膜，同时抑制薄膜下面的层间绝缘膜的损坏，其特征在于，当研磨具有诸如 互连层形成在衬底的绝缘膜中形成的互连槽，将至少基本上平行于表面的待抛光表面上的抛光溶液提供给抛光层，以优先通过抛光膜的突出部分并通过剪切使表面变平 处理溶液的应力或者配置面向表面的阴极部件，并在表面和阴极部件之间提供含有螯合剂的电解液，同时在膜和阴极部件之间提供电压，以通过抛光膜的突出部分优先除去， 通过电解质的剪切应力使表面变平 溶液和使用其的抛光装置。

公开(公告)号：US20050003654A1

公开(公告)日：2005-01-06

申请号：US10680668

申请日：2003-10-07

申请人： Hiroshi Horikoshi ,  Yuji Segawa ,  Takeshi Nogami

发明人： Hiroshi Horikoshi ,  Yuji Segawa ,  Takeshi Nogami

IPC分类号： C23C18/18 ,  C23C18/32 ,  C23C18/50 ,  C25D5/50 ,  C25D7/12 ,  H01L21/28 ,  H01L21/288 ,  H01L21/3205 ,  H01L21/44 ,  H01L21/4763 ,  H01L21/768 ,  H01L23/52

CPC分类号： H01L21/76877 ,  H01L21/288 ,  H01L21/76849 ,  H01L21/76873

摘要： A method of producing a semiconductor device capable of suppressing damages by corrosion on wiring in a catalyst process performed in electroless plating processing on a Co base material, etc. in producing a semiconductor device having wiring of Cu, etc., having steps of forming metal wiring including an additive on a first insulation film formed in a semiconductor substrate, and forming on the metal wiring a barrier layer for preventing diffusion of constituting elements of the metal wiring, wherein said additive is an element to reduce corrosion of the metal wiring at the time of forming the barrier layer in the step of forming the metal wiring.

摘要翻译： 一种制造半导体器件的方法，该半导体器件能够抑制对在Co基材等的无电解电镀处理中进行的催化剂工艺中的布线的腐蚀的损伤，以制造具有Cu等布线的半导体器件，其具有形成金属的步骤 在半导体基板上形成的第一绝缘膜上具有添加剂的布线，在金属布线上形成防止金属布线构成元件扩散的阻挡层，其中，所述添加剂是减少金属布线的腐蚀的元素 在形成金属布线的步骤中形成阻挡层的时间。

公开(公告)号：US06835292B2

公开(公告)日：2004-12-28

申请号：US10697814

申请日：2003-10-29

申请人： Shuzo Sato ,  Yuji Segawa ,  Akira Yoshiq ,  Takeshi Nogami

发明人： Shuzo Sato ,  Yuji Segawa ,  Akira Yoshiq ,  Takeshi Nogami

IPC分类号： C25F700

CPC分类号： H01L21/3212 ,  B24B37/042 ,  H01L21/76807

摘要： A polishing method able to easily flatten unevenness formed on the surface of a film to be polished and able to efficiently polish the film flat while suppressing damage to an interlayer insulating film below the film, comprising, when polishing an object having a film such as an interconnection layer formed burying interconnection grooves formed in an insulating film of a substrate, supplying a polishing solution over the surface to be polished at least substantially parallel to the surface to preferentially remove by polishing the projecting portions of the film and flatten the surface by the shear stress of the processing solution or arranging a cathode member facing the surface and supplying an electrolytic solution containing a chelating agent between the surface and cathode member while supplying voltage between the film and the cathode member to preferentially remove by polishing the projecting portions of the film and flatten the surface by the shear stress of the electrolytic solution, and a polishing apparatus using the same.

摘要翻译： 一种抛光方法，其能够容易地使形成在待研磨的膜的表面上的凹凸变平，并且能够有效地抛光该薄膜，同时抑制薄膜下面的层间绝缘膜的损坏，其特征在于，当研磨具有诸如 互连层形成在衬底的绝缘膜中形成的互连槽，将至少基本上平行于表面的待抛光表面上的抛光溶液提供给抛光层，以优先通过抛光膜的突出部分并通过剪切使表面变平 处理溶液的应力或者配置面向表面的阴极部件，并在表面和阴极部件之间提供含有螯合剂的电解液，同时在膜和阴极部件之间提供电压，以通过抛光膜的突出部分优先除去， 通过电解质的剪切应力使表面变平 溶液和使用其的抛光装置。

公开(公告)号：US06638564B2

公开(公告)日：2003-10-28

申请号：US09827936

申请日：2001-04-09

申请人： Yuji Segawa ,  Akira Yoshio ,  Masatoshi Suzuki ,  Katsumi Watanabe ,  Shuzo Sato

发明人： Yuji Segawa ,  Akira Yoshio ,  Masatoshi Suzuki ,  Katsumi Watanabe ,  Shuzo Sato

IPC分类号： B05D312

CPC分类号： H01L21/76843 ,  C23C18/1664 ,  C23C18/1683 ,  C23C18/50 ,  H01L21/288 ,  H01L21/76849 ,  H01L21/76876

摘要： A method of electroless plating for processing a plating surface to form a barrier layer being capable of uniformly forming a barrier layer and reducing the consumption of a processing solution, comprising a step of feeding a processing solution used in at least one of the pre-processing steps of the electroless plating and the electroless plating step to the plating surface for puddling treatment, or, using a processing solution at least containing, with respect to one mole of a first metallic material supplying a main ingredient of the barrier layer, three or more moles of a completing agent and three or more moles of reducing agent and having a pH value adjusted to 9 or more and stored in an atmosphere of an inert gas or ammonia gas, and a corresponding electroless plating apparatus.

公开(公告)号：US06479384B2

公开(公告)日：2002-11-12

申请号：US09784715

申请日：2001-02-15

申请人： Naoki Komai ,  Yuji Segawa ,  Takeshi Nogami

发明人： Naoki Komai ,  Yuji Segawa ,  Takeshi Nogami

IPC分类号： H01L2144

CPC分类号： H01L21/76843 ,  H01L21/288 ,  H01L21/76849 ,  H01L21/76852 ,  H01L21/76874 ,  H01L21/76877

摘要： A process for fabricating a semiconductor device, which comprises forming, on a metal wiring formed from copper or a copper alloy, a barrier film which functions as a diffusion-preventing film for the metal wiring by an electroless plating method, wherein a catalytic metal film which serves as a catalyst in the electroless plating method is selectively formed on the metal wiring by a displacement plating method using a displacement plating solution at a temperature in the range of 30° C. or more and lower than a boiling point thereof, and the barrier film is selectively formed on the catalytic metal film by the electroless plating method. It is an object of the present invention, to selectively and uniformly carry out the catalyst activation to the surface of the metal wiring made of copper or a copper alloy by using palladium so as to improve plating property of the electroless plating method using a hypophosphite as a reducing agent and the reliability of the wiring.

摘要翻译： 一种制造半导体器件的方法，其包括在由铜或铜合金形成的金属布线上形成通过化学镀方法用作金属布线的防扩散膜的阻挡膜，其中催化金属膜 在化学镀方法中作为催化剂的催化剂通过使用位移镀液在30℃以上且低于其沸点的温度下的位移镀方法选择性地形成在金属配线上， 通过化学镀方法在催化金属膜上选择性地形成阻挡膜。 本发明的目的是通过使用钯来选择性地和均匀地进行由铜或铜合金制成的金属配线的表面的催化剂活化，从而提高使用次磷酸盐的化学镀方法的电镀性能 还原剂和布线的可靠性。

公开(公告)号：US5870000A

公开(公告)日：1999-02-09

申请号：US805365

申请日：1997-02-24

申请人： Atsushi Matsuda ,  Yuji Segawa

发明人： Atsushi Matsuda ,  Yuji Segawa

IPC分类号： H03K3/0231 ,  H03L7/099 ,  H03L7/183 ,  H03L7/00

CPC分类号： H03K3/0231 ,  H03L7/099 ,  H03L7/183

摘要： An oscillation circuit for producing an output whose frequency accords with an input voltage value, comprises a first constant current source whose current has a value according to the input voltage value; a charge capacitor to be charged by the first constant current source; a comparator having one input terminal connected to a charge terminal of the charge capacitor to be charged and an other input terminal supplied with a first reference voltage, for comparing inputs to both input terminals with each other and outputting an output signal having a high level or a low level; and first switch means for pulling down a potential of the charge terminal of the charge capacitor to a second reference voltage lower than the first reference voltage under control by an output of the comparator.

摘要翻译： 用于产生其频率符合输入电压值的输出的振荡电路包括电流具有根据输入电压值的值的第一恒流源; 由第一恒流源充电的充电电容器; 比较器，其具有连接到要充电的充电电容器的充电端子的一个输入端子和被提供有第一参考电压的另一个输入端子，用于将两个输入端子的输入彼此进行比较，并输出具有高电平的输出信号或 低水平 以及第一开关装置，用于通过比较器的输出将充电电容器的充电端子的电位降低到低于第一参考电压的第二参考电压。