公开(公告)号：US08513787B2

公开(公告)日：2013-08-20

申请号：US13210841

申请日：2011-08-16

申请人： Richard K. Williams ,  Keng Hung Lin

发明人： Richard K. Williams ,  Keng Hung Lin

IPC分类号： H01L23/495 ,  H01L23/48

CPC分类号： H01L25/50 ,  H01L23/49503 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12033 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： To avoid shorts between adjacent die pads in mounting a multi-die semiconductor package to a printed circuit board (PCB), one of the die pads is embedded in the polymer capsule, while the other die pad is exposed at the bottom of the package to provide a thermal escape path to the PCB. This arrangement is particularly useful when one of the dice in a multi-die package generates more heat than another die in the package.

摘要翻译： 为了避免将多芯片半导体封装安装到印刷电路板（PCB）上的相邻裸片焊盘之间的短路，其中一个裸片焊盘嵌入聚合物胶囊中，而另一个芯片焊盘在封装的底部露出， 提供热释放通路到PCB。 当多芯片封装中的一个芯片产生比封装中的另一个裸片更多的热量时，这种布置是特别有用的。

公开(公告)号：US09500678B2

公开(公告)日：2016-11-22

申请号：US14298074

申请日：2014-06-06

申请人： ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED

发明人： Richard K. Williams

IPC分类号： G01R19/00 ,  H01L23/495 ,  H01L23/00 ,  H01L27/088 ,  H01L29/78 ,  H03K17/082 ,  H01L29/10 ,  G01R1/20 ,  H03K17/18 ,  H01L29/417 ,  H01L29/423 ,  H02M1/00

CPC分类号： G01R19/0092 ,  G01R1/203 ,  H01L23/49575 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/17 ,  H01L24/25 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L27/088 ,  H01L29/1087 ,  H01L29/41758 ,  H01L29/4238 ,  H01L29/7833 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05093 ,  H01L2224/05558 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12035 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H02M2001/0009 ,  H03K17/0822 ,  H03K17/18 ,  H03K2217/0027 ,  H01L2924/00 ,  H01L2924/00012

摘要： A current sensor to be connected in series with a power semiconductor device between a voltage supply terminal and ground. The current sensor includes a first terminal to be coupled to the power semiconductor device, a second terminal to be coupled to one of the voltage supply terminal and ground, and a current mirror. The current mirror includes a first MOSFET and a second MOSFET each having a source, a drain, and a gate. The source of the first MOSFET is connected to the source of the second MOSFET and to the second terminal, the drain of the first MOSFET is connected to the first terminal, and the gate of the first MOSFET is connected to the gate of the second MOSFET.

摘要翻译： 与电源端子和地之间的功率半导体器件串联连接的电流传感器。 电流传感器包括要耦合到功率半导体器件的第一端子，要耦合到电压端子和地之一的第二端子以及电流镜。 电流镜包括第一MOSFET和第二MOSFET，每个具有源极，漏极和栅极。 第一MOSFET的源极连接到第二MOSFET的源极和第二端子，第一MOSFET的漏极连接到第一端子，并且第一MOSFET的栅极连接到第二MOSFET的栅极 。

公开(公告)号：US09246449B2

公开(公告)日：2016-01-26

申请号：US14087555

申请日：2013-11-22

申请人： ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED

发明人： Richard K. Williams

IPC分类号： H03F3/217 ,  H01L29/78 ,  H03F1/02 ,  H03F3/68 ,  H03F3/185 ,  H01L23/367 ,  H01L23/495 ,  H01L23/00 ,  H01L27/092 ,  H01L29/40 ,  H01L29/423

CPC分类号： H01L29/7811 ,  H01L23/3677 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L27/092 ,  H01L29/407 ,  H01L29/42372 ,  H01L29/7802 ,  H01L29/7813 ,  H01L2223/6644 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12035 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H03F1/0205 ,  H03F3/185 ,  H03F3/2171 ,  H03F3/2173 ,  H03F3/68 ,  H03F2200/03 ,  H03F2200/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A stereo class-D audio system includes a first die including four monolithically integrated NMOS high-side devices and a second a second die including, four monolithically integrated PMOS low-side devices. The audio system also includes a set of electrical contacts for connecting the high and low-side devices to components within the a stereo class-D audio system, the set of electrical contacts including at least one supply contact for connecting the drains of the high-side devices to a supply voltage (Vcc) and at least one ground contact for connecting the drains of the low-side devices to ground, the electrical contacts also including respective contacts for each source of the high and low-side devices allowing the source of each high-side device to be connected to the source of a respective low-side device to form two H-bridge circuits.

摘要翻译： 立体声D类音频系统包括包括四个单片集成NMOS高侧器件的第一裸片和包括四个单片集成PMOS低侧器件的第二裸片。 音频系统还包括一组用于将高侧和低端设备连接到立体声D类音频系统内的组件的电触点，该组触点包括至少一个电源触点， 侧端装置到电源电压（Vcc）和至少一个用于将低侧装置的漏极连接到地的接地触点，电触点还包括用于高端和低侧装置的每个源的相应触点， 每个高侧装置连接到相应的低侧装置的源极以形成两个H桥电路。

公开(公告)号：US09063557B2

公开(公告)日：2015-06-23

申请号：US14021579

申请日：2013-09-09

申请人： ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED

发明人： Kevin D'Angelo

IPC分类号： G05F1/577 ,  H05B33/08 ,  G05F1/46 ,  H02M3/156

CPC分类号： G05F1/46 ,  H02M3/156 ,  H05B33/0815 ,  H05B33/0827 ,  H05B33/0848

摘要： An operational transconductance amplifier used in conjunction with a multiple chip voltage feedback technique allows multiple strings of LEDs and current sinks to be efficiently powered by a simple feedback oriented voltage regulator within an appliance. A connected series of differential amplifiers or multiplexors are used to monitor the voltages between the connected LEDs and the current sinks, in order to progressively determine the lowest voltage. The operational transconductance amplifier compares this voltage to a reference voltage and injects or removes current from the feedback node of a voltage regulator, thereby altering the voltage present at the feedback node. This causes the voltage regulator to adjust its output, ensuring that the current sinks of the LED strings have adequate voltage with which to function, even as the LEDs have different forward voltages and the strings are asynchronously enabled and disabled.

摘要翻译： 与多芯片电压反馈技术结合使用的运算跨导放大器允许多个LED串和电流吸收器由设备内的简单的反馈取向的电压调节器有效地供电。 使用连接的差分放大器或多路复用器系列来监视连接的LED和电流吸收器之间的电压，以便逐步确定最低电压。 操作跨导放大器将该电压与参考电压进行比较，并从电压调节器的反馈节点注入或去除电流，从而改变反馈节点处的电压。 这使得电压调节器调节其输出，确保LED串的电流吸收器具有足够的电压，即使LED具有不同的正向电压，并且串是异步启用和禁用的。

公开(公告)号：US08952619B2

公开(公告)日：2015-02-10

申请号：US13347639

申请日：2012-01-10

申请人： Richard K. Williams ,  Kevin D'Angelo ,  David A. Brown ,  George A. Hariman

发明人： Richard K. Williams ,  Kevin D'Angelo ,  David A. Brown ,  George A. Hariman

IPC分类号： H05B37/02 ,  H05B33/08

CPC分类号： H05B33/0827 ,  H05B33/0884

摘要： A distributed system for driving strings of series-connected LEDs for backlighting, display and lighting applications includes multiple intelligent satellite LED driver ICs connected to a an interface IC via serial bus. The interface IC translates information obtained from a host microcontroller into instructions for the satellite LED driver ICs pertaining to such parameters as duty factor, current levels, phase delay and fault settings. Fault conditions in the LED driver ICs can be transmitted back to, the interface IC. An analog current sense feedback system which also links the LED driver ICs determines the supply voltage for the LED strings.

摘要翻译： 用于驱动用于背光，显示和照明应用的串联LED串的分布式系统包括通过串行总线连接到接口IC的多个智能卫星LED驱动器IC。 接口IC将从主机微控制器获得的信息转换成与占空比，当前电平，相位延迟和故障设置等参数有关的卫星LED驱动器IC的指令。 LED驱动器IC中的故障条件可以传回回接口IC。 也连接LED驱动器IC的模拟电流感测反馈系统确定LED串的电源电压。

公开(公告)号：US08947407B2

公开(公告)日：2015-02-03

申请号：US13347631

申请日：2012-01-10

申请人： Richard K. Williams ,  Kevin D'Angelo ,  David A. Brown ,  George A. Hariman

发明人： Richard K. Williams ,  Kevin D'Angelo ,  David A. Brown ,  George A. Hariman

IPC分类号： G06F3/038 ,  H05B37/02 ,  H05B33/08

CPC分类号： H05B33/0827 ,  H05B33/0884

摘要： A distributed system for driving strings of series-connected LEDs for backlighting, display and lighting applications includes multiple intelligent satellite LED driver ICs connected to a an interface IC via serial bus. The interface IC translates information obtained from a host microcontroller into instructions for the satellite LED driver ICs pertaining to such parameters as duty factor, current levels, phase delay and fault settings. Fault conditions in the LED driver ICs can be transmitted back to the interface IC. An analog current sense feedback system which also links the LED driver ICs determines the supply voltage for the LED strings.

公开(公告)号：US08823342B2

公开(公告)日：2014-09-02

申请号：US12168626

申请日：2008-07-07

申请人： Richard Williams

发明人： Richard Williams

IPC分类号： G05F1/00

CPC分类号： H02M3/158 ,  H02M3/1584 ,  H02M2001/009

摘要： A multi-output dual polarity inductive boost converter includes an inductor, a first output node, a second output node, and a switching network, the switching network configured to provide the following modes of circuit operation: a first mode where the positive electrode of the inductor is connected to an input voltage and the negative electrode of the inductor is connected to ground; 2) a second mode the negative electrode of the inductor is connected to ground and the positive electrode of the inductor is connected in sequence to one or more of the fourth and fifth output nodes; and 3) a third mode where the positive electrode of the inductor is connected to the input voltage and the negative electrode of the inductor is connected in sequence to one or more of the first, second and third output nodes.

摘要翻译： 多输出双极性电感升压转换器包括电感器，第一输出节点，第二输出节点和交换网络，所述交换网络被配置为提供以下模式的电路操作：第一模式，其中所述正电极 电感器连接到输入电压，电感器的负极接地; 2）第二模式，电感器的负极连接到地，并且电感器的正极依次连接到第四和第五输出节点中的一个或多个; 以及3）第三模式，其中电感器的正电极连接到输入电压，并且电感器的负极依次连接到第一，第二和第三输出节点中的一个或多个。

公开(公告)号：US08611063B2

公开(公告)日：2013-12-17

申请号：US12715048

申请日：2010-03-01

申请人： John So

发明人： John So

IPC分类号： H02H9/08

CPC分类号： H02H9/025 ,  H02H3/006 ,  H02J7/0029 ,  H02J7/345 ,  H02J2007/0039 ,  H02J2007/0062 ,  H03K17/0822 ,  H03K17/122 ,  H03K2217/0027

摘要： Devices, such as mobile devices, may be exposed to short circuit and output overload events. To protect against such events, mobile devices typically include circuitry to limit currents so as not to exceed a pre-programmed current limit. Various embodiments of the present invention include devices and methods for detecting pre-programmed current limits and for limiting currents in response to such detection. In some embodiments, both the current limit detector and the current limit controller circuitry include scaled current switches. The scaling may be substantially similar between the programmed-current limit detector and the current limit controller circuitry.

摘要翻译： 诸如移动设备的设备可能暴露于短路和输出过载事件。 为了防止这种事件，移动设备通常包括限制电流的电路，以便不超过预编程的电流限制。 本发明的各种实施例包括用于检测预编程电流限制并响应于这种检测限制电流的装置和方法。 在一些实施例中，电流限制检测器和限流控制器电路均包括定标电流开关。 编程电流限制检测器和电流限制控制器电路之间的缩放可能基本相似。

公开(公告)号：US08593220B2

公开(公告)日：2013-11-26

申请号：US13788336

申请日：2013-03-07

申请人： Advanced Analogic Technologies Incorporated

发明人： Richard K. Williams

IPC分类号： H03F3/217

CPC分类号： H01L29/7811 ,  H01L23/3677 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L27/092 ,  H01L29/407 ,  H01L29/42372 ,  H01L29/7802 ,  H01L29/7813 ,  H01L2223/6644 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12035 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H03F1/0205 ,  H03F3/185 ,  H03F3/2171 ,  H03F3/2173 ,  H03F3/68 ,  H03F2200/03 ,  H03F2200/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A stereo class-D audio system includes a first die including four monolithically integrated NMOS high-side devices and a second a second die including four monolithically integrated PMOS low-side devices. The audio system also includes a set of electrical contacts for connecting the high and low-side devices to components within the a stereo class-D audio system, the set of electrical contacts including at least one supply contact for connecting the drains of the high-side devices to a supply voltage (Vcc) and at least one ground contact for connecting the drains of the low-side devices to ground, the electrical contacts also including respective contacts for each source of the high and low-side devices allowing the source of each high-side device to be connected to the source of a respective low-side device to form two H-bridge circuits.

摘要翻译： 立体声D类音频系统包括包括四个单片集成NMOS高侧器件的第一裸片和包括四个单片集成PMOS低边器件的第二裸片。 音频系统还包括一组用于将高侧和低端设备连接到立体声D类音频系统内的组件的电触点，该组触点包括至少一个电源触点， 侧端装置到电源电压（Vcc）和至少一个用于将低侧装置的漏极连接到地的接地触点，电触点还包括用于高端和低侧装置的每个源的相应触点， 每个高侧装置连接到相应的低侧装置的源极以形成两个H桥电路。

公开(公告)号：US08502362B2

公开(公告)日：2013-08-06

申请号：US13210592

申请日：2011-08-16

申请人： Richard K. Williams

发明人： Richard K. Williams

IPC分类号： H01L23/495 ,  H01L23/34

CPC分类号： H01L23/49811 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49572 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： Thermal transfer from a silicon-on-insulator (SOI) die is improved by mounting the die in a bump-on-leadframe manner in a semiconductor package, with solder or other metal bumps connecting the active layer of the SOI die to metal leads used to mount the package on a printed circuit board or other support structure.

摘要翻译： 通过以半导体封装中的凸起引线框架方式将裸片安装在半导体封装中，通过将SOI裸片的有源层连接到金属引线上的焊料或其它金属凸块来改善来自绝缘体上硅（SOI）裸片的热传递 将封装安装在印刷电路板或其他支撑结构上。