公开(公告)号：US20150352608A1

公开(公告)日：2015-12-10

申请号：US14707151

申请日：2015-05-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tea-Geon KIM

IPC: B08B9/46 ,  B08B9/08 ,  B08B5/02

CPC classification number: B08B5/02 ,  B08B15/02 ,  C11D11/0047 ,  F26B21/02 ,  H01L21/67028 ,  H01L21/6719 ,  H05K3/26 ,  H05K2203/081 ,  H05K2203/1105

Abstract: A substrate treating apparatus includes a chamber defining an inside space, a supply passage connected to the inside space to supply a cleaning gas for cleaning, a discharge passage connected to the inside space to discharge the cleaning gas from the inside space, and an exhaust member connected to the discharge passage for forcedly exhausting the cleaning gas from the inside space through the discharge passage.

Abstract translation: 基板处理装置包括限定内部空间的室，与内部空间连接以供给清洁用清洁气体的供给通路，与内部空间连接的排出通路，从内部空间排出清洗气体;排气构件 连接到排出通道，用于通过排出通道强制地从内部空间排出清洁气体。

公开(公告)号：US09185811B2

公开(公告)日：2015-11-10

申请号：US13642471

申请日：2011-03-02

Applicant: Yoichi Saito ,  Shigeru Michiwaki ,  Noriaki Taneko ,  Shukichi Takii

Inventor： Yoichi Saito ,  Shigeru Michiwaki ,  Noriaki Taneko ,  Shukichi Takii

IPC: H05K3/02 ,  H01R43/00 ,  H05K3/00 ,  H05K1/00 ,  B29C65/00 ,  H05K3/20 ,  H05K3/26

CPC classification number: H05K3/205 ,  H05K3/26 ,  H05K2201/0376 ,  H05K2201/098 ,  H05K2203/0152 ,  H05K2203/025 ,  H05K2203/1572

Abstract: A method of producing a printed circuit board includes: forming a metal layer on a support plate; forming a mask layer on the metal layer; forming a pattern plating having a stem as plating up to a level of the mask layer, and a cap as a portion of plating exceeding the mask layer and having an outgrowth lying over the surface of the mask layer; laminating an insulating base on a conductive circuit board constituted by the support plate, the metal layer and the pattern plating to form a circuit board intermediate in which the pattern plating is buried in the base; removing the support plate and the metal layer to form an exposed surface; and mechanically polishing the exposed surface until the stem of the pattern plating is removed, to increase the width of the conductive pattern on the exposed surface.

Abstract translation: 制造印刷电路板的方法包括：在支撑板上形成金属层; 在所述金属层上形成掩模层; 形成具有作为所述掩模层的水平的电极的杆的图案电镀，以及作为超过所述掩模层并且具有位于所述掩模层的表面上的生长的电镀部分的帽; 在由支撑板，金属层和图案电镀构成的导电电路板上层叠绝缘基底，以形成电路板中间，其中图案电镀埋在基座中; 移除支撑板和金属层以形成暴露表面; 并且机械抛光露出的表面，直到去除图案电镀的杆，以增加暴露表面上的导电图案的宽度。

公开(公告)号：US09095737B2

公开(公告)日：2015-08-04

申请号：US13862517

申请日：2013-04-15

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Robert C. Johnson ,  Hsueh S. Tung ,  Rajiv R. Singh ,  Ian Shankland

IPC: A62D1/06 ,  C11D3/43 ,  C11D7/50 ,  C11D11/00 ,  G03F7/42 ,  C09K5/04 ,  B01F17/00 ,  C09K3/00 ,  C09K21/08 ,  C11D7/30 ,  C08J9/14 ,  H05K3/26

CPC classification number: C09K5/044 ,  A62D1/06 ,  B01F17/0035 ,  C08J9/144 ,  C09K3/00 ,  C09K5/045 ,  C09K21/08 ,  C09K2205/102 ,  C09K2205/104 ,  C09K2205/12 ,  C09K2205/122 ,  C09K2205/126 ,  C10M101/02 ,  C10M171/008 ,  C10M2203/003 ,  C10N2220/302 ,  C10N2240/30 ,  C11D3/43 ,  C11D7/30 ,  C11D7/5018 ,  C11D11/0047 ,  C23G5/02809 ,  C23G5/02825 ,  F25B1/00 ,  F25B31/002 ,  G03F7/426 ,  H05K3/26 ,  Y02C20/30

Abstract: Compositions and methods based on the use of fluoroalkene containing from 3 to 4 carbon atoms and at least one carbon-carbon double bond, such as HFO-1214, HFO-HFO-1233, or HFO-1354, having properties highly beneficial in foaming and blowing agent applications, articles and methods.

Abstract translation: 基于使用含有3至4个碳原子的氟代烯烃和至少一个碳 - 碳双键的组合物和方法，例如HFO-1214，HFO-HFO-1233或HFO-1354，具有在发泡和 发泡剂应用，物品和方法。

公开(公告)号：US20150175867A1

公开(公告)日：2015-06-25

申请号：US14643500

申请日：2015-03-10

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Robert C. Johnson ,  Hsueh S. Tung ,  Rajiv R. Singh ,  Ian Shankland

IPC: C09K5/04

CPC classification number: C09K5/044 ,  A62D1/06 ,  B01F17/0035 ,  C08J9/144 ,  C09K3/00 ,  C09K5/045 ,  C09K21/08 ,  C09K2205/102 ,  C09K2205/104 ,  C09K2205/12 ,  C09K2205/122 ,  C09K2205/126 ,  C10M101/02 ,  C10M171/008 ,  C10M2203/003 ,  C10N2220/302 ,  C10N2240/30 ,  C11D3/43 ,  C11D7/30 ,  C11D7/5018 ,  C11D11/0047 ,  C23G5/02809 ,  C23G5/02825 ,  F25B1/00 ,  F25B31/002 ,  G03F7/426 ,  H05K3/26 ,  Y02C20/30

Abstract: Compositions and methods based on the use of fluoroalkene containing from 3 to 4 carbon atoms and at least one carbon-carbon double bond, such as HFO-1214, HFO—HF0-1233, or HF0-1354 having properties highly beneficial in foaming and blowing agent applications, articles and methods.

Abstract translation: 基于使用含有3至4个碳原子的氟代烯烃和至少一个碳 - 碳双键的组合物和方法，例如HFO-1214，HFO-HF0-1233或HF0-1354，其具有在发泡和吹塑中非常有益的性质 代理申请，文章和方法。

公开(公告)号：US20150138743A1

公开(公告)日：2015-05-21

申请号：US14085613

申请日：2013-11-20

Applicant: Mihir K. ROY ,  Mathew J. Manusharow

Inventor： Mihir K. ROY ,  Mathew J. Manusharow

IPC: H05K1/02 ,  H05K1/16 ,  H05K1/18

CPC classification number: H05K3/10 ,  H01B3/485 ,  H01B3/50 ,  H01B7/083 ,  H01F17/0006 ,  H05K1/0222 ,  H05K1/038 ,  H05K1/165 ,  H05K3/043 ,  H05K3/103 ,  H05K3/22 ,  H05K3/26 ,  H05K3/30 ,  H05K3/40 ,  H05K3/4046 ,  H05K2201/029 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K2201/1081 ,  H05K2203/0228 ,  H05K2203/025 ,  H05K2203/1461 ,  H05K2203/175 ,  H05K2203/30

Abstract: A substrate package includes a woven fabric having electrically non-conductive strands woven between electrically conductive strands including wire strands, co-axial strands, and/or an inductor pattern of strands. The package may be formed by an inexpensive and high throughput process that first weaves the non-conductive strands (e.g., glass) between the conductive strands to form a circuit board pattern of conductive strands in a woven fabric. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planarized. Planarizing segments and exposes ends of the wire, co-axial, and inductor pattern strands. Since the conductive strands were formed integrally within the planarized woven fabric, the substrate has a high mechanical stability and provides conductor strand based electrical components built in situ in the substrate package.

Abstract translation: 衬底封装包括织造织物，其具有在导电股线之间编织的非导电股线，包括线股，同轴股线和/或股线的电感器图案。 封装可以通过廉价且高通量的工艺来形成，该工艺首先在导电股线之间编织非导电股线（例如玻璃），以形成机织织物中导电股线的电路板图案。 接下来，用树脂材料浸渍织物以形成浸渍织物，然后将其固化以形成固化织物。 随后将固化的织物的上表面和下表面平坦化。 平面化节段并露出导线，同轴和电感图案线的端部。 由于导电丝束在平面织造织物内整体形成，所以基底具有高的机械稳定性，并提供了在基底包装中原位构建的基于导线的电气部件。

公开(公告)号：US08877087B2

公开(公告)日：2014-11-04

申请号：US13667169

申请日：2012-11-02

Applicant: Solvay Fluor GmbH

Inventor： Michael Marhold ,  Helge Rau ,  Karsten Borner ,  Christoph Meurer

IPC: C09K5/04 ,  C11D7/50 ,  C23G5/028 ,  H05K3/26

CPC classification number: C23G5/02803 ,  C11D7/5059 ,  C23G5/02809 ,  C23G5/02864 ,  C23G5/02887 ,  H05K3/26

Abstract: Nonflammable compositions comprising fluorinated compounds selected from the group consisting of hydrofluoroalkanes, hydrofluoroalkenes, partially or perfluorinated aromatic compounds, hydrofluoroethers, and fluoroketones; 1,2-dichloroethylene, especially trans-1,2-dichloroethylene; and a stabilizer. These non-flammable compositions which preferably contain 1,1,1,3,3-pentafluorobutane, can be used especially as solvents for cleaning and defluxing electronic components and for degreasing metals. The compositions further may comprise a propellant, e.g. 1,1,1,2-tetrafluoroethane. These compositions are especially suitable as flushing agent.

Abstract translation: 包含选自氢氟烷烃，氢氟烯烃，部分或全氟化芳族化合物，氢氟醚和氟代酮的氟化化合物的不可燃组合物; 1,2-二氯乙烯，特别是反式-1,2-二氯乙烯; 和稳定剂。 优选含有1,1,1,3,3-五氟丁烷的这些不易燃组合物可特别用作洗涤和去除电子元件以及用于脱脂金属的溶剂。 组合物还可以包含推进剂，例如 1,1,1,2-四氟乙烷。 这些组合物特别适合作为冲洗剂。

公开(公告)号：US08756775B2

公开(公告)日：2014-06-24

申请号：US12547616

申请日：2009-08-26

Applicant: Akiyoshi Kawamura ,  Takako Sato ,  Osamu Chikagawa

Inventor： Akiyoshi Kawamura ,  Takako Sato ,  Osamu Chikagawa

IPC: B23P13/00

CPC classification number: B24B31/06 ,  B24B1/04 ,  H05K1/0306 ,  H05K3/26 ,  H05K2201/0209 ,  H05K2203/025 ,  H05K2203/0285

Abstract: A method is provided for efficiently and securely smoothing a surface of an electrode disposed on a base, such as a ceramic substrate, without damaging the electrode or the base. The electrode is fired by a non-shrinkage process using a constraining layer and is separated from the constraining layer. The base including the electrode disposed thereon is prepared and a surface of the electrode is smoothed by vibrating media such that the media are arranged to be in contact with the electrode.

Abstract translation: 提供了一种用于有效且可靠地平滑设置在诸如陶瓷基板的基底上的电极的表面而不损坏电极或基底的方法。 电极通过使用约束层的非收缩工艺进行烧制并与约束层分离。 制备包括设置在其上的电极的基底，并且通过振动介质使电极的表面平滑，使得介质被布置成与电极接触。

公开(公告)号：US08709530B2

公开(公告)日：2014-04-29

申请号：US12003712

申请日：2007-12-31

Applicant: Chul Ho Kim ,  Tae Young Oh ,  Choon Ho Park

Inventor： Chul Ho Kim ,  Tae Young Oh ,  Choon Ho Park

IPC: B05D5/12 ,  B05D1/28 ,  B05D3/12

CPC classification number: H05K3/1275 ,  G02F1/1303 ,  G02F1/13439 ,  G02F1/1368 ,  H05K3/26 ,  H05K2203/0108 ,  H05K2203/0143 ,  H05K2203/0191

Abstract: A pattern forming method using printing device and method of manufacturing LCD device using the same is disclosed, which uses a cleaning dry film to remove a pattern material from a printing plate, the printing device comprising a printing roller coated with a pattern material; a printing plate including embossing and depressed patterns for patterning the pattern material of the printing roller; a substrate to which the pattern material on the embossing patterns of the printing roller is transcribed; and a cleaning unit, for removing the pattern material from the printing plate, provided with a film-supplying roller, a cleaning roller and a film-collecting roller combined with one another by one cleaning dry film.

Abstract translation: 公开了一种使用印刷装置的图案形成方法和使用其的LCD装置的制造方法，其使用清洁干膜从印刷版去除图案材料，所述印刷装置包括涂布有图案材料的印刷辊; 印刷版，其包括用于图案化印刷辊的图案材料的压花和凹陷图案; 印刷辊的压印图案上的图案材料被转印到的基板; 以及清洁单元，用于从设置有通过一个清洁干膜彼此组合的胶片供应辊，清洁辊和胶片收集辊的印刷板移除图案材料。

公开(公告)号：US20140109934A1

公开(公告)日：2014-04-24

申请号：US13844094

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Kwan LEE

IPC: H05K3/26 ,  B08B7/02 ,  B08B5/04

CPC classification number: H05K3/26 ,  B08B5/04 ,  B08B7/02

Abstract: Disclosed herein are an apparatus for removing particles from a printed circuit board and a method for removing particles from a printed circuit board. The apparatus includes: a vibration generating unit vibrating a printed circuit board; a vacuum sucking unit formed over the printed circuit board and removing the particles from the printed circuit board; and a controlling unit controlling the vibration generating unit and the vacuum sucking unit.

Abstract translation: 本文公开了一种用于从印刷电路板除去颗粒的装置和从印刷电路板上去除颗粒的方法。 该装置包括：振动产生单元振动印刷电路板; 形成在所述印刷电路板上并从所述印刷电路板上除去所述颗粒的真空吸附单元; 以及控制单元，其控制所述振动产生单元和所述真空吸附单元。

公开(公告)号：US08663484B2

公开(公告)日：2014-03-04

申请号：US12452479

申请日：2008-06-23

Applicant: Harumi Nagao ,  Yoshiyuki Asakawa

Inventor： Harumi Nagao ,  Yoshiyuki Asakawa

IPC: H01B13/00

CPC classification number: H05K3/067 ,  C23F1/26 ,  C23F1/28 ,  H05K1/0393 ,  H05K3/26 ,  H05K3/388 ,  H05K2201/0761 ,  H05K2203/0796 ,  Y10T428/12569 ,  Y10T428/31681

Abstract: A method for manufacturing a printed circuit board enables a metal residue between wirings to be removed inexpensively without side etching of a copper layer while having sufficient insulation reliability for micro wiring working. The method includes forming a base metal layer directly at least on one face of an insulator film without an adhesive, and a copper coat layer formed on the base metal layer to form adhesiveless copper clad laminates, then forming a pattern on the adhesiveless copper clad laminates by an etching method. The etching method includes a process of etching treatment for the adhesiveless copper clad laminates with an iron (III) chloride solution or a copper (II) chloride solution containing hydrochloric acid and then, a process of treatment with an acid oxidant containing potassium permanganate.

Abstract translation: 印刷电路板的制造方法能够廉价地除去布线之间的金属残留物，而不会对铜层进行侧蚀刻，同时具有足够的微布线工作的绝缘可靠性。 该方法包括直接在绝缘膜的至少一个表面上形成基底金属层，而无需粘合剂，以及形成在基底金属层上的铜涂层，以形成无粘合剂的铜包覆层压板，然后在无粘合剂覆铜层压板上形成图案 通过蚀刻方法。 蚀刻方法包括用氯化铁（III）溶液或含有盐酸的氯化铜（II）溶液对无粘合剂覆铜层压板进行蚀刻处理的方法，然后使用含有高锰酸钾的酸式氧化剂进行处理。