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公开(公告)号：US08084116B2
公开(公告)日：2011-12-27
申请号：US11239973
申请日：2005-09-30
Applicant: Joanna Aizenberg , Thomas Nikita Krupenkin , Oleksander Sydorenko , Joseph Ashley Taylor
CPC classification number: C09D5/00 , B81B3/0089 , B81B2201/06 , B81B2203/0361 , B82Y30/00 , Y10T428/24 , Y10T428/24174 , Y10T428/24273 , Y10T428/24355 , Y10T428/24496 , Y10T428/24612 , Y10T428/2462 , Y10T428/31511 , Y10T428/31663
Abstract: An apparatus includes a substrate having a top surface, a substantially regular array of raised structures located over the top surface, and a layer located on the top surface between the structures. Distal surfaces of the structures are farther from the top surface than remaining portions of the structures. The layer is able to contract such that the distal surfaces of the structures protrude through the layer. The layer is able to swell such that the distal surfaces of the structures are closer to the top surface of the substrate than one surface of the layer.
Abstract translation: 一种装置包括具有顶表面，位于顶表面上方的基本上规则的凸起结构阵列的基底和位于结构之间的顶表面上的层。 结构的远端表面比结构的剩余部分远离顶表面。 该层能够收缩，使得结构的远端表面突出穿过该层。 该层能够膨胀，使得结构的远端表面比该层的一个表面更靠近衬底的顶表面。
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公开(公告)号：US20110180931A1
公开(公告)日：2011-07-28
申请号：US13121268
申请日：2009-09-24
Applicant: Freddy Roozeboom , Martijn Goossens , Willen Frederik Adrianus Besling , Nynke Verhaegh
CPC classification number: H01L29/41 , B81B3/007 , B81B2201/06 , B81C1/00619 , B81C2201/0112 , B81C2201/0132 , H01L28/91
Abstract: The invention relates to an semi-conductor device comprising a first surface and neighboring first and second electric elements arranged on the first surface, in which each of the first and second elements extends from the first surface in a first direction, the first element having a cross section substantially perpendicular to the first direction and a sidewall surface extending at least partially in the first direction, wherein the sidewall surface comprises a first section and a second section adjoining the first section along a line extending substantially parallel to the first direction, wherein the first and second sections are placed at an angle with respect to each other for providing an inner corner wherein the sidewall surface at the inner corner is, at least partially, arranged at a constant distance R from a facing part of the second element for providing a mechanical reinforcement structure at the inner corner.
Abstract translation: 本发明涉及一种半导体器件，其包括第一表面和布置在第一表面上的相邻的第一和第二电气元件，其中第一和第二元件中的每个元件在第一方向上从第一表面延伸，第一元件具有 基本上垂直于第一方向的横截面和至少部分地沿第一方向延伸的侧壁表面，其中侧壁表面包括沿着基本上平行于第一方向延伸的线邻接第一部分的第一部分和第二部分，其中， 第一和第二部分相对于彼此以一定角度放置以提供内角，其中内角处的侧壁表面至少部分地布置成距离第二元件的面对部分恒定的距离R，以提供 机械加强结构在内角。
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23.发明申请PROCESS FOR PRODUCING FLUOROCARBON MICROSTRUCTURE, FLUOROCARBON MICROSTRUCTURE, AND MICROSYSTEM 失效生产氟化物微结构，氟化物微结构和微结构的方法公开(公告)号：US20100167014A1
公开(公告)日：2010-07-01
申请号：US12522871
申请日：2008-01-21
Applicant: Takahiro Arakawa , Hiroyuki Kusakawa , Shuichi Shoji
Inventor： Takahiro Arakawa , Hiroyuki Kusakawa , Shuichi Shoji
CPC classification number: C23F1/02 , B81B7/0077 , B81B2201/025 , B81B2201/06 , B81B2203/0118 , B81B2203/053 , C12N5/0075 , Y10T428/24479
Abstract: A process for producing a fluorocarbon microstructure capable of easily fabricating a three-dimensional fluorocarbon microstructure. The process for producing a fluorocarbon microstructure comprises a first processing step for forming, on a substrate (2), a film deposition portion with a given pattern made up of a through-hole figure by etching the substrate (2), a fabricating step for forming a fluorocarbon film (6) on an inner circumferential surface of a film deposition portion (9) to fabricate a fluorocarbon region surrounded by the fluorocarbon film (6), and a second processing step for fabricating the fluorocarbon microstructure protruding from a processing surface of the substrate (2) by etching a given region other than a fluorocarbon region on the substrate (2). Hence, the three-dimensional fluorocarbon microstructure can be fabricated which comprises a complicated structure that has conventionally been hard to fabricate. Thus, a microchannel (1) equipped with the three-dimensional fluorocarbon microstructure can be easily fabricated.
Abstract translation: 一种能够容易地制造三维碳氟化合物显微组织的氟碳微结构的制造方法。 制造碳氟化合物微结构的方法包括：第一处理步骤，用于通过蚀刻基板（2）在基板（2）上形成具有由通孔图形构成的给定图案的成膜部分， 在成膜部（9）的内周面上形成氟碳膜（6），以制造由碳氟化合物膜（6）包围的碳氟化合物区域;以及第二加工步骤，用于制造从处理表面 通过蚀刻在基板（2）上的碳氟化合物区域以外的给定区域而使基板（2）。 因此，可以制造三维碳氟化合物微结构，其包括通常难以制造的复杂结构。 因此，可以容易地制造装备有三维碳氟化合物微结构的微通道（1）。
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公开(公告)号：US07662653B2
公开(公告)日：2010-02-16
申请号：US11314696
申请日：2005-12-20
Applicant: David O'Brien , Florent Cros , Jin Woo Park , Michael Fonseca , Liang You , Mark Allen
Inventor： David O'Brien , Florent Cros , Jin Woo Park , Michael Fonseca , Liang You , Mark Allen
IPC: H01L21/00
CPC classification number: G01L9/0075 , A61B5/03 , A61B2562/0247 , B81B7/007 , B81B2201/0264 , B81B2201/06 , B81B2207/096 , B81C1/00301 , G01L9/0073
Abstract: A method of manufacturing a hermetically-sealed chamber with an electrical feedthrough includes the step of hermetically fixing an electrode to a substrate in a predetermined location on the substrate. A passage is formed through the substrate through the predetermined location such that at least a portion of the electrode is exposed to the passage. The passage is then at least partially filled with an electrically conductive material. A housing is then formed including the substrate such that the housing defines a chamber, with the electrode being disposed within the housing and the chamber being hermetically sealed. The electrode within the chamber can be placed in electrical communication with an exterior electrical component by way of the electrically conductive material in the passage.
Abstract translation: 制造具有电馈通的气密密封室的方法包括将电极气密固定在基板上的预定位置上的步骤。 通过基板穿过预定位置形成通道，使得电极的至少一部分暴露于通道。 然后通道至少部分地填充有导电材料。 然后形成包括基板的壳体，使得壳体限定室，其中电极设置在壳体内，并且室被气密地密封。 室内的电极可以通过通道中的导电材料与外部电气部件电连接。
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公开(公告)号：US20090298116A1
公开(公告)日：2009-12-03
申请号：US12471835
申请日：2009-05-26
Applicant: Ye Fang , Jianguo Wang , Ying Zhang
Inventor： Ye Fang , Jianguo Wang , Ying Zhang
CPC classification number: C12M23/16 , B01L3/5085 , B01L2300/0829 , B01L2300/0851 , B01L2300/163 , B81B2201/06 , B81B2203/0346 , B81B2203/0376 , B81C99/0085 , B81C99/009 , C12M23/12
Abstract: A cell culture apparatus includes a substrate having formed therein a micro-well array, the micro-well array comprising a plurality of micro-wells. Each micro-well is defined by a curved surface which is concave.
Abstract translation: 细胞培养装置包括其中形成有微孔阵列的基底，微孔阵列包括多个微孔。 每个微孔由凹入的曲面限定。
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Patent Agency Ranking
公开(公告)号：US20070077396A1
公开(公告)日：2007-04-05
申请号：US11239973
申请日：2005-09-30
Applicant: Joanna Aizenberg , Thomas Krupenkin , Oleksander Sydorenko , Joseph Taylor
Inventor： Joanna Aizenberg , Thomas Krupenkin , Oleksander Sydorenko , Joseph Taylor
IPC: B32B3/00
CPC classification number: C09D5/00 , B81B3/0089 , B81B2201/06 , B81B2203/0361 , B82Y30/00 , Y10T428/24 , Y10T428/24174 , Y10T428/24273 , Y10T428/24355 , Y10T428/24496 , Y10T428/24612 , Y10T428/2462 , Y10T428/31511 , Y10T428/31663
Abstract: An apparatus includes a substrate having a top surface, a substantially regular array of raised structures located over the top surface, and a layer located on the top surface between the structures. Distal surfaces of the structures are farther from the top surface than remaining portions of the structures. The layer is able to contract such that the distal surfaces of the structures protrude through the layer. The layer is able to swell such that the distal surfaces of the structures are closer to the top surface of the substrate than one surface of the layer.
Abstract translation: 一种装置包括具有顶表面，位于顶表面上方的基本上规则的凸起结构阵列的基底和位于结构之间的顶表面上的层。 结构的远端表面比结构的剩余部分远离顶表面。 该层能够收缩，使得结构的远端表面突出穿过该层。 该层能够膨胀，使得结构的远端表面比该层的一个表面更靠近衬底的顶表面。
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公开(公告)号：US20060177956A1
公开(公告)日：2006-08-10
申请号：US11314696
申请日：2005-12-20
Applicant: David O'Brien , Florent Cros , Jin Park , Michael Fonseca , Liang You , Mark Allen
Inventor： David O'Brien , Florent Cros , Jin Park , Michael Fonseca , Liang You , Mark Allen
IPC: H01L21/00
CPC classification number: G01L9/0075 , A61B5/03 , A61B2562/0247 , B81B7/007 , B81B2201/0264 , B81B2201/06 , B81B2207/096 , B81C1/00301 , G01L9/0073
Abstract: A method of manufacturing a hermetically-sealed chamber with an electrical feedthrough includes the step of hermetically fixing an electrode to a substrate in a predetermined location on the substrate. A passage is formed through the substrate through the predetermined location such that at least a portion of the electrode is exposed to the passage. The passage is then at least partially filled with an electrically conductive material. A housing is then formed including the substrate such that the housing defines a chamber, with the electrode being disposed within the housing and the chamber being hermetically sealed. The electrode within the chamber can be placed in electrical communication with an exterior electrical component by way of the electrically conductive material in the passage.
Abstract translation: 制造具有电馈通的气密密封室的方法包括将电极气密固定在基板上的预定位置上的步骤。 通过基板穿过预定位置形成通道，使得电极的至少一部分暴露于通道。 然后通道至少部分地填充有导电材料。 然后形成包括基板的壳体，使得壳体限定室，其中电极设置在壳体内，并且室被气密地密封。 室内的电极可以通过通道中的导电材料与外部电气部件电连接。
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28.发明申请Method of transcribing biomolecular patterns, method of manufacturing chip boards, and method of manufacturing biochips 失效转录生物分子模式的方法，制造芯片板的方法以及制造生物芯片的方法公开(公告)号：US20050046758A1
公开(公告)日：2005-03-03
申请号：US10902495
申请日：2004-07-29
Applicant: Tomohiko Matsushita , Shigeru Aoyama , Takeo Nishikawa , Yuko Tsuda , Shigemi Norioka , Tetsuichi Wazawa
Inventor： Tomohiko Matsushita , Shigeru Aoyama , Takeo Nishikawa , Yuko Tsuda , Shigemi Norioka , Tetsuichi Wazawa
IPC: G01N33/53 , B81C1/00 , B81C99/00 , G01N33/48 , G01N33/50 , G01N35/00 , G01N37/00 , G02F1/017 , G02F1/13 , H01S5/34
CPC classification number: B82Y20/00 , B01J2219/00382 , B01J2219/00385 , B01J2219/00436 , B01J2219/00527 , B01J2219/00576 , B01J2219/00596 , B01J2219/00605 , B01J2219/00612 , B01J2219/00617 , B01J2219/00619 , B01J2219/00621 , B81B2201/0214 , B81B2201/06 , B81C1/00206 , B81C99/009 , B82Y5/00 , B82Y10/00 , G02F2001/01791 , G02F2202/32 , H01S5/3412
Abstract: A method of mass-producing minute structures such as biochips, protein chips, quantum dots, and quantum chips involves arranging an antigen two-dimensionally on a board and arranging probes two-dimensionally facing the same direction so that the binding sites of the probes may bind to the antigen. An inorganic substance such as Ni is deposited on the board from the upper side of the probes by sputtering or evaporation to form a thin film layer and on the top surface of the flatly formed thin film layer, a supporting layer is formed by separating out the same inorganic substance using electrotyping. Then, by peeling the thin film layer and the supporting layer off of the board together, the mother stamper having cavities for the patterns of biomolecules is obtained.
Abstract translation: 大规模生产生物芯片，蛋白质芯片，量子点和量子芯片的微小结构的方法包括将二维布置在板上，并将探针二维排列成相同的方向，使得探针的结合位点 结合抗原。 无机物质如Ni通过溅射或蒸发从探针的上侧沉积在板上以形成薄膜层，并且在平坦形成的薄膜层的顶表面上，通过分离出 使用电化学的相同无机物质。 然后，通过将薄膜层和支撑层从板上剥离在一起，获得具有用于生物分子图案的空腔的母模。
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公开(公告)号：US20240101943A1
公开(公告)日：2024-03-28
申请号：US17933509
申请日：2022-09-20
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Sagarika Mukesh , Steven Holmes , John S. Werner , Benjamin Hardy Wunsch , Arkadiy O. Tsfasman
CPC classification number: C12M23/16 , B81B1/002 , B81C1/00047 , C12M23/58 , G01N33/5058 , B81B2201/058 , B81B2201/06
Abstract: A neural lattice device includes a substrate having formed therein one or more wells and one or more supply ducts. A channel network includes one or more channels configured to establish fluid communication among the at least one well and the at least one supply duct. A reservoir is coupled to the substrate and configured to hold a fluid, and a cover is disposed against an upper surface of the substrate and configured to hermetically seal the wells, the supply ducts and the channel network.
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公开(公告)号：US09349545B2
公开(公告)日：2016-05-24
申请号：US14414174
申请日：2013-07-22
Applicant: MYCARTIS NV
Inventor： Raphael Tornay , Nicolas Demierre , Stephan Gamper , Philippe Renaud
IPC: H01G13/06 , B01L3/00 , B81C99/00 , G01N33/543
CPC classification number: H01G13/06 , B01J2219/005 , B01J2219/00502 , B01J2219/00536 , B01J2219/00556 , B01J2219/00637 , B01L3/502707 , B01L3/502761 , B01L3/508 , B01L3/54 , B01L3/545 , B01L2200/0647 , B01L2200/10 , B01L2200/12 , B01L2300/0803 , B01L2300/0819 , B01L2300/0851 , B01L2300/0893 , B81B2201/058 , B81B2201/06 , B81C99/008 , G01N33/54313
Abstract: The present invention relates to a method for producing microcarriers comprising the following steps: (a) providing a wafer having a sandwich structure comprising a bottom layer, a top layer and an insulating layer located between said bottom and top layers, (b) etching away the top layer to delineate lateral walls of bodies of the microcarriers, (c) depositing a first active layer at least on a top surface of the bodies, (d) applying a continuous polymer layer over the first active layer, (e) etching away the bottom layer and the insulating layer, (f) removing the polymer layer to release the microcarriers.
Abstract translation: 本发明涉及一种生产微载体的方法，包括以下步骤：（a）提供具有夹层结构的晶片，该夹层结构包括位于所述底层和顶层之间的底层，顶层和绝缘层，（b）蚀刻掉 描绘微载体的主体的侧壁的顶层，（c）至少在主体的顶表面上沉积第一有源层，（d）在第一有源层上施加连续聚合物层，（e）蚀刻掉 底层和绝缘层，（f）去除聚合物层以释放微载体。
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