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公开(公告)号:US11881615B2
公开(公告)日:2024-01-23
申请号:US16968187
申请日:2019-02-07
申请人: YOKOWO CO., LTD.
发明人: Masaru Shimizu , Tsuyoshi Komori , Yuzou Harada
CPC分类号: H01Q1/3275 , B60R11/04 , H01Q1/42 , H01Q9/42 , H04N23/51 , H04N23/54 , B60R2011/004
摘要: An antenna device for a vehicle, the antenna device includes; an antenna; a camera; and a case that accommodates the antenna and the camera, wherein the antenna includes a capacitance loading element disposed at a position separate from the camera, and when the capacitance loading element is divided into a short-distance-side portion and a long-distance-side portion based on a distance from the camera, a length of a first portion of the short-distance-side portion is shorter than a length of a second portion of the short-distance-side portion in a height direction, in which the first portion overlaps the camera in top view and/or side view while the second portion does not overlap the camera in top view and/or side view.
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公开(公告)号:US20240007975A1
公开(公告)日:2024-01-04
申请号:US17819978
申请日:2022-08-16
申请人: Acer Incorporated
发明人: Kun-Sheng CHANG , Ching-Chi LIN
摘要: A mobile device includes a hybrid antenna, a tunable circuit element, an RF (Radio Frequency) module, and a proximity sensor. The tunable circuit element provides an impedance value. The RF module generates RF power. The hybrid antenna is coupled through the tunable circuit element to the RF module. The proximity sensor is respectively coupled to the hybrid antenna, the tunable circuit element, and the RF module, and is configured to detect a specific distance between the hybrid antenna and a conductive element. The tunable circuit element and the RF module are operated according to relative information of the specific distance. If the specific distance is shorter than or equal to a first threshold distance, the RF module will reduce the RF power. If the specific distance is shorter than or equal to a second threshold distance, the tunable circuit element will change the impedance value.
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公开(公告)号:US11831086B2
公开(公告)日:2023-11-28
申请号:US17370181
申请日:2021-07-08
申请人: Wistron NeWeb Corp.
发明人: Po-Yen Chen , Kuan-Hung Li
摘要: An antenna structure includes a metal mechanism element, a ground element, a feeding radiation element, and a dielectric substrate. The metal mechanism element has a slot. The slot has a first closed end and a second closed end. The ground element is coupled to the metal mechanism element. The feeding radiation element has a feeding point. The feeding radiation element is coupled to the ground element. The dielectric substrate has a first surface and a second surface which are opposite to each other. The feeding radiation element is disposed on the first surface of the dielectric substrate. The second surface of the dielectric substrate is adjacent to the metal mechanism element. The slot of the metal mechanism element is excited to generate a first frequency band and a second frequency band. The feeding radiation element is excited to generate a third frequency band.
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公开(公告)号:US11818843B2
公开(公告)日:2023-11-14
申请号:US17971146
申请日:2022-10-21
发明人: Jungsik Park , Soyoung Lee
IPC分类号: H05K1/14 , G06F1/16 , H01Q1/52 , H04M1/02 , H04B1/3883 , G06F1/20 , G06F1/26 , H01Q9/04 , H01R12/53 , H05K1/11 , H01Q9/42 , H01Q1/24 , H01Q21/06 , H05K1/02 , H05K1/18
CPC分类号: H05K1/144 , G06F1/1626 , G06F1/1635 , G06F1/1656 , G06F1/1658 , G06F1/1698 , G06F1/203 , G06F1/263 , H01Q1/526 , H01Q9/0407 , H01R12/53 , H04B1/3883 , H04M1/026 , H04M1/0262 , H04M1/0277 , H05K1/116 , H01Q1/243 , H01Q9/42 , H01Q21/065 , H05K1/0216 , H05K1/147 , H05K1/181 , H05K2201/042 , H05K2201/10037 , H05K2201/10098 , H05K2201/10189 , H05K2201/10371 , H05K2201/10378
摘要: An electronic device including an interposer is provided. The electronic device includes a first circuit board having a first connection terminal formed thereon, an application processor (AP) connected to the first connection terminal and deployed on the first circuit board, an interposer having a via formed therein and having a first surface attached to the first circuit board, the interposer at least partly surrounding at least a partial region of the first circuit board and a first end portion of the via being electrically connected to the first connection terminal, a second circuit board having a second connection terminal formed thereon and attached to a second surface of the interposer in an opposite direction to the first surface, the second connection terminal being electrically connected to a second end portion of the via and the second circuit board forming an inner space together with the first circuit board and the interposer, a communication processor (CP) connected to the second connection terminal and deployed on the second circuit board, and an antenna electrically connected to the CP.
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25.
公开(公告)号:US11799203B2
公开(公告)日:2023-10-24
申请号:US17257025
申请日:2019-12-24
发明人: Ding Wu , Bo Lv , Wentao Zhong
CPC分类号: H01Q5/307 , H01Q1/2291 , H01Q1/38 , H01Q1/48 , H01Q9/42 , H01Q23/00 , H03F3/19 , H03F2200/171 , H03F2200/451
摘要: A modified-material-based high-precision combined antenna for satellite navigation and communications includes a high-frequency satellite navigation antenna metal radiating surface, a low-frequency satellite navigation antenna metal radiating surface, a WIFI/Bluetooth antenna metal radiating surface, a PCB, a shielding metal cavity and an injection molded modified-material-based substrate. The low-frequency satellite navigation antenna metal radiating surface is located between the high-frequency satellite navigation antenna metal radiating surface and the PCB. The WIFI/Bluetooth antenna metal radiating surface is located on a side of the low-frequency satellite navigation antenna metal radiating surface. The injection molded modified-material-based substrate is made of polyphenyl ether doped with a modified material, and the modified material has a relative permittivity of 2.65 and a density of 1.06 g/cm3. The injection molded modified-material-based substrate includes a first injection molded modified-material-based substrate and a second injection molded modified-material-based substrate.
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26.
公开(公告)号:US11764459B2
公开(公告)日:2023-09-19
申请号:US18147270
申请日:2022-12-28
发明人: Juneseok Lee , Junsig Kum , Kwanghyun Baek , Dohyuk Ha , Jinsu Heo , Youngju Lee , Jungyub Lee
CPC分类号: H01Q1/2283 , H01Q1/243 , H01Q9/0435 , H01Q9/42 , H04B7/0617 , H05K1/189
摘要: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module is provided. The antenna module includes a flexible printed circuit board (FPCB) including a first surface directed in a first direction and a second surface directed in a second direction that forms a predetermined first angle with respect to the first direction, a first antenna deployed on one surface of the first surface, and a second antenna deployed on one surface of the second surface.
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公开(公告)号:US11670843B2
公开(公告)日:2023-06-06
申请号:US17512420
申请日:2021-10-27
申请人: Pacesetter, Inc.
发明人: Armando M. Cappa , Jorge N. Amely-Velez , Alan B. Vogel , Wisit Lim , John R. Gonzalez , Alexander Robertson , Alex Soriano , Evan Sheldon , Perry Li , Jeffery Crook
摘要: Methods for manufacturing implantable electronic devices include forming an antenna of the implantable electronic device by delivering an antenna trace within a dielectric antenna body. The antenna trace includes a first trace portion disposed in a first transverse layer and defining a first trace path and a second trace portion disposed in a second transverse layer longitudinally offset from the first transverse layer and defining a second trace path. If projected to be coplanar, the first trace path defines a trace boundary and the second trace path is within the trace boundary.
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公开(公告)号:US11670838B2
公开(公告)日:2023-06-06
申请号:US17645806
申请日:2021-12-23
发明人: Chulmin Han , Wee Kian Toh , Wei Huang , Hongwei Liu
IPC分类号: H01Q1/38 , H01Q1/24 , H01Q5/371 , H01Q5/35 , H01Q13/10 , H01Q5/50 , H01Q1/48 , H01Q13/18 , H04B7/0404 , H04B7/0413 , H01Q21/28 , H01Q9/04 , H01Q9/42
CPC分类号: H01Q1/243 , H01Q1/48 , H01Q5/35 , H01Q5/371 , H01Q5/50 , H01Q13/10 , H01Q13/18 , H04B7/0404 , H04B7/0413 , H01Q9/0414 , H01Q9/42 , H01Q21/28
摘要: An apparatus and associated method are provided involving a housing having a periphery configured to operate as a second antenna, a third antenna, and a fourth antenna. The periphery includes a top wall having a first slot formed therein, a first side wall having a second slot formed therein, and a second side wall having a third slot formed therein. The top wall is arranged between the first side wall and the second side wall, and a top portion of the periphery is defined between the second slot and the third slot. The top portion is divided into a first top side portion and a second top side portion via the first slot. Further, the first top side portion operates as the second antenna, and the second top side portion operates as both the third antenna and the fourth antenna.
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公开(公告)号:US11659916B2
公开(公告)日:2023-05-30
申请号:US17478680
申请日:2021-09-17
申请人: Apple Inc.
发明人: Ryan C. Perkins , Paul J. Thompson
IPC分类号: A45F5/00 , G01S5/02 , H04R1/02 , H04R7/02 , G06K19/07 , G06K19/077 , H01Q1/22 , H04W4/029 , A61B5/11 , G01S5/00 , G06F3/01 , G06T13/40 , E05B73/00 , G06K7/00 , G06K7/10 , H01M50/109 , H01M50/184 , H04W12/03 , G04G21/04 , G04G21/08 , G06F3/02 , G06F3/044 , G06F3/0485 , G06F3/04883 , H01Q1/27 , H04B1/3888 , H04B5/00 , H04L9/08 , H04M1/21 , H04R3/00 , H04W12/02 , H01Q5/25 , H01Q5/378 , H01Q7/00 , H01Q9/42 , H04L9/30 , A63B24/00 , H01Q21/06 , H04B1/717 , H04W88/06
CPC分类号: A45F5/00 , A61B5/1116 , E05B73/0005 , G01S5/0036 , G01S5/0226 , G04G21/04 , G04G21/08 , G06F3/017 , G06F3/02 , G06F3/044 , G06F3/0485 , G06F3/04883 , G06K7/0008 , G06K7/10396 , G06K19/0701 , G06K19/0702 , G06K19/0708 , G06K19/0723 , G06K19/07711 , G06K19/07758 , G06K19/07766 , G06K19/07773 , G06K19/07779 , G06T13/40 , H01M50/109 , H01M50/184 , H01Q1/2208 , H01Q1/2225 , H01Q1/2291 , H01Q1/273 , H01Q5/25 , H01Q5/378 , H01Q7/00 , H01Q9/42 , H04B1/3888 , H04B5/0037 , H04L9/0825 , H04L9/30 , H04M1/21 , H04R1/028 , H04R3/00 , H04R7/02 , H04W4/029 , H04W12/02 , H04W12/03 , A45F2005/006 , A45F2200/0508 , A63B24/0062 , G01S5/0231 , G06F3/016 , H01Q21/06 , H04B1/717 , H04R2400/03 , H04R2420/07 , H04W88/06
摘要: A mounting base for use with a wirelessly locatable tag may include a base portion defining a latching member configured to engage a wirelessly locatable tag to releasably retain the wirelessly locatable tag to the mounting base, a contact block attached to the base portion and configured to be positioned at least partially within a battery cavity of the wirelessly locatable tag, the contact block defining a top side and a peripheral side. The mounting base may further include a first conductive member positioned along the peripheral side of the contact block and configured to contact a first battery contact in the battery cavity of the wirelessly locatable tag, a second conductive member outwardly biased from the top side of the contact block, the second conductive member configured to contact a second battery contact in the battery cavity of the tag, and a power cable coupled to the base portion.
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公开(公告)号:US11658404B2
公开(公告)日:2023-05-23
申请号:US17028871
申请日:2020-09-22
申请人: Apple Inc.
发明人: Lucas R. Compton
CPC分类号: H01Q1/38 , H01Q1/243 , H01Q9/0485 , H01Q9/42
摘要: An electronic device may be provided with a conductive sidewall and a phased antenna array having a dielectric resonator antenna aligned with an aperture in the conductive sidewall. A feed probe may excite the antenna to radiate through the aperture at a frequency greater than 10 GHz. The antenna may include an injection-molded plastic substrate that affixes the antenna to the peripheral conductive housing structures, thereby integrating the antenna into the conductive sidewall. A hole or other machining operation may be used to expose the feed probe through the injection-molded plastic substrate. Conductive interconnect structures may be inserted into the substrate and coupled to the feed probe. The interconnect structures may be soldered to a circuit board. The circuit board may be coupled to the feed probe through the interconnect structures. The circuit board may be mounted to a rear surface or a side surface of the injection-molded plastic substrate.
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