MEMS microphone
    23.
    发明授权

    公开(公告)号:US11838724B2

    公开(公告)日:2023-12-05

    申请号:US17566637

    申请日:2021-12-30

    CPC classification number: H04R1/04 B81B3/0021 B81B2203/0315 H04R2201/003

    Abstract: The present disclosure discloses a MEMS microphone including a printed circuit board, a shell assembled with the printed circuit board for forming a receiving space and provided with a sound hole communicating with the receiving space, a MEMS Die with a cavity accommodated in the receiving space and mounted on the shell for covering the sound hole, and an ASIC chip accommodated in the receiving space and mounted on the shell through a substrate. The cavity of the MEMS Die communicates with the sound hole. The MEMS Die electrically connects with the ASIC chip. The ASIC chip electrically connects with the substrate. The substrate electrically connects with the printed circuit board.

    Transducer system with configurable acoustic overload point

    公开(公告)号:US11800299B2

    公开(公告)日:2023-10-24

    申请号:US17747454

    申请日:2022-05-18

    Abstract: A MEMS transducer system has a transducer configured to convert a received signal into an output signal for forwarding by a transducer output port, and an integrated circuit having an IC input in communication with the transducer output port. The IC input is configured to receive an IC input signal produced as a function of the output signal. The system also has a dividing element coupled between the IC input and the transducer output port. The dividing element is configured to selectively attenuate one or more signals into the IC input to at least in part produce the IC input signal. Other implementations may couple a feedback loop to the ground of the transducer (similar to bootstrapping), or pick off voltages at specific portions of the transducer.

    Microphone
    29.
    发明授权

    公开(公告)号:US11785371B2

    公开(公告)日:2023-10-10

    申请号:US17571834

    申请日:2022-01-10

    Inventor: Satoshi Yoshino

    CPC classification number: H04R1/086 H04R1/04

    Abstract: A microphone includes an outer wall member having a sound hole, a first mesh arranged inside the outer wall member and made of Dutch weave, and a spacer having a diameter corresponding to an inner diameter of the outer wall member. The first mesh is pressed to an inside the outer wall member while a first surface of which is in contact with the first mesh. A second mesh is in contact with a second surface of the spacer and has water repellency. A microphone unit is stored under the second mesh.

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