CLEANING SOLUTION AND METHOD FOR CLEANING SUBSTRATE

    公开(公告)号:US20190256805A1

    公开(公告)日:2019-08-22

    申请号:US16348063

    申请日:2017-10-24

    IPC分类号: C11D7/08 C11D7/32 C11D7/50

    摘要: A cleaning solution that is used, inter alia, for removal of residue of a photoresist pattern or etching residue, and has exceptional anticorrosion properties with respect to silicon nitride; and a method for cleaning a substrate using the cleaning solution. In a cleaning solution containing a hydrofluoric acid and a solvent, a polymer that includes units derived from a compound of a specific structure having a carboxylic acid amide bond (—CO—N

    Agent and method for cleaning permeable membranes

    公开(公告)号:US10307713B2

    公开(公告)日:2019-06-04

    申请号:US14386224

    申请日:2013-04-09

    摘要: The invention provides cleaning agents, cleaning liquids and cleaning methods that effectively remove contaminants which are impossible to remove sufficiently with conventional cleaning liquids at the occurrence of a decrease in performances such as permeation flux and salt rejection rate due to contamination of permeable membranes, in particular aromatic polyamide RO membranes used in water treatment. Permeable membranes are cleaned with a cleaning liquid which is an aqueous solution including a chloramine compound and an alkali agent and having a pH of 10 or above. The chloramine compound is preferably one obtained by mixing a compound having a primary amino group with hypochlorous acid and/or a hypochlorite.

    Cleaning solution and manufacturing method therefor

    公开(公告)号:US10194665B2

    公开(公告)日:2019-02-05

    申请号:US14915211

    申请日:2013-08-30

    申请人: Epios Co., LTD

    发明人: Yasuo Shichitani

    摘要: The present invention has an object to provide a highly stable cleaning solution that generates a high concentration of hypochlorous acid during cleaning, and has sterilizing and washing out activity on bacteria and viruses. As means for achieving this object, a cleaning solution has been developed which is an aqueous solution containing hypochlorous acid and hypochlorite ions produced using a diaphragm-free electrolysis process. The effective residual chlorine concentration thereof and the hydrogen ion concentration exponent thereof are adjusted to a value from 500 ppm to 2000 ppm and to a value from pH 8.5 to pH 9.5, respectively. Thus, the cleaning solution remains stable for a prolonged period of time, and exhibits high sterilizing and wash-out activity during use.